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CY7C12461KV18 PDF预览

CY7C12461KV18

更新时间: 2024-11-27 09:43:39
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赛普拉斯 - CYPRESS 静态存储器双倍数据速率
页数 文件大小 规格书
29页 864K
描述
36-Mbit DDR II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency)

CY7C12461KV18 数据手册

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CY7C12461KV18, CY7C12571KV18  
CY7C12481KV18, CY7C12501KV18  
36-Mbit DDR II+ SRAM 2-Word Burst  
Architecture (2.0 Cycle Read Latency)  
36-Mbit DDR II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency)  
Features  
Functional Description  
36-Mbit Density (4M x 8, 4M x 9, 2M x 18, 1M x 36)  
450 MHz Clock for High Bandwidth  
The CY7C12461KV18, CY7C12571KV18, CY7C12481KV18,  
and CY7C12501KV18 are 1.8V Synchronous Pipelined SRAMs  
equipped with DDR II+ architecture. The DDR II+ consists of an  
SRAM core with advanced synchronous peripheral circuitry.  
Addresses for read and write are latched on alternate rising  
edges of the input (K) clock. Write data is registered on the rising  
edges of both K and K. Read data is driven on the rising edges  
of K and K. Each address location is associated with two 8-bit  
words (CY7C12461KV18), 9-bit words (CY7C12571KV18),  
2-word Burst for reducing Address Bus Frequency  
Double Data Rate (DDR) Interfaces  
(data transferred at 900 MHz) at 450 MHz  
Available in 2.0 Clock Cycle Latency  
Two Input Clocks (K and K) for precise DDR Timing  
SRAM uses rising edges only  
18-bit  
words  
(CY7C12481KV18),  
or  
36-bit  
words  
(CY7C12501KV18) that burst sequentially into or out of the  
device.  
Echo Clocks (CQ and CQ) simplify Data Capture in High Speed  
Systems  
Asynchronous inputs include an output impedance matching  
input (ZQ). Synchronous data outputs (Q, sharing the same  
physical pins as the data inputs D) are tightly matched to the two  
output echo clocks CQ/CQ, eliminating the need for separately  
capturing data from each individual DDR SRAM in the system  
design.  
Data Valid Pin (QVLD) to indicate Valid Data on the Output  
Synchronous Internally Self Timed Writes  
DDR II+ operates with 2.0 Cycle Read Latency when DOFF is  
asserted HIGH  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the K or K input clocks. Writes are  
conducted with on-chip synchronous self-timed write circuitry.  
Operates similar to DDR I Device with 1 Cycle Read Latency  
when DOFF is asserted LOW  
[1]  
Core VDD = 1.8V ± 0.1V; I/O VDDQ = 1.4V to VDD  
Supports both 1.5V and 1.8V I/O supply  
These devices are down bonded from the 65nm 72M  
QDRII+/DDRII+ devices and hence have the same IDD/ISB1  
values and the same JTAG ID code as the equivalent 72M device  
options. For details refer to the application note AN53189, 65nm  
Technology InterimQDRII+/DDRII+ SRAM device family  
description.  
HSTL Inputs and Variable Drive HSTL Output Buffers  
Available in 165-Ball FBGA Package (13 x 15 x 1.4 mm)  
Offered in both Pb-free and non Pb-free Packages  
JTAG 1149.1 Compatible Test Access Port  
Table 1. Selection Guide  
450 400 375 333  
Description  
Unit  
Phase Locked Loop (PLL) for Accurate Data Placement  
MHz MHz MHz MHz  
Max Operating Frequency  
Max Operating Current  
450 400 375 333 MHz  
x8 630 580 550 510 mA  
x9 630 580 550 510  
Configurations  
With Read Cycle Latency of 2.0 cycles:  
CY7C12461KV18 – 4M x 8  
x18 650 590 570 520  
x36 820 750 710 640  
CY7C12571KV18 – 4M x 9  
CY7C12481KV18 – 2M x 18  
CY7C12501KV18 – 1M x 36  
Note  
1. The Cypress QDR II+ devices surpass the QDR consortium specification and can support V  
= 1.4V to V  
.
DDQ  
DD  
Cypress Semiconductor Corporation  
Document Number: 001-53194 Rev. *I  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised January 31, 2011  
[+] Feedback  

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