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CY7C1041CV33-15VXIT PDF预览

CY7C1041CV33-15VXIT

更新时间: 2024-12-02 06:27:15
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
14页 427K
描述
Standard SRAM, 256KX16, 15ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, SOJ-44

CY7C1041CV33-15VXIT 技术参数

生命周期:Obsolete零件包装代码:SOJ
包装说明:SOJ,针数:44
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.29
最长访问时间:15 nsJESD-30 代码:R-PDSO-J44
JESD-609代码:e4长度:28.575 mm
内存密度:4194304 bit内存集成电路类型:STANDARD SRAM
内存宽度:16功能数量:1
端子数量:44字数:262144 words
字数代码:256000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:256KX16封装主体材料:PLASTIC/EPOXY
封装代码:SOJ封装形状:RECTANGULAR
封装形式:SMALL OUTLINE并行/串行:PARALLEL
认证状态:Not Qualified座面最大高度:3.7592 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:NICKEL PALLADIUM GOLD端子形式:J BEND
端子节距:1.27 mm端子位置:DUAL
宽度:10.16 mm

CY7C1041CV33-15VXIT 数据手册

 浏览型号CY7C1041CV33-15VXIT的Datasheet PDF文件第2页浏览型号CY7C1041CV33-15VXIT的Datasheet PDF文件第3页浏览型号CY7C1041CV33-15VXIT的Datasheet PDF文件第4页浏览型号CY7C1041CV33-15VXIT的Datasheet PDF文件第5页浏览型号CY7C1041CV33-15VXIT的Datasheet PDF文件第6页浏览型号CY7C1041CV33-15VXIT的Datasheet PDF文件第7页 
CY7C1041CV33  
4-Mbit (256K x 16) Static RAM  
Features  
Functional Description  
Temperature ranges  
The CY7C1041CV33 is a high performance CMOS static RAM  
organized as 262,144 words by 16 bits.  
Commercial: 0°C to 70°C  
Industrial: –40°C to 85°C  
Automotive-A: –40°C to 85°C  
Automotive-E: –40°C to 125°C  
To write to the device, take Chip Enable (CE) and Write Enable  
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data  
from IO pins (IO0 through IO7), is written into the location  
specified on the address pins (A0 through A17). If Byte High  
Pin and function compatible with CY7C1041BV33  
Enable (BHE) is LOW, then data from IO pins (IO8 through IO15  
)
is written into the location specified on the address pins (A0  
through A17).  
High speed  
tAA = 10 ns (Commercial, Industrial and Automotive-A)  
tAA = 12 ns (Automotive-E)  
To read from the device, take Chip Enable (CE) and Output  
Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If  
Byte Low Enable (BLE) is LOW, then data from the memory  
location specified by the address pins appear on IO0 to IO7. If  
Byte High Enable (BHE) is LOW, then data from memory  
appears on IO8 to IO15. For more information, see the Truth  
Table on page 9 for a complete description of Read and Write  
modes.  
Low active power  
324 mW (max)  
2.0V data retention  
Automatic power down when deselected  
TTL-compatible inputs and outputs  
Easy memory expansion with CE and OE features  
The input and output pins (IO0 through IO15) are placed in a high  
impedance state when the device is deselected (CE HIGH), the  
outputs are disabled (OE HIGH), the BHE and BLE are disabled  
(BHE, BLE HIGH), or during a write operation (CE LOW and WE  
LOW).  
AvailableinPb-freeandnonPb-free44-pin400MilSOJ, 44-pin  
TSOP II and 48-Ball FBGA packages  
For best practice recommendations, refer to the Cypress  
application note AN1064, SRAM System Guidelines.  
Logic Block Diagram  
INPUT BUFFER  
A
A
0
1
A
A
A
A
2
3
4
5
256K x 16  
RAM Array  
IO –IO  
0
7
A
A
A
6
7
8
IO –IO  
8
15  
COLUMN DECODER  
BHE  
WE  
CE  
OE  
BLE  
Cypress Semiconductor Corporation  
Document Number: 38-05134 Rev. *I  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised February 14, 2008  
[+] Feedback  

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