CY7C1471BV33
CY7C1473BV33
72-Mbit (2M × 36/4M × 18)
Flow-Through SRAM
with NoBL™ Architecture
72-Mbit (2M
× 36/4M × 18) Flow-Through SRAM with NoBL™ Architecture
Features
Functional Description
■ No bus latency™ (NoBL™) architecture eliminates dead cycles
between write and read cycles
The CY7C1471BV33 and CY7C1473BV33 are 3.3 V,
2M × 36/4M × 18 synchronous flow through burst SRAMs
designed specifically to support unlimited true back-to-back read
or write operations without the insertion of wait states. The
CY7C1471BV33 and CY7C1473BV33 are equipped with the
advanced No Bus Latency (NoBL) logic. NoBL™ is required to
enable consecutive read or write operations with data being
transferred on every clock cycle. This feature dramatically
improves the throughput of data through the SRAM, especially
in systems that require frequent write-read transitions.
■ Supports up to 133 MHz bus operations with zero wait states
■ Data is transferred on every clock
■ Pin compatible and functionally equivalent to ZBT™ devices
■ Internally self timed output buffer control to eliminate the need
to use OE
■ Registered inputs for flow through operation
■ Byte write capability
All synchronous inputs pass through input registers controlled by
the rising edge of the clock. The clock input is qualified by the
Clock Enable (CEN) signal, which when deasserted suspends
operation and extends the previous clock cycle. Maximum
access delay from the clock rise is 6.5 ns (133 MHz device).
■ 3.3 V/2.5 V I/O supply (VDDQ
)
■ Fast clock-to-output times
Write operations are controlled by two or four Byte Write Select
(BWX) and a Write Enable (WE) input. All writes are conducted
with on-chip synchronous self timed write circuitry.
❐ 6.5 ns (for 133 MHz device)
■ Clock enable (CEN) pin to enable clock and suspend operation
■ Synchronous self-timed writes
Three synchronous chip enables (CE1, CE2, CE3) and an
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. To avoid bus contention,
the output drivers are synchronously tri-stated during the data
portion of a write sequence.
■ Asynchronous output enable (OE)
■ CY7C1471BV33 available in JEDEC-standard Pb-free 100-pin
thin quad flat pack (TQFP), Pb-free and non-Pb-free 165-ball
fine-pitch ball grid array (FBGA) package. CY7C1473BV33
available in JEDEC-standard Pb-free 100-pin thin quad flat
pack (TQFP)
For a complete list of related documentation, click here.
■ Three chip enables (CE1, CE2, CE3) for simple depth
expansion
■ Automatic power-down feature available using ZZ mode or CE
deselect
■ IEEE 1149.1 JTAG boundary scan compatible
■ Burst capability – linear or interleaved burst order
■ Low standby power
Selection Guide
Description
Maximum access time
133 MHz Unit
6.5
305
120
ns
Maximum operating current
mA
mA
Maximum CMOS standby current
Cypress Semiconductor Corporation
Document Number: 001-15029 Rev. *K
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised January 12, 2018