Datasheet > CY7C1165KV18-400BZC

CY7C1165KV18-400BZC

更新时间： 2024-11-07 09:43:39

品牌	Logo	应用领域
赛普拉斯 - CYPRESS		静态存储器
页数	文件大小	规格书
29页	859K
描述
18-Mbit QDR? II+ SRAM Four-Word Burst Architecture (2.5 Cycle Read Latency)

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CY7C1165KV18-400BZC 技术参数

是否Rohs认证：	不符合	生命周期：	Active
包装说明：	LBGA, BGA165,11X15,40	Reach Compliance Code：	compliant
ECCN代码：	3A991.B.2.A	HTS代码：	8542.32.00.41
Factory Lead Time：	1 week	风险等级：	1.94
最长访问时间：	0.45 ns	其他特性：	PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)：	400 MHz	I/O 类型：	SEPARATE
JESD-30 代码：	R-PBGA-B165	JESD-609代码：	e0
长度：	15 mm	内存密度：	18874368 bit
内存集成电路类型：	QDR SRAM	内存宽度：	36
湿度敏感等级：	3	功能数量：	1
端子数量：	165	字数：	524288 words
字数代码：	512000	工作模式：	SYNCHRONOUS
最高工作温度：	70 °C	最低工作温度：
组织：	512KX36	输出特性：	3-STATE
封装主体材料：	PLASTIC/EPOXY	封装代码：	LBGA
封装等效代码：	BGA165,11X15,40	封装形状：	RECTANGULAR
封装形式：	GRID ARRAY, LOW PROFILE	并行/串行：	PARALLEL
峰值回流温度（摄氏度）：	235	电源：	1.5/1.8,1.8 V
认证状态：	Not Qualified	座面最大高度：	1.4 mm
最大待机电流：	0.29 A	最小待机电流：	1.7 V
子类别：	SRAMs	最大压摆率：	0.85 mA
最大供电电压 (Vsup)：	1.9 V	最小供电电压 (Vsup)：	1.7 V
标称供电电压 (Vsup)：	1.8 V	表面贴装：	YES
技术：	CMOS	温度等级：	COMMERCIAL
端子面层：	Tin/Lead (Sn/Pb)	端子形式：	BALL
端子节距：	1 mm	端子位置：	BOTTOM
处于峰值回流温度下的最长时间：	20	宽度：	13 mm
Base Number Matches：	1

CY7C1165KV18-400BZC 数据手册

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CY7C1161KV18, CY7C1176KV18

CY7C1163KV18, CY7C1165KV18

18-Mbit QDR^®II+ SRAM Four-Word Burst

Architecture (2.5 Cycle Read Latency)

Features

Configurations

■ Separate independent read and write data ports

❐ Supports concurrent transactions

With Read Cycle Latency of 2.5 cycles:

CY7C1161KV18 – 2 M x 8

■ 550-MHz clock for high bandwidth

CY7C1176KV18 – 2 M x 9

■ Four-word burst for reducing address bus frequency

CY7C1163KV18 – 1 M x 18

CY7C1165KV18 – 512 K x 36

■ Double data rate (DDR) interfaces on both read and write ports

(data transferred at 1100 MHz) at 550 MHz

Functional Description

■ Available in 2.5 clock cycle latency

The CY7C1161KV18, CY7C1176KV18, CY7C1163KV18, and

CY7C1165KV18 are 1.8 V Synchronous Pipelined SRAMs,

equipped with QDR II+ architecture. Similar to QDR II

■ Two input clocks (K and K) for precise DDR timing

❐ SRAM uses rising edges only

■ Echo clocks (CQ and CQ) simplify data capture in high speed

architecture, QDR II+ architecture consists of two separate ports:

the read port and the write port to access the memory array. The

read port has dedicated data outputs to support read operations

and the write port has dedicated data inputs to support write

operations. QDR II+ architecture has separate data inputs and

data outputs to completely eliminate the need to ‘turnaround’ the

data bus that exists with common I/O devices. Each port is

accessed through a common address bus. Addresses for read

and write addresses are latched on alternate rising edges of the

input (K) clock. Accesses to the QDR II+ read and write ports are

completely independent of one another. To maximize data

throughput, both read and write ports are equipped with DDR

interfaces. Each address location is associated with four 8-bit

words (CY7C1161KV18), 9-bit words (CY7C1176KV18), 18-bit

words (CY7C1163KV18), or 36-bit words (CY7C1165KV18) that

burst sequentially into or out of the device. Because data is

transferred into and out of the device on every rising edge of both

input clocks (K and K), memory bandwidth is maximized while

simplifying system design by eliminating bus ‘turnarounds’.

