CY7C1447V25
CY7C1443V25
CY7C1441V25
PRELIMINARY
1M x 36/2M x 18/512K x 72 Flow-Thru SRAM
inputs are gated by registers controlled by a positive-
edge-triggered clock input (CLK). The synchronous inputs
Features
•Supports 133-MHz bus operations
•1M x 36/2M x18/512K x 72 common I/O
•Fast clock-to-output times
— 5.5 ns (for 150-MHz device)
— 6.5 ns (for 133-MHz device)
— 7.5 ns (for 117-MHz device)
include all addresses, all data inputs, address-pipelining Chip
Enable (CE), Burst Control Inputs (ADSC, ADSP, and ADV),
Write Enables (BWa, BWb, BWc, BWd,BWe,BWf,BWg and
BWh, BWE), and Global Write (GW).
Asynchronous inputs include the Output Enable (OE) and
Burst Mode Control (MODE). The data outputs (Q), enabled
by OE, are also asynchronous.
• Single 2.5V –5% and +5% power supply VDD
• Separate VDDQ for 2.5V or 1.8V I/O
• Byte Write Enable and Global Write control
• Burst capability–linear or interleaved burst order
Addresses and chip enables are registered with either
Address Status Processor (ADSP) or address status controller
(ADSC) input pins. Subsequent burst addresses can be inter-
nally generated as controlled by the Burst Advance Pin (ADV).
• Automatic power down available using ZZ mode or CE
deselect
• JTAG boundary scan for BGA packaging version
• Available in 119-ball bump BGA, 165-ball FBGA, and
100-pin TQFP packages (CY7C1441V25 and
CY7C1443V25). 209 FBGA package for CY7C1447V25.
Address, data inputs, and Write controls are registered on-chip
to initiate self-timed Write cycle. Write cycles can be one to
four bytes wide as controlled by the Write control inputs.
Individual byte Write allows individual byte to be written. BWa
controls DQ1–DQ8 and DP1. BWb controls DQ9–DQ16 and
DP2. BWc controls DQ17–DQ24and DP3. BWd controls
DQ25–DQ32 and DP4. BWe controls DQ33–DQ40 and DP5.
BWf controls DQ41–DQ48 and DP6. BWg controls
DQ49–DQ56 and DP7. BWh controls DQ57–DQ64 and DP8.
BWa, BWb BWc, BWd, BWe, BWf, BWg, and BWh can be
active only with BWE LOW. GW LOW causes all bytes to be
written. Write pass-thru capability allows written data available
at the output for the immediately next Read cycle. This device
also incorporates pipelined enable circuit for easy depth
expansion without penalizing system performance.
Functional Description
The Cypress Synchronous Burst SRAM family employs
high-speed, low-power CMOS designs using advanced
single-layer polysilicon, triple-layer metal technology. Each
memory cell consists of six transistors.
The CY7C1441V25/CY7C1443V25/CY7C1447V25 SRAMs
integrate 1,048,576 × 36/2,097,152 × 18/524,288 × 72 SRAM
cells with advanced synchronous peripheral circuitry and a
two-bit counter for internal burst operation. All synchronous
All inputs and outputs of the CY7C1441V25/ CY7C1443V25/
CY7C1447V25 are JEDEC-standard JESD8-5 compatible.
MODE
Logic Block Diagram
2
(A[1;0]
)
CY7C1441V25–1M × 36
Q
Q
CLK
0
BURST
COUNTER
ADV
CE
CLR
ADSC
1
ADSP
Q
18
20
ADDRESS
REGISTER
CE
D
1M × 36
Memory
Array
A[19:0]
20
18
GW
DQd, DPd
BYTEWRITE
REGISTERS
D
Q
BWE
BW
d
DQc, DPc
BYTEWRITE
REGISTERS
D
D
D
Q
Q
Q
BW
c
DQb, DPb
BYTEWRITE
REGISTERS
BW
b
DQa, DPa
BYTEWRITE
REGISTERS
BW
a
36
36
CE
2
1
CE
D
D
Q
ENABLE CE
REGISTER
CE
3
Q
OUTPUT
REGISTERS
CLK
INPUT
REGISTERS
CLK
ENABLE DELAY
REGISTER
OE
ZZ
SLEEP
CONTROL
DQa,b,c,d
DPa,b,c,d
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134
•
408-943-2600
Document #: 38-05186 Rev. **
Revised April 19, 2002