CY7C11661KV18, CY7C11771KV18
CY7C11681KV18, CY7C11701KV18
18-Mbit DDR II+ SRAM Two-Word Burst
Architecture (2.5 Cycle Read Latency)
18-Mbit DDR II+ SRAM Two-Burst Architecture (2.5 Cycle Read Latency)
Features
Functional Description
■ 18-Mbit density (2 M × 8, 2 M × 9, 1 M × 18, 512 K × 36)
■ 550 MHz clock for high bandwidth
The CY7C11661KV18, CY7C11771KV18, CY7C11681KV18,
and CY7C11701KV18 are 1.8 V Synchronous Pipelined SRAMs
equipped with DDR II+ architecture. The DDR II+ consists of an
SRAM core with advanced synchronous peripheral circuitry.
Addresses for read and write are latched on alternate rising
edges of the input (K) clock. Write data is registered on the rising
edges of both K and K. Read data is driven on the rising edges
of K and K. Each address location is associated with two 8-bit
words (CY7C11661KV18), 9-bit words (CY7C11771KV18),
■ 2-word burst for reducing address bus frequency
■ Double data rate (DDR) interfaces
(data transferred at 1100 MHz) at 550 MHz
■ Available in 2.5 clock cycle latency
■ Two input clocks (K and K) for precise DDR timing
❐ SRAM uses rising edges only
18-bit
words
(CY7C11681KV18),
or
36-bit
words
(CY7C11701KV18) that burst sequentially into or out of the
device.
■ Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Asynchronous inputs include an output impedance matching
input (ZQ). Synchronous data outputs (Q, sharing the same
physical pins as the data inputs D) are tightly matched to the two
output echo clocks CQ/CQ, eliminating the need for separately
capturing data from each individual DDR SRAM in the system
design.
■ Data valid pin (QVLD) to indicate valid data on the output
■ Synchronous internally self-timed writes
■ DDR II+ operates with 2.5 cycle read latency when DOFF is
asserted HIGH
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the K or K input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
■ OperatessimilartoDDRIdevicewith1cyclereadlatencywhen
DOFF is asserted LOW
[1]
■ Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4 V to VDD
❐ Supports both 1.5 V and 1.8 V I/O supply
Table 1. Selection Guide
550 500 450 400
Description
Unit
■ HSTL inputs and variable drive HSTL output buffers
■ Available in 165-Ball FBGA package (13 × 15 × 1.4 mm)
■ Offered in both Pb-free and non Pb-free packages
■ JTAG 1149.1 compatible test access port
MHz MHz MHz MHz
Maximum operating
frequency
550 500 450 400 MHz
Maximum operating
current
x8 740 690 630 580 mA
x9 740 690 630 580
x18 760 700 650 590
x36 970 890 820 750
■ Phase-locked loop (PLL) for accurate data placement
Configurations
With Read cycle latency of 2.5 cycles:
CY7C11661KV18 – 2 M × 8
CY7C11771KV18 – 2 M × 9
CY7C11681KV18 – 1 M × 18
CY7C11701KV18 – 512 K × 36
Note
1. The Cypress QDR II+ devices surpass the QDR consortium specification and can support V
= 1.4 V to V
.
DD
DDQ
Cypress Semiconductor Corporation
Document Number: 001-53199 Rev. *I
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised January 31, 2011
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