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CY7C1447V33-117BX PDF预览

CY7C1447V33-117BX

更新时间: 2024-09-21 06:17:11
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
28页 605K
描述
Standard SRAM, 512KX72, 7.5ns, CMOS, PBGA209, 14 X 22 MM, 2.20 MM HEIGHT, PLASTIC, BGA-209

CY7C1447V33-117BX 数据手册

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CY7C1441V33  
CY7C1443V33  
CY7C1447V33  
PRELIMINARY  
1M x 36/2M x 18/512K x 72  
Flow-through SRAM  
inputs include all addresses, all data inputs, address-pipelining  
Chip Enable (CE), Burst Control Inputs (ADSC, ADSP, and  
ADV), Write Enables (BWa, BWb, BWc, BWd, BWe, BWf, BWg,  
BWh, and BWe), and Global Write (GW).  
Features  
• Supports 133-MHz bus operations  
• 1M x 36/2M x 18/512K x 72 common I/O  
• Fast clock-to-output times  
— 6.5 ns (for 133-MHz device)  
— 7.5 ns (for 117-MHz device)  
Asynchronous inputs include the Output Enable (OE) and  
Burst Mode Control (MODE). The data outputs (DQ), enabled  
by OE, are also asynchronous.  
• Single 3.3V –5% and +5% power supply VDD  
• Separate VDDQ for 3.3V or 2.5V  
• Byte Write Enable and Global Write control  
• Burst Capability – linear or interleaved burst order  
Addresses and chip enables are registered with either  
Address Status Processor (ADSP) or address status controller  
(ADSC) input pins. Subsequent burst addresses can be inter-  
nally generated as controlled by the Burst Advance Pin (ADV).  
Address, data inputs, and write controls are registered on-chip  
to initiate self-timed Write cycle. Write cycles can be one to  
four bytes wide as controlled by the write control inputs.  
Individual byte write allows individual byte to be written. BWa  
controls DQ1DQ8 and DP1. BWb controls DQ9DQ16 and  
DP2. BWc controls DQ17DQ24 and DP3. BWd controls  
DQ25DQ32 and DP4. BWe controls DQ33DQ40 and DP5.  
BWf controls DQ41DQ48 and DP6. BWg controls  
DQ49DQ56 and DP7. BWh controls DQ57DQ64 and DP8.  
BWa, BWb, BWc, BWd, BWe, BWf, BWg, and BWh can be  
active only with BWE being LOW. GW being LOW causes all  
bytes to be written. Write pass-through capability allows  
written data available at the output for the immediately next  
Read cycle. This device also incorporates pipelined enable  
circuit for easy depth expansion without penalizing system  
performance.  
• Automatic power down available using ZZ mode or CE  
deselect  
• JTAG boundary scan for BGA packaging version  
• Available in 119-ball bump BGA, 165-ball FBGA, and  
100-pin TQFP packages (CY7C1441V33 and  
CY7C1443V33). 209 FBGA package for CY7C1447V33.  
Functional Description  
The Cypress Synchronous Burst SRAM family employs  
high-speed, low power CMOS designs using advanced  
single-layer polysilicon, triple-layer metal technology. Each  
memory cell consists of six transistors.  
The CY7C1441V33/CY7C1443V33/CY7C1447V33 SRAMs  
integrate 1,048,576 x 36/2,097,152 x18 and 524,288 x 72  
SRAM cells with advanced synchronous peripheral circuitry  
and a two-bit counter for internal burst operation. All  
synchronous inputs are gated by registers controlled by a  
positive-edge-triggered clock input (CLK). The synchronous  
All inputs and outputs of theCY7C1441V33/CY7C1443V33/  
CY7C1447V33 are JEDEC-standard JESD8-5-compatible.  
Logic Block Diagram CY7C1441V33 1M × 36  
MODE  
2
(A[1;0]  
)
Q
Q
CLK  
ADV  
ADSC  
0
BURST  
COUNTER  
CE  
CLR  
1
ADSP  
Q
18  
20  
ADDRESS  
REGISTER  
CE  
D
1M X36  
A[19:0]  
GW  
20  
18  
MEMORY  
ARRAY  
DQd, DPd  
BYTEWRITE  
REGISTERS  
D
Q
BWE  
BW  
d
DQc, DPc  
BYTEWRITE  
REGISTERS  
D
D
D
Q
Q
Q
BW  
c
DQb, DPb  
BYTEWRITE  
REGISTERS  
BW  
b
DQa, DPa  
BYTEWRITE  
REGISTERS  
BW  
a
36  
36  
CE  
CE  
1
2
D
D
Q
ENABLE CE  
REGISTER  
CE  
3
Q
OUTPUT  
REGISTERS  
INPUT  
REGISTERS  
CLK  
ENABLE DELAY  
REGISTER  
CLK  
OE  
ZZ  
SLEEP  
CONTROL  
DQa,b,c,d  
DPa,b,c,d  
Cypress Semiconductor Corporation  
Document #: 38-05185 Rev. *B  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Revised November 13, 2002  

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