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CY7C1350-80AC PDF预览

CY7C1350-80AC

更新时间: 2024-11-25 14:48:43
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 时钟静态存储器内存集成电路
页数 文件大小 规格书
13页 185K
描述
ZBT SRAM, 128KX36, 7ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

CY7C1350-80AC 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
针数:100Reach Compliance Code:not_compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.77最长访问时间:7 ns
最大时钟频率 (fCLK):80 MHzI/O 类型:COMMON
JESD-30 代码:R-PQFP-G100JESD-609代码:e0
长度:20 mm内存密度:4718592 bit
内存集成电路类型:ZBT SRAM内存宽度:36
湿度敏感等级:3功能数量:1
端子数量:100字数:131072 words
字数代码:128000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:128KX36输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装等效代码:QFP100,.63X.87封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):225电源:3.3 V
认证状态:Not Qualified座面最大高度:1.6 mm
最大待机电流:0.025 A最小待机电流:3.14 V
子类别:SRAMs最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
宽度:14 mmBase Number Matches:1

CY7C1350-80AC 数据手册

 浏览型号CY7C1350-80AC的Datasheet PDF文件第2页浏览型号CY7C1350-80AC的Datasheet PDF文件第3页浏览型号CY7C1350-80AC的Datasheet PDF文件第4页浏览型号CY7C1350-80AC的Datasheet PDF文件第5页浏览型号CY7C1350-80AC的Datasheet PDF文件第6页浏览型号CY7C1350-80AC的Datasheet PDF文件第7页 
CY7C1350  
128Kx36 Pipelined SRAM with NoBL™ Architecture  
Features  
Functional Description  
• Pin compatible and functionally equivalent to ZBT™ de-  
vices IDT71V546, MT55L128L36P, and MCM63Z736  
• Supports 143-MHz bus operations with zero wait states  
— Data is transferred on every clock  
The CY7C1350 is a 3.3V, 128K by 36 synchronous-pipelined  
Burst SRAM designed specifically to support unlimited true  
back-to-back Read/Write operations without the insertion of  
wait states. The CY7C1350 is equipped with the advanced No  
Bus Latency™ (NoBL™) logic required to enable consecutive  
Read/Write operations with data being transferred on every  
clock cycle. This feature dramatically improves the throughput  
of the SRAM, especially in systems that require frequent  
Write/Read transitions. The CY7C1350 is pin/functionally  
compatible to ZBT™ SRAMs IDT71V546, MT55L128L36P,  
and MCM63Z736.  
• Internally self-timed output buffer control to eliminate  
the need to use OE  
• Fully registered (inputs and outputs) for pipelined  
operation  
• Byte Write capability  
• 128K x 36 common I/O architecture  
• Single 3.3V power supply  
• Fast clock-to-output times  
— 4.0 ns (for 143-MHz device)  
All synchronous inputs pass through input registers controlled  
by the rising edge of the clock. All data outputs pass through  
output registers controlled by the rising edge of the clock. The  
clock input is qualified by the Clock Enable (CEN) signal, which  
when deasserted suspends operation and extends the previ-  
ous clock cycle. Maximum access delay from the clock rise is  
4.0 ns (143-MHz device).  
— 4.2 ns (for 133-MHz device)  
— 5.0 ns (for 100-MHz device)  
— 7.0 ns (for 80-MHz device)  
Write operations are controlled by the four Byte Write Select  
• Clock Enable (CEN) pin to suspend operation  
• Synchronous self-timed writes  
• Asynchronous output enable  
• JEDEC-standard 100 TQFP package  
• Burst Capability — linear or interleaved burst order  
• Low standby power (17.325 mW max.)  
(BWS  
) and a Write Enable (WE) input. All writes are con-  
[3:0]  
ducted with on-chip synchronous self-timed write circuitry.  
Three synchronous Chip Enables (CE , CE , CE ) and an  
1
2
3
asynchronous Output Enable (OE) provide for easy bank se-  
lection and output three-state control. In order to avoid bus  
contention, the output drivers are synchronously three-stated  
during the data portion of a write sequence.  
Logic Block Diagram  
36  
D
CLK  
Data-In REG.  
CE  
Q
36  
ADV/LD  
17  
A[16:0]  
CEN  
CE  
CONTROL  
and WRITE  
LOGIC  
36  
128Kx36  
1
CE  
MEMORY  
2
DQ[31:0]  
DP[3:0]  
CE  
ARRAY  
36  
17  
3
WE  
BWS[3:0]  
MODE  
OE  
.
Selection Guide  
7C1350-143  
7C1350-133  
7C1350-100  
7C1350-80  
Maximum Access Time (ns)  
4.0  
450  
5
4.2  
400  
5
5.0  
350  
5
7.0  
300  
5
Maximum Operating Current (mA)  
Maximum CMOS Standby Current (mA)  
Commercial  
Commercial  
NoBLand No Bus Latency are trademarks of Cypress Semiconductor Corporation.  
ZBT is a trademark of Integrated Device Technology.  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
August 9, 1999  

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