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CY7C1246V18-300BZC PDF预览

CY7C1246V18-300BZC

更新时间: 2024-11-24 05:09:31
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器双倍数据速率
页数 文件大小 规格书
27页 1241K
描述
36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency)

CY7C1246V18-300BZC 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:BGA
包装说明:15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165针数:165
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.92
最长访问时间:0.45 ns其他特性:PIPELINED ARCHITECTURE
最大时钟频率 (fCLK):300 MHzI/O 类型:COMMON
JESD-30 代码:R-PBGA-B165JESD-609代码:e0
长度:17 mm内存密度:33554432 bit
内存集成电路类型:DDR SRAM内存宽度:8
湿度敏感等级:3功能数量:1
端子数量:165字数:4194304 words
字数代码:4000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:4MX8输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LBGA
封装等效代码:BGA165,11X15,40封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):220电源:1.5/1.8,1.8 V
认证状态:Not Qualified座面最大高度:1.4 mm
最大待机电流:0.29 A最小待机电流:1.7 V
子类别:SRAMs最大压摆率:1 mA
最大供电电压 (Vsup):1.9 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:TIN LEAD端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:15 mm
Base Number Matches:1

CY7C1246V18-300BZC 数据手册

 浏览型号CY7C1246V18-300BZC的Datasheet PDF文件第2页浏览型号CY7C1246V18-300BZC的Datasheet PDF文件第3页浏览型号CY7C1246V18-300BZC的Datasheet PDF文件第4页浏览型号CY7C1246V18-300BZC的Datasheet PDF文件第5页浏览型号CY7C1246V18-300BZC的Datasheet PDF文件第6页浏览型号CY7C1246V18-300BZC的Datasheet PDF文件第7页 
CY7C1246V18  
CY7C1257V18  
CY7C1248V18  
CY7C1250V18  
36-Mbit DDR-II+ SRAM 2-Word  
Burst Architecture (2.0 Cycle Read Latency)  
Functional Description  
Features  
• 36-Mbit density (4M x 8, 4M x 9, 2M x 18, 1M x 36)  
• 300 MHz to 375 MHz clock for high bandwidth  
• 2-Word burst for reducing address bus frequency  
The CY7C1246V18, CY7C1257V18, CY7C1248V18, and  
CY7C1250V18 are 1.8V Synchronous Pipelined SRAM  
equipped with DDR-II+ architecture. The DDR-II+ consists of  
an SRAM core with advanced synchronous peripheral  
circuitry. Addresses for read and write are latched on alternate  
rising edges of the input (K) clock. Write data is registered on  
the rising edges of both K and K. Read data is driven on the  
rising edges of both K and K. Each address location is  
associated with two 8-bit words (CY7C1246V18), 9-bit words  
(CY7C1257V18), 18-bit words (CY7C1248V18), or 36-bit  
words (CY7C1250V18) that burst sequentially into or out of the  
device.  
• Double Data Rate (DDR) interfaces  
(data transferred at 750 MHz) @ 375 MHz  
• Read latency of 2.0 clock cycles  
• Two input clocks (K and K) for precise DDR timing  
— SRAM uses rising edges only  
• Echo clocks (CQ and CQ) simplify data capture in high  
speed systems  
Asynchronous inputs include output impedance matching  
input (ZQ). Synchronous data outputs (Q, which share the  
same physical pins with the data inputs, D) are tightly matched  
to the two output echo clocks CQ/CQ, eliminating the need to  
capture data separately from individual DDR SRAMs in the  
system design.  
• Data valid pin (QVLD) to indicate valid data on the output  
• Synchronous internally self-timed writes  
[1]  
• Core VDD = 1.8V ± 0.1V; IO VDDQ = 1.4V to VDD  
• HSTL inputs and variable drive HSTL output buffers  
• Available in 165-ball FBGA package (15 x 17 x 1.4 mm)  
• Offered in both in Pb-free and non Pb-free packages  
• JTAG 1149.1 compatible test access port  
All synchronous inputs pass through input registers controlled  
by the K or K input clocks. All data outputs pass through output  
registers controlled by the K or K input clocks. Writes are  
conducted with on-chip synchronous self-timed write circuitry.  
• Delay Lock Loop (DLL) for accurate data placement  
Configurations  
With Read Cycle Latency of 2.0 cycles:  
CY7C1246V18 – 4M x 8  
CY7C1257V18 – 4M x 9  
CY7C1248V18 – 2M x 18  
CY7C1250V18 – 1M x 36  
Selection Guide  
375 MHz  
333 MHz  
333  
300 MHz  
300  
Unit  
MHz  
mA  
Maximum Operating Frequency  
Maximum Operating Current  
375  
1210  
1080  
1000  
Note  
1. The QDR consortium specification for V  
is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting  
DDQ  
V
= 1.4V to V  
.
DDQ  
DD  
Cypress Semiconductor Corporation  
Document Number: 001-06348 Rev. *C  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised May 15, 2007  
[+] Feedback  

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