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CY7C12431KV18 PDF预览

CY7C12431KV18

更新时间: 2024-09-18 09:43:39
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
29页 863K
描述
36-Mbit QDR? II+ SRAM 4-Word Burst Architecture (2.0 Cycle Read Latency)

CY7C12431KV18 数据手册

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CY7C12411KV18, CY7C12561KV18  
CY7C12431KV18, CY7C12451KV18  
36-Mbit QDR® II+ SRAM 4-Word Burst  
Architecture (2.0 Cycle Read Latency)  
36-Mbit QDR® II+ SRAM 4-Word Burst Architecture (2.0 Cycle Read Latency)  
Features  
Functional Description  
Separate Independent Read and Write Data Ports  
Supports concurrent transactions  
The CY7C12411KV18, CY7C12561KV18, CY7C12431KV18,  
and CY7C12451KV18 are 1.8V Synchronous Pipelined SRAMs,  
equipped with QDR II+ architecture. Similar to QDR II  
architecture, QDR II+ architecture consists of two separate ports:  
the read port and the write port to access the memory array. The  
read port has dedicated data outputs to support read operations  
and the write port has dedicated data inputs to support write  
operations. QDR II+ architecture has separate data inputs and  
data outputs to eliminate the need to “turnaround” the data bus  
that exists with common I/O devices. Each port is accessed  
through a common address bus. Addresses for read and write  
addresses are latched on alternate rising edges of the input (K)  
clock. Accesses to the QDR II+ read and write ports are  
completely independent of one another. To maximize data  
throughput, both read and write ports are equipped with DDR  
interfaces. Each address location is associated with four 8-bit  
words (CY7C12411KV18), 9-bit words (CY7C12561KV18),  
450 MHz Clock for High Bandwidth  
4-word Burst for Reducing Address Bus Frequency  
Double Data Rate (DDR) Interfaces on both Read and Write  
Ports (Data transferred at 900 MHz) at 450 MHz  
Available in 2.0 Clock Cycle Latency  
Two Input Clocks (K and K) for Precise DDR Timing  
SRAM uses rising edges only  
Echo Clocks (CQ and CQ) simplify Data Capture in High Speed  
Systems  
Data Valid Pin (QVLD) to indicate Valid Data on the Output  
Single Multiplexed Address Input Bus Latches Address Inputs  
for Read and Write Ports  
18-bit  
words  
(CY7C12431KV18),  
or  
36-bit  
words  
(CY7C12451KV18) that burst sequentially into or out of the  
device. Because data is transferred into and out of the device on  
every rising edge of both input clocks (K and K), memory  
bandwidth is maximized while simplifying system design by  
eliminating bus “turnarounds”.  
Separate Port Selects for Depth Expansion  
Synchronous Internally Self Timed Writes  
QDR® II+ operates with 2.0 Cycle Read Latency when DOFF  
is asserted HIGH  
Depth expansion is accomplished with port selects, which  
enables each port to operate independently.  
Operates similar to QDR-I Device with 1 Cycle Read Latency  
when DOFF is asserted LOW  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the K or K input clocks. Writes are  
conducted with on-chip synchronous self-timed write circuitry.  
Available in x8, x9, x18, and x36 Configurations  
Full Data Coherency, providing most Current Data  
These devices are down bonded from the 65nm 72M  
QDRII+/DDRII+ devices and hence have the same IDD/ISB1  
values and the same JTAG ID code as the equivalent 72M device  
options. For details refer to the application note AN53189, 65nm  
Technology InterimQDRII+/DDRII+ SRAM device family  
description.  
[1]  
Core VDD = 1.8V± 0.1V; I/O VDDQ = 1.4V to VDD  
Supports both 1.5V and 1.8V I/O supply  
HSTL Inputs and Variable Drive HSTL Output Buffers  
Available in 165-Ball FBGA Package (13 x 15 x 1.4 mm)  
Offered in both Pb-free and non Pb-free Packages  
Table 1. Selection Guide  
450 400 375 333  
JTAG 1149.1 Compatible Test Access Port  
Description  
Unit  
Phase Locked Loop (PLL) for Accurate Data Placement  
MHz MHz MHz MHz  
Max Operating Frequency  
Max Operating Current  
450 400 375 333 MHz  
x8 760 690 660 600 mA  
x9 760 690 660 600  
Configurations  
With Read Cycle Latency of 2.0 cycles:  
CY7C12411KV18 – 4M x 8  
x18 780 710 680 620  
x36 1100 1000 950 850  
CY7C12561KV18 – 4M x 9  
CY7C12431KV18 – 2M x 18  
CY7C12451KV18 – 1M x 36  
Note  
1. The Cypress QDR II+ devices surpass the QDR consortium specification and can support V  
= 1.4V to V  
.
DD  
DDQ  
Cypress Semiconductor Corporation  
Document Number: 001-53192 Rev. *E  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised January 31, 2011  
[+] Feedback  

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