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CY7C1471BV33-133AXC PDF预览

CY7C1471BV33-133AXC

更新时间: 2024-11-17 15:18:43
品牌 Logo 应用领域
英飞凌 - INFINEON 静态存储器
页数 文件大小 规格书
32页 882K
描述
Synchronous SRAM

CY7C1471BV33-133AXC 数据手册

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CY7C1471BV33  
CY7C1473BV33  
72-Mbit (2M × 36/4M × 18)  
Flow-Through SRAM  
with NoBL™ Architecture  
72-Mbit (2M  
× 36/4M × 18) Flow-Through SRAM with NoBL™ Architecture  
Features  
Functional Description  
No bus latency™ (NoBL™) architecture eliminates dead cycles  
between write and read cycles  
The CY7C1471BV33 and CY7C1473BV33 are 3.3 V,  
2M × 36/4M × 18 synchronous flow through burst SRAMs  
designed specifically to support unlimited true back-to-back read  
or write operations without the insertion of wait states. The  
CY7C1471BV33 and CY7C1473BV33 are equipped with the  
advanced No Bus Latency (NoBL) logic. NoBL™ is required to  
enable consecutive read or write operations with data being  
transferred on every clock cycle. This feature dramatically  
improves the throughput of data through the SRAM, especially  
in systems that require frequent write-read transitions.  
Supports up to 133 MHz bus operations with zero wait states  
Data is transferred on every clock  
Pin compatible and functionally equivalent to ZBT™ devices  
Internally self timed output buffer control to eliminate the need  
to use OE  
Registered inputs for flow through operation  
Byte write capability  
All synchronous inputs pass through input registers controlled by  
the rising edge of the clock. The clock input is qualified by the  
Clock Enable (CEN) signal, which when deasserted suspends  
operation and extends the previous clock cycle. Maximum  
access delay from the clock rise is 6.5 ns (133 MHz device).  
3.3 V/2.5 V I/O supply (VDDQ  
)
Fast clock-to-output times  
Write operations are controlled by two or four Byte Write Select  
(BWX) and a Write Enable (WE) input. All writes are conducted  
with on-chip synchronous self timed write circuitry.  
6.5 ns (for 133 MHz device)  
Clock enable (CEN) pin to enable clock and suspend operation  
Synchronous self-timed writes  
Three synchronous chip enables (CE1, CE2, CE3) and an  
asynchronous Output Enable (OE) provide for easy bank  
selection and output tri-state control. To avoid bus contention,  
the output drivers are synchronously tri-stated during the data  
portion of a write sequence.  
Asynchronous output enable (OE)  
CY7C1471BV33 available in JEDEC-standard Pb-free 100-pin  
thin quad flat pack (TQFP), Pb-free and non-Pb-free 165-ball  
fine-pitch ball grid array (FBGA) package. CY7C1473BV33  
available in JEDEC-standard Pb-free 100-pin thin quad flat  
pack (TQFP)  
For a complete list of related documentation, click here.  
Three chip enables (CE1, CE2, CE3) for simple depth  
expansion  
Automatic power-down feature available using ZZ mode or CE  
deselect  
IEEE 1149.1 JTAG boundary scan compatible  
Burst capability – linear or interleaved burst order  
Low standby power  
Selection Guide  
Description  
Maximum access time  
133 MHz Unit  
6.5  
305  
120  
ns  
Maximum operating current  
mA  
mA  
Maximum CMOS standby current  
Cypress Semiconductor Corporation  
Document Number: 001-15029 Rev. *K  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised January 12, 2018  

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