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CY7C1351G-100AXIT PDF预览

CY7C1351G-100AXIT

更新时间: 2024-11-26 13:07:11
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
21页 567K
描述
ZBT SRAM, 128KX36, 8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026, TQFP-100

CY7C1351G-100AXIT 技术参数

生命周期:Obsolete零件包装代码:QFP
包装说明:LQFP,针数:100
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.64
Is Samacsys:N最长访问时间:8 ns
其他特性:FLOW THROUGH ARCHITECTUREJESD-30 代码:R-PQFP-G100
JESD-609代码:e3/e4长度:20 mm
内存密度:4718592 bit内存集成电路类型:ZBT SRAM
内存宽度:36功能数量:1
端子数量:100字数:131072 words
字数代码:128000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128KX36封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
认证状态:Not Qualified座面最大高度:1.6 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:MATTE TIN/NICKEL PALLADIUM GOLD端子形式:GULL WING
端子节距:0.65 mm端子位置:QUAD
宽度:14 mmBase Number Matches:1

CY7C1351G-100AXIT 数据手册

 浏览型号CY7C1351G-100AXIT的Datasheet PDF文件第2页浏览型号CY7C1351G-100AXIT的Datasheet PDF文件第3页浏览型号CY7C1351G-100AXIT的Datasheet PDF文件第4页浏览型号CY7C1351G-100AXIT的Datasheet PDF文件第5页浏览型号CY7C1351G-100AXIT的Datasheet PDF文件第6页浏览型号CY7C1351G-100AXIT的Datasheet PDF文件第7页 
CY7C1351G  
4-Mbit (128 K × 36) Flow-Through SRAM  
with NoBL™ Architecture  
4-Mbit (128  
K × 36) Flow-Through SRAM with NoBL™ Architecture  
Features  
Functional Description  
Can support up to 133-MHz bus operations with zero wait  
states  
Data is transferred on every clock  
The CY7C1351G is a 3.3 V, 128 K × 36 synchronous  
flow-through burst SRAM designed specifically to support  
unlimited true back-to-back read/write operations without the  
insertion of wait states. The CY7C1351G is equipped with the  
advanced No Bus Latency™ (NoBL™) logic required to enable  
consecutive Read/Write operations with data being transferred  
on every clock cycle. This feature dramatically improves the  
throughput of data through the SRAM, especially in systems that  
require frequent write-read transitions.  
Pin compatible and functionally equivalent to ZBT™ devices  
Internally self-timed output buffer control to eliminate the need  
to use OE  
Registered inputs for flow-through operation  
Byte write capability  
All synchronous inputs pass through input registers controlled by  
the rising edge of the clock. The clock input is qualified by the  
clock enable (CEN) signal, which when deasserted suspends  
operation and extends the previous clock cycle. Maximum  
access delay from the clock rise is 6.5 ns (133-MHz device).  
128 K × 36 common I/O architecture  
2.5 V/3.3 V I/O power supply (VDDQ  
)
Fast clock-to-output times  
6.5 ns (for 133-MHz device)  
Write operations are controlled by the four byte write select  
(BW[A:D]) and a write enable (WE) input. All writes are conducted  
with on-chip synchronous self-timed write circuitry.  
Clock enable (CEN) pin to suspend operation  
Synchronous self-timed writes  
Three synchronous chip enables (CE1, CE2, CE3) and an  
asynchronous output enable (OE) provide for easy bank  
selection and output tristate control. In order to avoid bus  
contention, the output drivers are synchronously tristated during  
the data portion of a write sequence.  
Asynchronous output enable  
Available in Pb-free 100-pin TQFP package  
Burst capability – linear or interleaved burst order  
Low standby power  
Selection Guide  
Description  
133 MHz  
6.5  
100 MHz Unit  
Maximum access time  
8.0  
205  
40  
ns  
Maximum operating current  
Maximum CMOS standby current  
225  
mA  
mA  
40  
Errata: For information on silicon errata, see "Errata" on page 18. Details include trigger conditions, devices affected, and proposed workaround.  
Cypress Semiconductor Corporation  
Document Number: 38-05513 Rev. *M  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised June 25, 2013  

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