生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | TBGA, | 针数: | 165 |
Reach Compliance Code: | unknown | ECCN代码: | 3A991.B.2.A |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.73 |
最长访问时间: | 8.5 ns | 其他特性: | FLOW-THROUGH ARCHITECTURE |
JESD-30 代码: | R-PBGA-B165 | JESD-609代码: | e0 |
长度: | 15 mm | 内存密度: | 9437184 bit |
内存集成电路类型: | CACHE SRAM | 内存宽度: | 18 |
功能数量: | 1 | 端子数量: | 165 |
字数: | 524288 words | 字数代码: | 512000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 512KX18 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, THIN PROFILE |
并行/串行: | PARALLEL | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 最大供电电压 (Vsup): | 3.63 V |
最小供电电压 (Vsup): | 3.135 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | TIN LEAD |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 宽度: | 13 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CY7C1363B-117AC | CYPRESS |
获取价格 |
9-Mbit (256K x 36/512K x 18) Flow-Through SRAM | |
CY7C1363B-117AI | CYPRESS |
获取价格 |
9-Mbit (256K x 36/512K x 18) Flow-Through SRAM | |
CY7C1363B-117AJC | CYPRESS |
获取价格 |
9-Mbit (256K x 36/512K x 18) Flow-Through SRAM | |
CY7C1363B-117AJI | CYPRESS |
获取价格 |
9-Mbit (256K x 36/512K x 18) Flow-Through SRAM | |
CY7C1363B-117BGC | CYPRESS |
获取价格 |
9-Mbit (256K x 36/512K x 18) Flow-Through SRAM | |
CY7C1363B-117BGI | CYPRESS |
获取价格 |
9-Mbit (256K x 36/512K x 18) Flow-Through SRAM | |
CY7C1363B-117BZC | CYPRESS |
获取价格 |
9-Mbit (256K x 36/512K x 18) Flow-Through SRAM | |
CY7C1363B-117BZI | CYPRESS |
获取价格 |
9-Mbit (256K x 36/512K x 18) Flow-Through SRAM | |
CY7C1363B-133AC | CYPRESS |
获取价格 |
9-Mbit (256K x 36/512K x 18) Flow-Through SRAM | |
CY7C1363B-133AI | CYPRESS |
获取价格 |
9-Mbit (256K x 36/512K x 18) Flow-Through SRAM |