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CY7C1041CV33-10BAXCT PDF预览

CY7C1041CV33-10BAXCT

更新时间: 2023-02-26 15:13:38
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
14页 427K
描述
Standard SRAM, 256KX16, 10ns, CMOS, PBGA48, 7 X 8.50 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-48

CY7C1041CV33-10BAXCT 数据手册

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CY7C1041CV33  
4-Mbit (256K x 16) Static RAM  
Features  
Functional Description  
Temperature ranges  
The CY7C1041CV33 is a high performance CMOS static RAM  
organized as 262,144 words by 16 bits.  
Commercial: 0°C to 70°C  
Industrial: –40°C to 85°C  
Automotive-A: –40°C to 85°C  
Automotive-E: –40°C to 125°C  
To write to the device, take Chip Enable (CE) and Write Enable  
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data  
from IO pins (IO0 through IO7), is written into the location  
specified on the address pins (A0 through A17). If Byte High  
Pin and function compatible with CY7C1041BV33  
Enable (BHE) is LOW, then data from IO pins (IO8 through IO15  
)
is written into the location specified on the address pins (A0  
through A17).  
High speed  
tAA = 10 ns (Commercial, Industrial and Automotive-A)  
tAA = 12 ns (Automotive-E)  
To read from the device, take Chip Enable (CE) and Output  
Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If  
Byte Low Enable (BLE) is LOW, then data from the memory  
location specified by the address pins appear on IO0 to IO7. If  
Byte High Enable (BHE) is LOW, then data from memory  
appears on IO8 to IO15. For more information, see the Truth  
Table on page 9 for a complete description of Read and Write  
modes.  
Low active power  
324 mW (max)  
2.0V data retention  
Automatic power down when deselected  
TTL-compatible inputs and outputs  
Easy memory expansion with CE and OE features  
The input and output pins (IO0 through IO15) are placed in a high  
impedance state when the device is deselected (CE HIGH), the  
outputs are disabled (OE HIGH), the BHE and BLE are disabled  
(BHE, BLE HIGH), or during a write operation (CE LOW and WE  
LOW).  
AvailableinPb-freeandnonPb-free44-pin400MilSOJ, 44-pin  
TSOP II and 48-Ball FBGA packages  
For best practice recommendations, refer to the Cypress  
application note AN1064, SRAM System Guidelines.  
Logic Block Diagram  
INPUT BUFFER  
A
A
0
1
A
A
A
A
2
3
4
5
256K x 16  
RAM Array  
IO –IO  
0
7
A
A
A
6
7
8
IO –IO  
8
15  
COLUMN DECODER  
BHE  
WE  
CE  
OE  
BLE  
Cypress Semiconductor Corporation  
Document Number: 38-05134 Rev. *I  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised February 14, 2008  
[+] Feedback  

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