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CY7C1445V33-300BGC PDF预览

CY7C1445V33-300BGC

更新时间: 2024-12-01 10:27:15
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
28页 506K
描述
Cache SRAM, 2MX18, 2.3ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119

CY7C1445V33-300BGC 数据手册

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CY7C1444V33  
CY7C1445V33  
PRELIMINARY  
1M x 36/2M x 18 Pipelined DCD SRAM  
registers controlled by a positive-edge-triggered Clock Input  
(CLK). The synchronous inputs include all addresses, all data  
inputs, address-pipelining Chip Enable (CE), burst control  
inputs (ADSC, ADSP, and ADV), write enables (BWa, BWb,  
BWc, BWd and BWE), and Global Write (GW).  
Features  
• Fast clock speed: 250, 200, and 167 MHz  
• Provide high-performance 3-1-1-1 access rate  
• Fast access time: 2.7, 3.0 and 3.5 ns  
• Optimal for depth expansion  
• Single 3.3V –5% and +5% power supply VDD  
• Separate VDDQ for 3.3V or 2.5V  
• Common data inputs and data outputs  
• Byte Write Enable and Global Write control  
• Chip enable for address pipeline  
Asynchronous inputs include the Output Enable (OE) and  
burst mode control (MODE). The data (DQa,b,c,d) and the data  
parity (DPa,b,c,d  
)
outputs, enabled by OE, are also  
asynchronous.  
DQa,b,c,d and DPa,b,c,d apply to CY7C1444V33, and DQa,b and  
DPa,b apply to CY7C1445V33. a, b, c, d each are eight bits  
wide in the case of DQ and 1 bit wide in the case of DP.  
• Address, data, and control registers  
• Internally self-timed Write Cycle  
• Burst control pins (interleaved or linear burst  
sequence)  
• Automatic power-down for portable applications  
• High-density, high-speed packages  
• JTAG boundary scan for BGA packaging version  
Addresses and chip enables are registered with either  
Address Status Processor (ADSP) or Address Status  
Controller (ADSC) input pins. Subsequent burst addresses  
can be internally generated as controlled by the Burst Advance  
Pin (ADV).  
Address, data inputs, and write controls are registered on-chip  
to initiate self-timed WRITE cycle. WRITE cycles can be one  
to four bytes wide as controlled by the write control inputs.  
Individual byte write allows individual byte to be written. BWa  
• Available in 119-ball bump BGA,165-ball FBGA and  
100-pin TQFP packages (CY7C1444V33 and  
CY7C1445V33)  
controls DQa and DPa. BWb controls DQ and DP . BWc  
b
b
controls DQc and DPd. BWd controls DQ and DPd. BWa,  
BWb, BWc, BWd can be active only with BWE being LOW. GW  
being LOW causes all bytes to be written. WRITE  
pass-through capability allows written data available at the  
output for the immediately next READ cycle. This device also  
incorporates pipelined enable circuit for easy depth expansion  
without penalizing system performance.  
Functional Description  
The Cypress Synchronous Burst SRAM family employs  
high-speed, low-power CMOS designs using advanced  
single-layer polysilicon, triple-layer metal technology. Each  
memory cell consists of six transistors.  
The CY7C1444V33 and CY7C1445V33 SRAMs integrate  
1,048,576 x 36/2,097,152 x18 SRAM cells with advanced  
synchronous peripheral circuitry and a two-bit counter for  
internal burst operation. All synchronous inputs are gated by  
The CY7C1444V33/CY7C1445V33 are both double-cycle  
deselect parts.All inputs and outputs of the CY7C1444V33,  
CY7C1445V33 are JEDEC-standard JESD8-5-compatible.  
Selection Guide[1]  
CY7C1444V33 CY7C1444V33 CY7C1444V33 CY7C1444V33  
CY7C1445V33 CY7C1445V33 CY7C1445V33 CY7C1445V33  
-300  
-250  
-200  
-167  
Unit  
ns  
Maximum Access Time  
2.3  
2.7  
3.0  
3.5  
Maximum Operating Current  
Coml  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
mA  
mA  
Maximum CMOS Standby Current  
Note:  
1. Shaded areas contain advance information.  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Document #: 38-05189 Rev. *B  
Revised November 13, 2002  

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