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CY7C1351B

更新时间: 2024-11-25 23:45:27
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16页 272K
描述
Memory

CY7C1351B 数据手册

 浏览型号CY7C1351B的Datasheet PDF文件第2页浏览型号CY7C1351B的Datasheet PDF文件第3页浏览型号CY7C1351B的Datasheet PDF文件第4页浏览型号CY7C1351B的Datasheet PDF文件第5页浏览型号CY7C1351B的Datasheet PDF文件第6页浏览型号CY7C1351B的Datasheet PDF文件第7页 
351B  
PRELIMINARY  
CY7C1351B  
128Kx36 Flow-Through SRAM with NoBL™ Architecture  
Features  
Functional Description  
Pincompatible andfunctionallyequivalenttoZBT™ de-  
The CY7C1351B is a 3.3V, 128K by 36 Synchronous  
Flow-Through Burst SRAM designed specifically to support  
unlimited true back-to-back Read/Write operations without the  
insertion of wait states. The CY7C1351B is equipped with the  
advanced No Bus Latency(NoBL) logic required to en-  
able consecutive Read/Write operations with data being trans-  
ferred on every clock cycle. This feature dramatically improves  
the throughput of data through the SRAM, especially in sys-  
tems that require frequent Write/Read transitions. The  
CY7C1351B is pin/functionally compatible to ZBT SRAMs  
IDT71V547, MT55L128L36F, and MCM63Z737.  
vices IDT71V547, MT55L128L36F, and MCM63Z737  
• Supports 66-MHz bus operations with zero wait states  
— Data is transferred on every clock  
• Internally self-timed output buffer control to eliminate  
the need to use OE  
• Registered inputs for Flow-Through operation  
• Byte Write capability  
• 128K x 36 common I/O architecture  
• Single 3.3V power supply  
All synchronous inputs pass through input registers controlled  
by the rising edge of the clock.The clock input is qualified by  
the Clock Enable (CEN) signal, which, when deasserted, sus-  
pends operation and extends the previous clock cycle. Maxi-  
mum access delay from the clock rise is 7.5 ns (117-MHz  
device).  
• Fast clock-to-output times  
— 7.5 ns (for 117-MHz device)  
— 8.5 ns (for 100-MHz device)  
— 11.0 ns (for 66-MHz device)  
— 12.0 ns (for 50-MHz device)  
Write operations are controlled by the four Byte Write Select  
(BWS[3:0]) and a Write Enable (WE) input. All writes are con-  
ducted with on-chip synchronous self-timed write circuitry.  
— 14.0 ns (for 40-MHz device)  
• Clock Enable (CEN) pin to suspend operation  
• Synchronous self-timed writes  
• Asynchronous Output Enable  
• Standard 100 TQFP and 119 BGA packages  
• Burst Capability—linear or interleaved burst order  
Low standby power  
Three synchronous Chip Enables (CE1, CE2, CE3) and an  
asynchronous Output Enable (OE) provide for easy bank se-  
lection and output three-state control. In order to avoid bus  
contention, the output drivers are synchronously three-stated  
during the data portion of a write sequence.  
Logic Block Diagram  
36  
D
CLK  
Data-In REG.  
CE  
Q
36  
ADV/LD  
17  
A
[16:0]  
CEN  
CONTROL  
and WRITE  
LOGIC  
36  
128KX36  
CE  
1
CE  
2
MEMORY  
DQ  
ARRAY  
[31:0]  
CE  
3
17  
DP  
WE  
[3:0]  
BWS  
[3:0]  
Mode  
OE  
.
Selection Guide  
7C1351B-117 7C1351B-100 7C1351B-66 7C1351B-50 7C1351B-40  
Maximum Access Time (ns)  
7.5  
8.5  
11.0  
12.0  
14.0  
Maximum Operating Current  
(mA)  
Commercial  
Commercial  
375 mA  
350 mA  
250 mA  
200 mA  
175 mA  
Maximum CMOS Standby  
Current (mA)  
5 mA  
5 mA  
5 mA  
5 mA  
5 mA  
Cypress Semiconductor Corporation  
Document #: 38-05208 Rev. *A  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Revised November 19, 2002  

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