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CY7C1472BV33-200BZI PDF预览

CY7C1472BV33-200BZI

更新时间: 2024-11-07 05:19:39
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
30页 902K
描述
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL⑩ Architecture

CY7C1472BV33-200BZI 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:15 X 17 MM, 1.40 MM HEIGHT, FBGA-165
针数:165Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.51最长访问时间:3 ns
其他特性:PIPELINED ARCHITECTURE最大时钟频率 (fCLK):200 MHz
I/O 类型:COMMONJESD-30 代码:R-PBGA-B165
长度:17 mm内存密度:75497472 bit
内存集成电路类型:ZBT SRAM内存宽度:18
功能数量:1端子数量:165
字数:4194304 words字数代码:4000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:4MX18
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装等效代码:BGA165,11X15,40
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE
并行/串行:PARALLEL电源:2.5/3.3,3.3 V
认证状态:Not Qualified座面最大高度:1.4 mm
最小待机电流:3.14 V子类别:SRAMs
最大压摆率:0.5 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
宽度:15 mmBase Number Matches:1

CY7C1472BV33-200BZI 数据手册

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CY7C1470BV33  
CY7C1472BV33, CY7C1474BV33  
72-Mbit (2M x 36/4M x 18/1M x 72)  
Pipelined SRAM with NoBL™ Architecture  
Features  
Functional Description  
The CY7C1470BV33, CY7C1472BV33, and CY7C1474BV33  
are 3.3V, 2M x 36/4M x 18/1M x 72 Synchronous pipelined burst  
SRAMs with No Bus Latency™ (NoBL™) logic, respectively.  
They are designed to support unlimited true back-to-back read  
or write operations with no wait states. The CY7C1470BV33,  
CY7C1472BV33, and CY7C1474BV33 are equipped with the  
advanced (NoBL) logic required to enable consecutive read or  
write operations with data being transferred on every clock cycle.  
This feature dramatically improves the throughput of data in  
systems that require frequent read or write transitions. The  
CY7C1470BV33, CY7C1472BV33, and CY7C1474BV33 are pin  
compatible and functionally equivalent to ZBT devices.  
Pin-compatible and functionally equivalent to ZBT™  
Supports 250 MHz bus operations with zero wait states  
Available speed grades are 250, 200, and 167 MHz  
Internally self-timed output buffer control to eliminate the need  
to use asynchronous OE  
Fully registered (inputs and outputs) for pipelined operation  
Byte Write capability  
Single 3.3V power supply  
3.3V/2.5V IO power supply  
All synchronous inputs pass through input registers controlled by  
the rising edge of the clock. All data outputs pass through output  
registers controlled by the rising edge of the clock. The clock  
input is qualified by the Clock Enable (CEN) signal, which when  
deasserted suspends operation and extends the previous clock  
cycle.  
Fast clock-to-output time  
3.0 ns (for 250-MHz device)  
Clock Enable (CEN) pin to suspend operation  
Synchronous self-timed writes  
Write operations are controlled by the Byte Write Selects  
CY7C1470BV33, CY7C1472BV33 available in  
(BWa–BWd  
for  
CY7C1470BV33,  
BWa–BWb  
for  
JEDEC-standard Pb-free 100-pin TQFP, Pb-free and  
non-Pb-free 165-ball FBGA package. CY7C1474BV33  
available in Pb-free and non-Pb-free 209-ball FBGA package  
CY7C1472BV33, and BWa–BWh for CY7C1474BV33) and a  
Write Enable (WE) input. All writes are conducted with on-chip  
synchronous self-timed write circuitry.  
IEEE 1149.1 JTAG Boundary Scan compatible  
Burst capability—linear or interleaved burst order  
“ZZ” Sleep Mode option and Stop Clock option  
Three synchronous Chip Enables (CE1, CE2, CE3) and an  
asynchronous Output Enable (OE) provide for easy bank  
selection and output tri-state control. To avoid bus contention,  
the output drivers are synchronously tri-stated during the data  
portion of a write sequence.  
Selection Guide  
Description  
Maximum Access Time  
250 MHz  
200 MHz  
3.0  
167 MHz  
3.4  
Unit  
ns  
3.0  
500  
120  
Maximum Operating Current  
500  
450  
mA  
mA  
Maximum CMOS Standby Current  
120  
120  
Cypress Semiconductor Corporation  
Document #: 001-15031 Rev. *C  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised February 29, 2008  
[+] Feedback  

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