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CY7C1426KV18_12 PDF预览

CY7C1426KV18_12

更新时间: 2024-11-27 12:23:15
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赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
35页 936K
描述
36-Mbit QDR® II SRAM Four-Word Burst Architecture

CY7C1426KV18_12 数据手册

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CY7C1411KV18, CY7C1426KV18  
CY7C1413KV18, CY7C1415KV18  
36-Mbit QDR® II SRAM Four-Word  
Burst Architecture  
36-Mbit QDR® II SRAM Four-Word Burst Architecture  
Features  
Configurations  
Separate independent read and write data ports  
Supports concurrent transactions  
CY7C1411KV18 – 4 M × 8  
CY7C1426KV18 – 4 M × 9  
CY7C1413KV18 – 2 M × 18  
CY7C1415KV18 – 1 M × 36  
333 MHz clock for high bandwidth  
Four-word burst for reducing address bus frequency  
Double data rate (DDR) Interfaces on both read and write ports  
(data transferred at 666 MHz) at 333 MHz  
Functional Description  
The CY7C1411KV18, CY7C1426KV18, CY7C1413KV18, and  
CY7C1415KV18 are 1.8 V synchronous pipelined SRAMs,  
equipped with QDR II architecture. QDR II architecture consists  
of two separate ports: the read port and the write port to access  
the memory array. The read port has dedicated data outputs to  
support read operations and the write port has dedicated data  
inputs to support write operations. QDR II architecture has  
separate data inputs and data outputs to completely eliminate  
the need to “turnaround” the data bus that exists with common  
I/O devices. Each port can be accessed through a common  
address bus. Addresses for read and write addresses are  
latched on alternate rising edges of the input (K) clock. Accesses  
to the QDR II read and write ports are independent of one  
another. To maximize data throughput, both read and write ports  
are equipped with DDR interfaces. Each address location is  
associated with four 8-bit words (CY7C1411KV18), 9-bit words  
(CY7C1426KV18), 18-bit words (CY7C1413KV18), or 36-bit  
words (CY7C1415KV18) that burst sequentially into or out of the  
device. Because data can be transferred into and out of the  
device on every rising edge of both input clocks (K and K and C  
and C), memory bandwidth is maximized while simplifying  
system design by eliminating bus ‘turnarounds’.  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Two input clocks for output data (C and C) to minimize clock  
skew and flight time mismatches  
Echo clocks (CQ and CQ) simplify data capture in high speed  
systems  
Single multiplexed address input bus latches address inputs  
for read and write ports  
Separate port selects for depth expansion  
Synchronous internally self-timed writes  
QDR® II operates with 1.5 cycle read latency when DOFF is  
asserted HIGH  
OperatessimilartoQDRIdevicewith1cyclereadlatencywhen  
DOFF is asserted LOW  
Available in × 8, × 9, × 18, and × 36 configurations  
Full data coherency, providing most current data  
Depth expansion is accomplished with port selects, which  
enables each port to operate independently.  
Core VDD = 1.8 V (±0.1 V); I/O VDDQ = 1.4 V to VDD  
Supports both 1.5 V and 1.8 V I/O supply  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the C or C (or K or K in a single clock  
domain) input clocks. Writes are conducted with on-chip  
synchronous self-timed write circuitry.  
Available in 165-ball FBGA package (13 × 15 × 1.4 mm)  
Offered in both Pb-free and non Pb-free Packages  
Variable drive HSTL output buffers  
JTAG 1149.1 compatible test access port  
Phase locked loop (PLL) for accurate data placement  
Selection Guide  
Description  
Maximum operating frequency  
333 MHz  
333  
300 MHz  
300  
250 MHz Unit  
250  
460  
460  
470  
640  
MHz  
mA  
Maximum operating current  
× 8 Not Offered  
520  
× 9  
560  
570  
790  
520  
× 18  
× 36  
540  
730  
Cypress Semiconductor Corporation  
Document Number: 001-57826 Rev. *E  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised October 25, 2012  

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