systems

■ Data valid pin (QVLD) to indicate valid data on the output

■ Single multiplexed address input bus latches address inputs

for read and write ports

■ Separate port selects for depth expansion

■ Synchronous internally self-timed writes

■ QDR^®II+ operates with 2.5 cycle read latency when DOFF is

asserted HIGH

■ Operates similar to QDR I device with one cycle read latency

when DOFF is asserted LOW

■ Available in x8, x9, x18, and x36 configurations

■ Full data coherency, providing most current data

[1]

■ Core V_DD= 1.8 V± 0.1 V; I/O V_DDQ= 1.4 V to V_DD

❐ Supports both 1.5 V and 1.8 V I/O supply

■ HSTL inputs and variable drive HSTL output buffers

■ Available in 165-ball FBGA package (13 x 15 x 1.4 mm)

■ Offered in both Pb-free and non Pb-free packages

■ JTAG 1149.1 compatible test access port

Depth expansion is accomplished with port selects, which

enables each port to operate independently.

All synchronous inputs pass through input registers controlled by

the K or K input clocks. All data outputs pass through output

registers controlled by the K or K input clocks. Writes are

conducted with on-chip synchronous self-timed write circuitry.

■ Phase-locked loop (PLL) for accurate data placement

Table 1. Selection Guide

Description

Maximum operating frequency

550 MHz

500 MHz

500

450 MHz

450

400 MHz

400

Unit

MHz

550

760

780

1100

Maximum operating current

710

650

600

710

650

600

x18

x36

720

670

610

1020

930

850

Note

1. The Cypress QDR II+ devices surpass the QDR consortium specification and can support V

= 1.4 V to V

DDQ

Cypress Semiconductor Corporation

Document Number: 001-58911 Rev. *C

•

198 Champion Court

•

San Jose, CA 95134-1709

•

408-943-2600

Revised February 24, 2011

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CY7C1165KV18-400BZC 替代型号

型号	品牌	替代类型	描述	数据表
CY7C1145KV18-400BZXC	CYPRESS	完全替代	18-Mbit QDRÂ® II SRAM Four-Word Burst Archite

与CY7C1165KV18-400BZC相关器件

型号	品牌	获取价格	描述	数据表
CY7C1165KV18-400BZXC	CYPRESS	获取价格	18-Mbit QDR? II+ SRAM Four-Word Burst Architecture (2.5 Cycle Read Latency)
CY7C1165KV18-400BZXC	INFINEON	获取价格	Synchronous SRAM
CY7C1165KV18-550BZC	CYPRESS	获取价格	18-Mbit QDR? II+ SRAM Four-Word Burst Architecture (2.5 Cycle Read Latency)
CY7C1165KV18-550BZC	INFINEON	获取价格	Synchronous SRAM
CY7C1165KV18-550BZXC	CYPRESS	获取价格	18-Mbit QDR? II+ SRAM Four-Word Burst Architecture (2.5 Cycle Read Latency)
CY7C1165V18	CYPRESS	获取价格	18-Mbit QDR⑩-II+ SRAM 4-Word Burst Architectu
CY7C1165V18-300BZC	CYPRESS	获取价格	18-Mbit QDR⑩-II+ SRAM 4-Word Burst Architectu
CY7C1165V18-300BZI	CYPRESS	获取价格	18-Mbit QDR⑩-II+ SRAM 4-Word Burst Architectu
CY7C1165V18-300BZXC	CYPRESS	获取价格	18-Mbit QDR⑩-II+ SRAM 4-Word Burst Architectu
CY7C1165V18-300BZXI	CYPRESS	获取价格	18-Mbit QDR⑩-II+ SRAM 4-Word Burst Architectu

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