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CY7C1380D-200BZXC PDF预览

CY7C1380D-200BZXC

更新时间: 2024-11-24 03:57:43
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
29页 468K
描述
18-Mbit (512K x 36/1M x 18) Pipelined SRAM

CY7C1380D-200BZXC 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:BGA
包装说明:LBGA, BGA165,11X15,40针数:165
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.7
最长访问时间:3 ns其他特性:PIPELINED ARCHITECTURE
最大时钟频率 (fCLK):200 MHzI/O 类型:COMMON
JESD-30 代码:R-PBGA-B165JESD-609代码:e1
长度:15 mm内存密度:18874368 bit
内存集成电路类型:CACHE SRAM内存宽度:36
湿度敏感等级:3功能数量:1
端子数量:165字数:524288 words
字数代码:512000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:512KX36输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LBGA
封装等效代码:BGA165,11X15,40封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:2.5/3.3,3.3 V
认证状态:Not Qualified座面最大高度:1.4 mm
最大待机电流:0.07 A子类别:SRAMs
最大压摆率:0.3 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:20
宽度:13 mm

CY7C1380D-200BZXC 数据手册

 浏览型号CY7C1380D-200BZXC的Datasheet PDF文件第2页浏览型号CY7C1380D-200BZXC的Datasheet PDF文件第3页浏览型号CY7C1380D-200BZXC的Datasheet PDF文件第4页浏览型号CY7C1380D-200BZXC的Datasheet PDF文件第5页浏览型号CY7C1380D-200BZXC的Datasheet PDF文件第6页浏览型号CY7C1380D-200BZXC的Datasheet PDF文件第7页 
CY7C1380D  
CY7C1382D  
PRELIMINARY  
18-Mbit (512K x 36/1M x 18) Pipelined SRAM  
Features  
Functional Description[1]  
• Supports bus operation up to 250 MHz  
• Available speed grades are 250, 200 and 167 MHz  
• Registered inputs and outputs for pipelined operation  
• 3.3V core power supply  
The CY7C1380D/CY7C1382D SRAM integrates 524,288 x 36  
and 1,048,576 x 18 SRAM cells with advanced synchronous  
peripheral circuitry and a two-bit counter for internal burst  
operation. All synchronous inputs are gated by registers  
controlled by a positive-edge-triggered Clock Input (CLK). The  
synchronous inputs include all addresses, all data inputs,  
• 2.5V / 3.3V I/O operation  
• Fast clock-to-output times  
address-pipelining Chip Enable (  
), depth-expansion Chip  
CE1  
[2]  
Enables (CE and  
), Burst Control inputs (  
,
,
CE3  
— 2.6 ns (for 250-MHz device)  
ADSC ADSP  
2
), Write Enables (  
ADV  
, and  
BWX  
), and Global Write  
and  
BWE  
— 3.0 ns (for 200-MHz device)  
(
). Asynchronous inputs include the Output Enable (  
)
OE  
GW  
— 3.4 ns (for 167-MHz device)  
and the ZZ pin.  
• Provide high-performance 3-1-1-1 access rate  
Addresses and chip enables are registered at rising edge of  
clock when either Address Strobe Processor ( ) or  
User-selectable burst counter supporting Intel  
ADSP  
) are active. Subsequent  
Pentium interleaved or linear burst sequences  
Address Strobe Controller (  
ADSC  
burst addresses can be internally generated as controlled by  
the Advance pin ( ).  
• Separate processor and controller address strobes  
• Synchronous self-timed writes  
ADV  
• Asynchronous output enable  
Address, data inputs, and write controls are registered on-chip  
to initiate a self-timed Write cycle.This part supports Byte Write  
operations (see Pin Descriptions and Truth Table for further  
details). Write cycles can be one to two or four bytes wide as  
• Single Cycle Chip Deselect  
• Offered in JEDEC-standard lead-free 100-pin TQFP,  
119-ball BGA and 165-Ball fBGA packages  
controlled by the byte write control inputs.  
when active  
GW  
• IEEE 1149.1 JTAG-Compatible Boundary Scan  
• “ZZ” Sleep Mode Option  
causes all bytes to be written.  
LOW  
The CY7C1380D/CY7C1382D operates from a +3.3V core  
power supply while all outputs may operate with either a +2.5  
or +3.3V supply. All inputs and outputs are JEDEC-standard  
JESD8-5-compatible.  
Selection Guide  
250 MHz  
2.6  
200 MHz  
3.0  
167 MHz  
3.4  
Unit  
ns  
Maximum Access Time  
Maximum Operating Current  
Maximum CMOS Standby Current  
350  
70  
300  
70  
275  
70  
mA  
mA  
Shaded areas contain advance information. Please contact your local Cypress sales representative for availability of these parts.  
Notes:  
1. For best–practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.  
2. CE , CE are for TQFP and 165 fBGA package only. 119 BGA is offered only in 1 Chip Enable.  
3
2
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Document #: 38-05543 Rev. *A  
Revised October 28, 2004  

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