CY7C109B
CY7C1009B
128K x 8 Static RAM
Features
Functional Description[1]
• High speed
The CY7C109B/CY7C1009B is a high-performance CMOS
static RAM organized as 131,072 words by 8 bits. Easy
memory expansion is provided by an active LOW Chip Enable
(CE1), an active HIGH Chip Enable (CE2), an active LOW
Output Enable (OE), and tri-state drivers. Writing to the device
is accomplished by taking Chip Enable One (CE1) and Write
Enable (WE) inputs LOW and Chip Enable Two (CE2) input
HIGH. Data on the eight I/O pins (I/O0 through I/O7) is then
written into the location specified on the address pins (A0
through A16).
— tAA = 12 ns
• Low active power
— 495 mW (max.)
• Low CMOS standby power
— 11 mW (max.) (L Version)
• 2.0V Data Retention
• Automatic power-down when deselected
• TTL-compatible inputs and outputs
• Easy memory expansion with CE1, CE2, and OE options
Reading from the device is accomplished by taking Chip
Enable One (CE1) and Output Enable (OE) LOW while forcing
Write Enable (WE) and Chip Enable Two (CE2) HIGH. Under
these conditions, the contents of the memory location
specified by the address pins will appear on the I/O pins.
• CY7C109B is available in standard 400-mil-wide SOJ
and 32-pin TSOP type I packages. The CY7C1009B is
available in a 300-mil-wide SOJ package
The eight input/output pins (I/O0 through I/O7) are placed in a
high-impedance state when the device is deselected (CE1
HIGH or CE2 LOW), the outputs are disabled (OE HIGH), or
during a write operation (CE1 LOW, CE2 HIGH, and WE LOW).
CY7C109B is available in standard 400-mil-wide SOJ and 32-
pin TSOP type I packages. The CY7C1009B is available in a
300-mil-wide SOJ package. The CY7C109B and CY7C1009B
are functionally equivalent in all other respects
Pin Configurations[2]
Logic Block Diagram
SOJ
Top View
V
NC
32
31
30
1
CC
A
16
A
15
CE
2
3
4
A
14
2
A
12
29
28
WE
5
A
7
A
6
A
5
A
A
A
13
8
27
26
6
7
9
25
24
23
22
21
A
A
8
9
10
11
12
13
A
4
3
11
I/O
0
OE
A
A
A
10
INPUT BUFFER
2
1
CE
I/O
I/O
1
7
6
I/O
I/O
A
I/O
1
0
0
A
0
20
19
A
1
I/O
I/O
GND
I/O
1
5
14
15
16
2
A
2
I/O
I/O
2
18
17
4
3
A
3
4
A
I/O
I/O
I/O
128K x 8
ARRAY
3
4
5
A
A
11
1
2
32
31
OE
5
6
A
A
A
A
9
8
10
3
4
5
6
7
8
30
29
28
27
26
25
24
23
22
21
20
19
18
17
CE
I/O
A
7
8
A
13
7
A
WE
I/O
I/O
I/O
I/O
6
5
CE
2
A
15
TSOP I
4
3
V
Top View
CC
I/O
6
7
NC
9
GND
(not to scale)
POWER
DOWN
COLUMN
DECODER
A
I/O
10
11
12
13
14
15
16
16
2
CE
2
WE
1
I/O
1
A
CE
14
A
I/O
I/O
12
0
A
A
0
7
A
A
6
1
A
2
OE
A
A
5
4
A
3
Note:
1. For guidelines on SRAM system design, please refer to the ‘System Design Guidelines’ Cypress application note, available on the internet at www.cypress.com.
2. NC pins are not connected on the die.
Cypress Semiconductor Corporation
Document #: 38-05038 Rev. *C
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised August 3, 2006