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CY7C1470V33-300BZC PDF预览

CY7C1470V33-300BZC

更新时间: 2024-11-17 06:47:35
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
26页 831K
描述
ZBT SRAM, 2MX36, 2.2ns, CMOS, PBGA165

CY7C1470V33-300BZC 数据手册

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CY7C1470V33  
CY7C1472V33  
CY7C1474V33  
ADVANCE  
INFORMATION  
2M x 36/4M x 18/1M x 72 Pipelined SRAM  
with NoBL™ Architecture  
Clock Enable (CEN), Byte Write Selects (BWSa, BWSb,  
BWSc, BWSd, BWSe, BWSf, BWSg, BWSh), and Read/Write  
Features  
• Zero Bus Latency™, no dead cycles between Write and  
Read cycles  
• Fast clock speed: 300, 250, 200, and 167 MHz  
• Fast access time: 2.2, 2.4, 3.0 and 3.4 ns  
• Internally synchronized registered outputs eliminate  
the need to control OE  
control (WE). BWSc and BWSd apply to CY7C1470V33 and  
CY7C1472V33 only. BWSe, BWSf, BWSg, and BWSh apply to  
CY7C1474V33 only.  
Address and control signals are applied to the SRAM during  
one clock cycle, and two cycles later its associated data  
occurs, either Read or Write.  
• Single 3.3V –5% and +5% power supply VDD  
• Separate VDDQ for 3.3V or 2.5V  
• Single WE (Read/Write) control pin  
• Positive clock-edge triggered, address, data, and  
control signal registers for fully pipelined applications  
A Clock Enable (CEN) pin allows operation of the  
CY7C1470V33, CY7C1472V33, and CY7C1474V33 to be  
suspended as long as necessary. All synchronous inputs are  
ignored when (CEN) is HIGH; the internal device registers will  
hold their previous values.  
There are three Chip Enable (CE1, CE2, CE3) pins that allow  
the user to deselect the device when desired. If any one of  
these three is not active when ADV/LD is LOW, no new  
memory operation can be initiated and any burst cycle in  
progress is stopped. However, any pending data transfers  
(read or write) will be completed. The data bus will be in a  
high-impedance state two cycles after chip is deselected or a  
Write cycle is initiated.  
• Interleaved or linear four-word burst capability  
• Individualbytewrite(BWSa–BWSh)control(maybetied  
LOW)  
• CEN pin to enable clock and suspend operations  
• Three chip enables for simple depth expansion  
• JTAG boundary scan for BGA packaging version  
• Available in 119-ball bump BGA and 100-pin TQFP  
packages (CY7C1470V33 and CY7C1472V33). 209-ball  
FBGA package for CY7C1474V33.  
The CY7C1470V33, CY7C1472V33, and CY7C1474V33  
have an on-chip two-bit burst counter. In burst mode,  
CY7C1470V33, CY7C1472V33, and CY7C1474V33 provide  
four cycles of data for a single address presented to the  
SRAM. The order of the burst sequence is defined by the  
MODE input pin. The MODE pin selects between linear and  
interleaved burst sequence. The ADV/LD signal is used to load  
a new external address (ADV/LD = LOW) or increment the  
internal burst counter (ADV/LD = HIGH)  
Functional Description  
The CY7C1470V33, CY7C1472V33, and CY7C1474V33  
SRAMs are designed to eliminate dead cycles when making  
transitions from Read to Write or vice versa. These SRAMs are  
optimized for 100% bus utilization and achieve Zero Bus  
Latency. They integrate 2,097,152 × 36/4,194,304 × 18/  
1,048,576 × 72 SRAM cells, respectively, with advanced  
synchronous peripheral circuitry and a two-bit counter for  
internal burst operation. The Cypress Synchronous Burst  
SRAM family employs high-speed, low-power CMOS designs  
using advanced single-layer polysilicon, three-layer metal  
technology. Each memory cell consists of six transistors.  
Output Enable (OE) and burst sequence select (MODE) are  
the asynchronous signals. OE can be used to disable the  
outputs at any given time. ZZ may be tied to LOW if it is not  
used.  
Four pins are used to implement JTAG test capabilities. The  
JTAG circuitry is used to serially shift data to and from the  
device. JTAG inputs use LVTTL/LVCMOS levels to shift data  
during this testing mode of operation.  
All synchronous inputs are gated by registers controlled by a  
positive-edge-triggered Clock Input (CLK). The synchronous  
inputs include all addresses, all data inputs, depth-expansion  
Chip Enables (CE1, CE2, and CE3), cycle start input (ADV/LD),  
Logic Block Diagram  
D
CLK  
Data-In REG.  
CE  
Q
ADV/LD  
A
x
CEN  
CE  
CONTROL  
and Write  
LOGIC  
2M × 36/  
4M × 18/  
1M × 72  
1
CE  
CE  
2
DQ  
DP  
x
3
DQ  
A
BWS  
X
DP  
X
X
X
MEMORY  
ARRAY  
WE  
BWS  
x
X = 20:0 X=a,b,c,d X=a,b,c,d X=a,b,c,d  
x
2M × 36  
Mode  
X = 21:0  
X = 19:0  
X = a, b  
X = a, b X = a, b  
4M × 18  
1M × 72  
X = a, b  
OE  
X = a, b,  
X = a, b,  
c,d,e,f,g,h  
c,d,e,f,g,h  
c,d,e,f,g,h  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Document #: 38-05289 Rev. **  
Revised August 2, 2002  

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