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CY7C1011CV33-12AIT PDF预览

CY7C1011CV33-12AIT

更新时间: 2024-09-18 20:03:19
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器内存集成电路
页数 文件大小 规格书
11页 284K
描述
Standard SRAM, 128KX16, 12ns, CMOS, PQFP44, PLASTIC, TQFP-44

CY7C1011CV33-12AIT 技术参数

生命周期:Obsolete零件包装代码:QFP
包装说明:LQFP,针数:44
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41Factory Lead Time:1 week
风险等级:5.7最长访问时间:12 ns
JESD-30 代码:S-PQFP-G44JESD-609代码:e0
长度:10 mm内存密度:2097152 bit
内存集成电路类型:STANDARD SRAM内存宽度:16
功能数量:1端子数量:44
字数:131072 words字数代码:128000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:128KX16
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装形状:SQUARE封装形式:FLATPACK, LOW PROFILE
并行/串行:PARALLEL认证状态:Not Qualified
座面最大高度:1.6 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:TIN LEAD
端子形式:GULL WING端子节距:0.8 mm
端子位置:QUAD宽度:10 mm
Base Number Matches:1

CY7C1011CV33-12AIT 数据手册

 浏览型号CY7C1011CV33-12AIT的Datasheet PDF文件第2页浏览型号CY7C1011CV33-12AIT的Datasheet PDF文件第3页浏览型号CY7C1011CV33-12AIT的Datasheet PDF文件第4页浏览型号CY7C1011CV33-12AIT的Datasheet PDF文件第5页浏览型号CY7C1011CV33-12AIT的Datasheet PDF文件第6页浏览型号CY7C1011CV33-12AIT的Datasheet PDF文件第7页 
CY7C1011CV33  
128K x 16 Static RAM  
Writing to the device is accomplished by taking Chip Enable  
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable  
(BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is  
written into the location specified on the address pins (A0  
through A16). If Byte High Enable (BHE) is LOW, then data  
from I/O pins (I/O8 through I/O15) is written into the location  
specified on the address pins (A0 through A16).  
Features  
• Pin equivalent to CY7C1011BV33  
• High speed  
— tAA = 10 ns  
• Low active power  
Reading from the device is accomplished by taking Chip  
Enable (CE) and Output Enable (OE) LOW while forcing the  
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,  
then data from the memory location specified by the address  
pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is  
LOW, then data from memory will appear on I/O8 to I/O15. See  
the truth table at the back of this data sheet for a complete  
description of read and write modes.  
— 360 mW (max.)  
• Data Retention at 2.0  
• Automatic power-down when deselected  
• Independent control of upper and lower bits  
• Easy memory expansion with CE and OE features  
• Available in 44-pin TSOP II, 44-pin TQFP, and 48-ball  
VFBGA  
The input/output pins (I/O0 through I/O15) are placed in a  
high-impedance state when the device is deselected (CE  
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE  
are disabled (BHE, BLE HIGH), or during a write operation (CE  
LOW, and WE LOW).  
• Also available in Lead-Free 44-pin TSOP II and 44-pin  
TQFP packages  
Functional Description  
The CY7C1011CV33 is available in a standard 44-pin TSOP  
II package with center power and ground pinout, a 44-pin Thin  
Plastic Quad Flatpack (TQFP), as well as a 48-ball fine-pitch  
ball grid array (VFBGA) package.  
The CY7C1011CV33 is a high-performance CMOS Static  
RAM organized as 131,072 words by 16 bits.  
Logic Block Diagram  
Pin Configuration  
TSOP II  
Top View  
INPUT BUFFER  
44  
1
2
3
4
5
6
A
A
5
4
A
0
43  
42  
41  
40  
39  
38  
A
A
3
6
A
1
A
A
2
7
A
2
OE  
A
1
I/O0–I/O7  
256K x 16  
ARRAY  
A
3
BHE  
BLE  
I/O  
A
0
A
4
CE  
1024 x 4096  
A
I/O8–I/O15  
5
I/O  
7
0
15  
A
6
37  
36  
35  
34  
33  
I/O  
I/O  
8
I/O  
I/O  
1
2
14  
13  
12  
A
8
7
9
A
10  
11  
12  
13  
I/O  
V
SS  
I/O  
3
CC  
V
SS  
V
V
CC  
COLUMN  
DECODER  
32  
31  
30  
29  
28  
27  
I/O  
I/O  
I/O  
4
5
6
7
11  
10  
I/O  
I/O  
I/O  
14  
15  
16  
I/O  
9
8
I/O  
WE 17  
NC  
A
18  
19  
20  
21  
22  
16  
15  
A
BHE  
8
A
A
26  
25  
A
WE  
CE  
OE  
9
A
11  
14  
10  
A
A
12  
24  
23  
13  
BLE  
A
NC  
Cypress Semiconductor Corporation  
Document #: 38-05232 Rev. *C  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Revised June 30, 2005  

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