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CY7C1444AV25-200BZC PDF预览

CY7C1444AV25-200BZC

更新时间： 2024-11-27 05:19:35
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
26页 434K
描述
36-Mbit (1M x 36/2M x 18) Pipelined DCD Sync SRAM

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中文翻译

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CY7C1444AV25-200BZC 技术参数

是否无铅： 含铅是否Rohs认证： 不符合
生命周期：Obsolete零件包装代码：BGA
包装说明：15 X 17 MM, 1.40 MM HEIGHT, FBGA-165针数：165
Reach Compliance Code：compliantECCN代码：3A991.B.2.A
HTS代码：8542.32.00.41风险等级：5.92
最长访问时间：3.2 ns其他特性：PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)：200 MHzI/O 类型：COMMON
JESD-30 代码：R-PBGA-B165JESD-609代码：e0
长度：17 mm内存密度：37748736 bit
内存集成电路类型：CACHE SRAM内存宽度：36
湿度敏感等级：3功能数量：1
端子数量：165字数：1048576 words
字数代码：1000000工作模式：SYNCHRONOUS
最高工作温度：70 °C最低工作温度：
组织：1MX36输出特性：3-STATE
封装主体材料：PLASTIC/EPOXY封装代码：LBGA
封装等效代码：BGA165,11X15,40封装形状：RECTANGULAR
封装形式：GRID ARRAY, LOW PROFILE并行/串行：PARALLEL
峰值回流温度（摄氏度）：220电源：1.8/2.5,2.5 V
认证状态：Not Qualified座面最大高度：1.4 mm
最小待机电流：2.38 V子类别：SRAMs
最大供电电压 (Vsup)：2.625 V最小供电电压 (Vsup)：2.375 V
标称供电电压 (Vsup)：2.5 V表面贴装：YES
技术：CMOS温度等级：COMMERCIAL
端子面层：Tin/Lead (Sn/Pb)端子形式：BALL
端子节距：1 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：15 mm
Base Number Matches：1

CY7C1444AV25-200BZC 数据手册

 浏览型号CY7C1444AV25-200BZC的Datasheet PDF文件第2页浏览型号CY7C1444AV25-200BZC的Datasheet PDF文件第3页浏览型号CY7C1444AV25-200BZC的Datasheet PDF文件第4页浏览型号CY7C1444AV25-200BZC的Datasheet PDF文件第5页浏览型号CY7C1444AV25-200BZC的Datasheet PDF文件第6页浏览型号CY7C1444AV25-200BZC的Datasheet PDF文件第7页 
CY7C1444AV25  
CY7C1445AV25  
36-Mbit (1M x 36/2M x 18) Pipelined  
DCD Sync SRAM  
Features  
Functional Description[1]  
• Supports bus operation up to 250 MHz  
The CY7C1444AV25/CY7C1445AV25 SRAM integrates 1M x  
36/2M x 18 SRAM cells with advanced synchronous  
peripheral circuitry and a two-bit counter for internal burst  
• Available speed grades are 250, 200 and 167 MHz  
• Registered inputs and outputs for pipelined operation  
• Optimal for performance (Double-Cycle deselect)  
• Depth expansion without wait state  
• 2.5V core power supply  
operation. All synchronous inputs are gated by registers  
controlled by a positive-edge-triggered Clock Input (CLK). The  
synchronous inputs include all addresses, all data inputs,  
address-pipelining Chip Enable (CE1), depth- expansion Chip  
Enables (CE2 and CE3), Burst Control inputs (ADSC, ADSP,  
and ADV), Write Enables (BWX, and BWE), and Global Write  
(GW). Asynchronous inputs include the Output Enable (OE)  
and the ZZ pin.  
• 2.5V/1.8V I/O power supply  
• Fast clock-to-output times  
— 2.6 ns (for 250-MHz device)  
Addresses and chip enables are registered at rising edge of  
clock when either Address Strobe Processor (ADSP) or  
Address Strobe Controller (ADSC) are active. Subsequent  
burst addresses can be internally generated as controlled by  
the Advance pin (ADV).  
• Provide high-performance 3-1-1-1 access rate  
• User-selectable burst counter supporting Intel®  
Pentium® interleaved or linear burst sequences  
• Separate processor and controller address strobes  
• Synchronous self-timed writes  
Address, data inputs, and write controls are registered on-chip  
to initiate a self-timed Write cycle.This part supports Byte Write  
operations (see Pin Descriptions and Truth Table for further  
details). Write cycles can be one to four bytes wide as  
controlled by the byte write control inputs. GW active LOW  
causes all bytes to be written. This device incorporates an  
additional pipelined enable register which delays turning off  
the output buffers an additional cycle when a deselect is  
executed.This feature allows depth expansion without penal-  
izing system performance.  
• Asynchronous output enable  
• CY7C1444AV25, CY7C1445AV25 available in  
JEDEC-standard lead-free 100-pin TQFP package,  
lead-free and non-lead-free 165-ball FBGA package  
• IEEE 1149.1 JTAG-Compatible Boundary Scan  
• “ZZ” Sleep Mode Option  
The CY7C1444AV25/CY7C1445AV25 operates from a +2.5V  
core power supply while all outputs operate with a +2.5V or  
1.8V supply. All inputs and outputs are JEDEC-standard  
JESD8-5-compatible.  
Selection Guide  
250 MHz  
2.6  
200 MHz  
3.2  
167 MHz  
3.4  
Unit  
ns  
Maximum Access Time  
Maximum Operating Current  
Maximum CMOS Standby Current  
435  
120  
385  
335  
mA  
mA  
120  
120  
Note:  
1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.  
Cypress Semiconductor Corporation  
Document #: 38-05351 Rev. *E  
•
198 Champion Court  
•
San Jose, CA 95134-1709  
•
408-943-2600  
Revised June 22, 2006  
1234567...26

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