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CY7C1019CV33-10ZXAT PDF预览

CY7C1019CV33-10ZXAT

更新时间: 2024-01-21 08:28:12
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
页数 文件大小 规格书
13页 442K
描述
1-Mbit (128 K × 8) Static RAM Center Power/Ground Pinout

CY7C1019CV33-10ZXAT 技术参数

生命周期:Obsolete零件包装代码:TSOP2
包装说明:TSOP2,针数:32
Reach Compliance Code:unknownECCN代码:3A991.B.2.B
HTS代码:8542.32.00.41风险等级:5.74
最长访问时间:10 nsJESD-30 代码:R-PDSO-G32
JESD-609代码:e3长度:20.95 mm
内存密度:1048576 bit内存集成电路类型:STANDARD SRAM
内存宽度:8功能数量:1
端子数量:32字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128KX8封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):3.63 V最小供电电压 (Vsup):2.97 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:TIN端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
宽度:10.16 mmBase Number Matches:1

CY7C1019CV33-10ZXAT 数据手册

 浏览型号CY7C1019CV33-10ZXAT的Datasheet PDF文件第2页浏览型号CY7C1019CV33-10ZXAT的Datasheet PDF文件第3页浏览型号CY7C1019CV33-10ZXAT的Datasheet PDF文件第4页浏览型号CY7C1019CV33-10ZXAT的Datasheet PDF文件第5页浏览型号CY7C1019CV33-10ZXAT的Datasheet PDF文件第6页浏览型号CY7C1019CV33-10ZXAT的Datasheet PDF文件第7页 
CY7C1019CV33  
1-Mbit (128 K × 8) Static RAM  
1-Mbit (128  
K × 8) Static RAM  
Features  
Functional Description  
Temperature Ranges  
Industrial: –40 °C to 85 °C  
Automotive-A: –40 °C to 85 °C  
The CY7C1019CV33 is a high performance CMOS static RAM  
organized as 131,072 words by 8 bits. Easy memory expansion  
is provided by an active LOW Chip Enable (CE), an active LOW  
Output Enable (OE), and tristate drivers. This device has an  
automatic power down feature that significantly reduces power  
consumption when deselected.  
Pin and Function compatible with CY7C1019BV33  
High Speed  
tAA = 10 ns  
Writing to the device is accomplished by taking Chip Enable (CE)  
and Write Enable (WE) inputs LOW. Data on the eight I/O pins  
(I/O0 through I/O7) is then written into the location specified on  
the address pins (A0 through A16).  
CMOS for optimum Speed and Power  
Data Retention at 2.0 V  
Reading from the device is accomplished by taking Chip Enable  
(CE) and Output Enable (OE) LOW while forcing Write Enable  
(WE) HIGH. Under these conditions, the contents of the memory  
location specified by the address pins will appear on the I/O pins.  
Center Power/Ground Pinout  
Automatic Power Down when deselected  
Easy Memory Expansion with CE and OE Options  
Available in Pb-free 32-pin TSOP II package  
The eight input/output pins (I/O0 through I/O7) are placed in a  
high impedance state when the device is deselected (CE HIGH),  
the outputs are disabled (OE HIGH), or during a write operation  
(CE LOW, and WE LOW).  
Logic Block Diagram  
I/O  
0
INPUT BUFFER  
I/O  
1
A
0
A
A
2
1
I/O  
2
A
3
A
I/O  
3
4
128K x 8  
ARRAY  
A
5
A
6
I/O  
4
A
7
A
8
I/O  
5
I/O  
6
POWER  
DOWN  
COLUMN  
DECODER  
CE  
I/O  
WE  
7
OE  
Cypress Semiconductor Corporation  
Document #: 38-05130 Rev. *K  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised June 8, 2011  
[+] Feedback  

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