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CY7C1380DV25-225BGC PDF预览

CY7C1380DV25-225BGC

更新时间: 2024-11-27 14:48:43
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器内存集成电路
页数 文件大小 规格书
30页 789K
描述
Cache SRAM, 512KX36, 2.8ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119

CY7C1380DV25-225BGC 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119针数:119
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.84
Is Samacsys:N最长访问时间:2.8 ns
其他特性:PIPELINED ARCHITECTUREJESD-30 代码:R-PBGA-B119
长度:22 mm内存密度:18874368 bit
内存集成电路类型:CACHE SRAM内存宽度:36
功能数量:1端子数量:119
字数:524288 words字数代码:512000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:512KX36
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装形状:RECTANGULAR封装形式:GRID ARRAY
并行/串行:PARALLEL认证状态:Not Qualified
座面最大高度:2.4 mm最大供电电压 (Vsup):2.625 V
最小供电电压 (Vsup):2.375 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
宽度:14 mmBase Number Matches:1

CY7C1380DV25-225BGC 数据手册

 浏览型号CY7C1380DV25-225BGC的Datasheet PDF文件第2页浏览型号CY7C1380DV25-225BGC的Datasheet PDF文件第3页浏览型号CY7C1380DV25-225BGC的Datasheet PDF文件第4页浏览型号CY7C1380DV25-225BGC的Datasheet PDF文件第5页浏览型号CY7C1380DV25-225BGC的Datasheet PDF文件第6页浏览型号CY7C1380DV25-225BGC的Datasheet PDF文件第7页 
CY7C1380DV25  
CY7C1382DV25  
PRELIMINARY  
18-Mbit (512K x 36/1M x 18) Pipelined SRAM  
Features  
Functional Description[1]  
• Supports bus operation up to 250 MHz  
The CY7C1380DV25/CY7C1382DV25 SRAM integrates  
524,288 x 36 and 1,048,576 x 18 SRAM cells with advanced  
synchronous peripheral circuitry and a two-bit counter for  
internal burst operation. All synchronous inputs are gated by  
registers controlled by a positive-edge-triggered Clock Input  
(CLK). The synchronous inputs include all addresses, all data  
inputs, address-pipelining Chip Enabl[e2] (CE1), depth-  
expansion Chip Enables (CE2 and CE3 ), Burst Control  
inputs (ADSC, ADSP, and ADV), Write Enables (BWX, and  
BWE), and Global Write (GW). Asynchronous inputs include  
the Output Enable (OE) and the ZZ pin.  
Addresses and chip enables are registered at rising edge of  
clock when either Address Strobe Processor (ADSP) or  
Address Strobe Controller (ADSC) are active. Subsequent  
burst addresses can be internally generated as controlled by  
the Advance pin (ADV).  
• Available speed grades are 250, 225, 200,167, and  
133 MHz  
• Registered inputs and outputs for pipelined operation  
• 2.5V core power supply  
• Fast clock-to-output times  
— 2.6 ns (for 250-MHz device)  
— 2.8 ns (for 225-MHz device)  
— 3.0 ns (for 200-MHz device)  
— 3.4 ns (for 167-MHz device)  
— 4.2 ns (for 133-MHz device)  
• Provide high-performance 3-1-1-1 access rate  
User-selectable burst counter supporting Intel®  
Address, data inputs, and write controls are registered on-chip  
to initiate a self-timed Write cycle.This part supports Byte Write  
operations (see Pin Descriptions and Truth Table for further  
details). Write cycles can be one to two or four bytes wide as  
controlled by the byte write control inputs. GW when active  
Pentium® interleaved or linear burst sequences  
• Separate processor and controller address strobes  
• Synchronous self-timed writes  
• Asynchronous output enable  
causes all bytes to be written.  
LOW  
• Single Cycle Chip Deselect  
The CY7C1380DV25/CY7C1382DV25 operates from a +2.5V  
core power supply while all outputs may operate with a +2.5  
supply. All inputs and outputs are JEDEC-standard JESD8-5-  
compatible.  
• Offered in JEDEC-standard 100-pin TQFP, 119-ball BGA  
and 165-ball fBGA packages  
• IEEE 1149.1 JTAG-Compatible Boundary Scan  
• “ZZ” Sleep Mode Option  
Selection Guide  
250 MHz  
225 MHz  
2.8  
200 MHz  
3.0  
167 MHz  
3.4  
133 MHz  
4.2  
Unit  
ns  
mA  
mA  
Maximum Access Time  
Maximum Operating Current  
Maximum CMOS Standby Current  
2.6  
350  
70  
325  
70  
300  
70  
275  
70  
245  
70  
Shaded areas contain advance information.  
Please contact your local Cypress sales representative for availability of these parts.  
Notes:  
1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.  
2. CE , CE are for TQFP and 165 fBGA package only. 119 BGA is offered only in 1 Chip Enable.  
3
2
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Document #: 38-05546 Rev. **  
Revised August 12, 2004  

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