CY7C1386D, CY7C1386F
CY7C1387D, CY7C1387F
18-Mbit (512 K × 36/1 M × 18) Pipelined
DCD Sync SRAM
18-Mbit (512
K × 36/1 M × 18) Pipelined DCD Sync SRAM
Features
Functional Description
■ Supports bus operation up to 250 MHz
The
CY7C1386D/CY7C1387D/CY7C1386F/CY7C1387F
SRAM[1] integrates 512 K × 36/1 M × 18 SRAM cells with
advanced synchronous peripheral circuitry and a two-bit counter
for internal burst operation. All synchronous inputs are gated by
registers controlled by a positive edge triggered clock input
(CLK). The synchronous inputs include all addresses, all data
inputs, address-pipelining chip enable (CE1), depth expansion
chip enables (CE2 and CE3 [2]), burst control inputs (ADSC,
■ Available speed grades are 250, 200, and 167 MHz
■ Registered inputs and outputs for pipelined operation
■ Optimal for performance (double-cycle deselect)
■ Depth expansion without wait state
■ 3.3 V core power supply (VDD
)
ADSP,
ADV), write enables (
, and BWE), and global
BWX
and
write (GW). Asynchronous inputs include the output enable (OE)
and the ZZ pin.
■ 2.5 V or 3.3 V I/O power supply (VDDQ)
■ Fast clock-to-output times
❐ 2.6 ns (for 250 MHz device)
Addresses and chip enables are registered at rising edge of
clock when either address strobe processor (ADSP) or address
strobe controller (ADSC) are active. Subsequent burst
addresses can be internally generated as controlled by the
advance pin (ADV).
■ Provides high performance 3-1-1-1 access rate
■ User selectable burst counter supporting Intel Pentium
Interleaved or linear burst sequences
Address, data inputs, and write controls are registered on-chip
to initiate a self timed write cycle.This part supports byte write
operations (see on page 4 and Truth Table on page 11 for further
details). Write cycles can be one to four bytes wide as controlled
by the byte write control inputs. GW active LOW causes all bytes
to be written. This device incorporates an additional pipelined
enable register which delays turning off the output buffers an
additional cycle when a deselect is executed.This feature allows
depth expansion without penalizing system performance.
■ Separate processor and controller address strobes
■ Synchronous self-timed writes
■ Asynchronous output enable
■ CY7C1386D/CY7C1387D available in JEDEC-standard
Pb-free 100-pin TQFP, Pb-free and non Pb-free 165-ball FBGA
package. CY7C1386F/CY7C1387F available in Pb-free and
non Pb-free 119-ball BGA package
The
CY7C1386D/CY7C1387D/CY7C1386F/CY7C1387F
■ IEEE 1149.1 JTAG-compatible boundary scan
■ ZZ sleep mode option
operates from a +3.3 V core power supply while all outputs
operate with a +3.3 V or +2.5 V supply. All inputs and outputs are
JEDEC-standard and JESD8-5-compatible.
Selection Guide
Description
Maximum access time
250 MHz
2.6
200 MHz
3.0
167 MHz
3.4
Unit
ns
Maximum operating current
350
300
275
mA
mA
Maximum CMOS standby current
70
70
70
Notes
1. For best practices or recommendations, please refer to the Cypress application note AN1064, SRAM System Design Guidelines on www.cypress.com.
2. CE and CE are for 100-pin TQFP and 165-ball FBGA packages only. 119-ball BGA is offered only in Single Chip Enable.
3
2
Cypress Semiconductor Corporation
Document Number: 38-05545 Rev. *H
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised July 12, 2011
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