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CY7C1444AV33-250BZC PDF预览

CY7C1444AV33-250BZC

更新时间: 2024-11-29 05:19:35
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
26页 475K
描述
36-Mbit (1M x 36/2Mx 18) Pipelined DCD Sync SRAM

CY7C1444AV33-250BZC 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:15 X 17 MM, 1.40 MM HEIGHT, FBGA-165
针数:165Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.91最长访问时间:2.6 ns
其他特性:PIPELINED ARCHITECTURE最大时钟频率 (fCLK):250 MHz
I/O 类型:COMMONJESD-30 代码:R-PBGA-B165
JESD-609代码:e0长度:17 mm
内存密度:37748736 bit内存集成电路类型:CACHE SRAM
内存宽度:36湿度敏感等级:3
功能数量:1端子数量:165
字数:1048576 words字数代码:1000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:1MX36
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装等效代码:BGA165,11X15,40
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):220
电源:2.5/3.3,3.3 V认证状态:Not Qualified
座面最大高度:1.4 mm最小待机电流:3.14 V
子类别:SRAMs最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:15 mmBase Number Matches:1

CY7C1444AV33-250BZC 数据手册

 浏览型号CY7C1444AV33-250BZC的Datasheet PDF文件第2页浏览型号CY7C1444AV33-250BZC的Datasheet PDF文件第3页浏览型号CY7C1444AV33-250BZC的Datasheet PDF文件第4页浏览型号CY7C1444AV33-250BZC的Datasheet PDF文件第5页浏览型号CY7C1444AV33-250BZC的Datasheet PDF文件第6页浏览型号CY7C1444AV33-250BZC的Datasheet PDF文件第7页 
CY7C1444AV33  
CY7C1445AV33  
36-Mbit (1M x 36/2Mx 18) Pipelined  
DCD Sync SRAM  
Features  
Functional Description[1]  
• Supports bus operation up to 250 MHz  
The CY7C1444AV33/CY7C1445AV33 SRAM integrates 1M x  
36/2M x 18 SRAM cells with advanced synchronous  
peripheral circuitry and a two-bit counter for internal burst  
• Available speed grades are 250, 200, and 167 MHz  
• Registered inputs and outputs for pipelined operation  
• Optimal for performance (Double-Cycle deselect)  
• Depth expansion without wait state  
• 3.3V core power supply  
operation. All synchronous inputs are gated by registers  
controlled by a positive-edge-triggered Clock Input (CLK). The  
synchronous inputs include all addresses, all data inputs,  
address-pipelining Chip Enable (CE1), depth- expansion Chip  
Enables (CE2 and CE3), Burst Control inputs (ADSC, ADSP,  
and ADV), Write Enables (BWX, and BWE), and Global Write  
(GW). Asynchronous inputs include the Output Enable (OE)  
and the ZZ pin.  
• 2.5V/3.3V I/O power supply  
• Fast clock-to-output times  
— 2.6 ns (for 250-MHz device)  
Addresses and chip enables are registered at rising edge of  
clock when either Address Strobe Processor (ADSP) or  
Address Strobe Controller (ADSC) are active. Subsequent  
burst addresses can be internally generated as controlled by  
the Advance pin (ADV).  
• Provide high-performance 3-1-1-1 access rate  
User-selectable burst counter supporting Intel®  
Pentium® interleaved or linear burst sequences  
• Separate processor and controller address strobes  
• Synchronous self-timed writes  
Address, data inputs, and write controls are registered on-chip  
to initiate a self-timed Write cycle. This part supports Byte  
Write operations (see Pin Descriptions and Truth Table for  
further details). Write cycles can be one to four bytes wide as  
• Asynchronous output enable  
• CY7C1444AV33, CY7C1445AV33 available in  
JEDEC-standard lead-free 100-pin TQFP package and  
lead-free and non-lead-free 165-ball FBGA package  
controlled by the byte write control inputs. GW  
active  
LOW  
This device incorporates an  
causes all bytes to be written.  
additional pipelined enable register which delays turning off  
the output buffers an additional cycle when a deselect is  
executed.This feature allows depth expansion without penal-  
izing system performance.  
• IEEE 1149.1 JTAG-compatible Boundary Scan  
• “ZZ” Sleep Mode Option  
The CY7C1444AV33/CY7C1445AV33 operates from a +3.3V  
core power supply while all outputs operate with a +3.3V or a  
+2.5V supply. All inputs and outputs are JEDEC-standard  
JESD8-5-compatible.  
Selection Guide  
250 MHz  
2.6  
200 MHz  
3.2  
167 MHz  
3.4  
Unit  
ns  
Maximum Access Time  
Maximum Operating Current  
Maximum CMOS Standby Current  
475  
120  
425  
375  
mA  
mA  
120  
120  
Note:  
1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.  
Cypress Semiconductor Corporation  
Document #: 38-05352 Rev. *E  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised June 22, 2006  
[+] Feedback  

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