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CY7C1441V25-133BGC PDF预览

CY7C1441V25-133BGC

更新时间: 2024-11-21 09:24:43
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
29页 988K
描述
Standard SRAM, 1MX36, 6.5ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119

CY7C1441V25-133BGC 数据手册

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CY7C1447V25  
CY7C1443V25  
CY7C1441V25  
PRELIMINARY  
1M x 36/2M x 18/512K x 72 Flow-Thru SRAM  
inputs are gated by registers controlled by a positive-  
edge-triggered clock input (CLK). The synchronous inputs  
Features  
•Supports 133-MHz bus operations  
•1M x 36/2M x18/512K x 72 common I/O  
•Fast clock-to-output times  
— 5.5 ns (for 150-MHz device)  
— 6.5 ns (for 133-MHz device)  
— 7.5 ns (for 117-MHz device)  
include all addresses, all data inputs, address-pipelining Chip  
Enable (CE), Burst Control Inputs (ADSC, ADSP, and ADV),  
Write Enables (BWa, BWb, BWc, BWd,BWe,BWf,BWg and  
BWh, BWE), and Global Write (GW).  
Asynchronous inputs include the Output Enable (OE) and  
Burst Mode Control (MODE). The data outputs (Q), enabled  
by OE, are also asynchronous.  
• Single 2.5V –5% and +5% power supply VDD  
• Separate VDDQ for 2.5V or 1.8V I/O  
• Byte Write Enable and Global Write control  
• Burst capability–linear or interleaved burst order  
Addresses and chip enables are registered with either  
Address Status Processor (ADSP) or address status controller  
(ADSC) input pins. Subsequent burst addresses can be inter-  
nally generated as controlled by the Burst Advance Pin (ADV).  
• Automatic power down available using ZZ mode or CE  
deselect  
• JTAG boundary scan for BGA packaging version  
• Available in 119-ball bump BGA, 165-ball FBGA, and  
100-pin TQFP packages (CY7C1441V25 and  
CY7C1443V25). 209 FBGA package for CY7C1447V25.  
Address, data inputs, and Write controls are registered on-chip  
to initiate self-timed Write cycle. Write cycles can be one to  
four bytes wide as controlled by the Write control inputs.  
Individual byte Write allows individual byte to be written. BWa  
controls DQ1DQ8 and DP1. BWb controls DQ9DQ16 and  
DP2. BWc controls DQ17DQ24and DP3. BWd controls  
DQ25DQ32 and DP4. BWe controls DQ33DQ40 and DP5.  
BWf controls DQ41DQ48 and DP6. BWg controls  
DQ49DQ56 and DP7. BWh controls DQ57DQ64 and DP8.  
BWa, BWb BWc, BWd, BWe, BWf, BWg, and BWh can be  
active only with BWE LOW. GW LOW causes all bytes to be  
written. Write pass-thru capability allows written data available  
at the output for the immediately next Read cycle. This device  
also incorporates pipelined enable circuit for easy depth  
expansion without penalizing system performance.  
Functional Description  
The Cypress Synchronous Burst SRAM family employs  
high-speed, low-power CMOS designs using advanced  
single-layer polysilicon, triple-layer metal technology. Each  
memory cell consists of six transistors.  
The CY7C1441V25/CY7C1443V25/CY7C1447V25 SRAMs  
integrate 1,048,576 × 36/2,097,152 × 18/524,288 × 72 SRAM  
cells with advanced synchronous peripheral circuitry and a  
two-bit counter for internal burst operation. All synchronous  
All inputs and outputs of the CY7C1441V25/ CY7C1443V25/  
CY7C1447V25 are JEDEC-standard JESD8-5 compatible.  
MODE  
Logic Block Diagram  
2
(A[1;0]  
)
CY7C1441V251M × 36  
Q
Q
CLK  
0
BURST  
COUNTER  
ADV  
CE  
CLR  
ADSC  
1
ADSP  
Q
18  
20  
ADDRESS  
REGISTER  
CE  
D
1M × 36  
Memory  
Array  
A[19:0]  
20  
18  
GW  
DQd, DPd  
BYTEWRITE  
REGISTERS  
D
Q
BWE  
BW  
d
DQc, DPc  
BYTEWRITE  
REGISTERS  
D
D
D
Q
Q
Q
BW  
c
DQb, DPb  
BYTEWRITE  
REGISTERS  
BW  
b
DQa, DPa  
BYTEWRITE  
REGISTERS  
BW  
a
36  
36  
CE  
2
1
CE  
D
D
Q
ENABLE CE  
REGISTER  
CE  
3
Q
OUTPUT  
REGISTERS  
CLK  
INPUT  
REGISTERS  
CLK  
ENABLE DELAY  
REGISTER  
OE  
ZZ  
SLEEP  
CONTROL  
DQa,b,c,d  
DPa,b,c,d  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Document #: 38-05186 Rev. **  
Revised April 19, 2002  

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