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CY7C1011BV33-10ZC PDF预览

CY7C1011BV33-10ZC

更新时间: 2024-09-18 21:12:43
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
11页 299K
描述
Standard SRAM, 128KX16, 10ns, CMOS, PDSO44, TSOP2-44

CY7C1011BV33-10ZC 技术参数

生命周期:Obsolete零件包装代码:TSOP2
包装说明:TSOP2,针数:44
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.73
最长访问时间:10 nsJESD-30 代码:R-PDSO-G44
长度:18.41 mm内存密度:2097152 bit
内存集成电路类型:STANDARD SRAM内存宽度:16
功能数量:1端子数量:44
字数:131072 words字数代码:128000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:128KX16
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
并行/串行:PARALLEL认证状态:Not Qualified
座面最大高度:1.2 mm最大供电电压 (Vsup):3.63 V
最小供电电压 (Vsup):2.97 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:0.8 mm端子位置:DUAL
宽度:10.16 mmBase Number Matches:1

CY7C1011BV33-10ZC 数据手册

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CY7C1011BV33  
ADVANCE INFORMATION  
128K x 16 Static RAM  
(BLE) is LOW, then data from I/O pins (I/O1 through I/O8), is  
written into the location specified on the address pins (A0  
through A15). If Byte High Enable (BHE) is LOW, then data  
from I/O pins (I/O9 through I/O16) is written into the location  
specified on the address pins (A0 through A15).  
April 25, 2001Features  
• 3.0 – 3.6V Operation  
• Ram 5 - 0.25µ Technology  
• High speed  
— tAA = 8, 10, 12, 15 ns  
Reading from the device is accomplished by taking Chip En-  
able (CE) and Output Enable (OE) LOW while forcing the Write  
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then  
data from the memory location specified by the address pins  
will appear on I/O1 to I/O8. If Byte High Enable (BHE) is LOW,  
then data from memory will appear on I/O9 to I/O16. See the  
truth table at the back of this data sheet for a complete descrip-  
tion of read and write modes.  
• CMOS for optimum speed/power  
• Low active power  
— 828 mW (Max.)  
• Automatic power-down when deselected  
• Independent control of upper and lower bits  
• Available in 44-pin TSOP II ,400-mil SOJ and 44 TQFP  
The input/output pins (I/O1 through I/O16) are placed in a  
high-impedance state when the device is deselected (CE  
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE  
are disabled (BHE, BLE HIGH), or during a write operation (CE  
LOW, and WE LOW).  
Functional Description  
The CY7C1011BV33 is a high-performance CMOS static  
RAM organized as 65,536 words by 16 bits. This device has  
an automatic power-down feature that significantly reduces  
power consumption when deselected.  
The CY7C1011BV33 is available in standard 44-pin TSOP  
Type II, 400-mil-wide SOJ and 44 TQFP packages.  
Writing to the device is accomplished by taking Chip Enable  
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable  
Logic Block Diagram  
DATA IN DRIVERS  
A
A
A
7
6
5
4
32K x 16  
A
A
A
I/O –I/O  
RAM Array  
512 X 2048  
1
8
3
2
1
0
I/O I/O  
9
16  
A
A
COLUMN DECODER  
BHE  
WE  
CE  
OE  
BLE  
1011B-1  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Document #: 38-05021 Rev. **  
Revised April 25, 2001  

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