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CY7C1006D-12VXI PDF预览

CY7C1006D-12VXI

更新时间: 2024-11-07 15:30:15
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
10页 143K
描述
Standard SRAM, 256KX4, 12ns, CMOS, PDSO28, 0.300 INCH, LEAD FREE, SOJ-28

CY7C1006D-12VXI 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOJ
包装说明:SOJ, SOJ28,.34针数:28
Reach Compliance Code:compliantECCN代码:3A991.B.2.B
HTS代码:8542.32.00.41风险等级:5.79
最长访问时间:12 nsI/O 类型:COMMON
JESD-30 代码:R-PDSO-J28JESD-609代码:e4
长度:17.907 mm内存密度:1048576 bit
内存集成电路类型:STANDARD SRAM内存宽度:4
湿度敏感等级:3功能数量:1
端子数量:28字数:262144 words
字数代码:256000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:256KX4输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:SOJ
封装等效代码:SOJ28,.34封装形状:RECTANGULAR
封装形式:SMALL OUTLINE并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:5 V
认证状态:Not Qualified座面最大高度:3.556 mm
最大待机电流:0.003 A最小待机电流:2 V
子类别:SRAMs最大压摆率:0.05 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:J BEND
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40宽度:7.5057 mm
Base Number Matches:1

CY7C1006D-12VXI 数据手册

 浏览型号CY7C1006D-12VXI的Datasheet PDF文件第2页浏览型号CY7C1006D-12VXI的Datasheet PDF文件第3页浏览型号CY7C1006D-12VXI的Datasheet PDF文件第4页浏览型号CY7C1006D-12VXI的Datasheet PDF文件第5页浏览型号CY7C1006D-12VXI的Datasheet PDF文件第6页浏览型号CY7C1006D-12VXI的Datasheet PDF文件第7页 
CY7C106D  
CY7C1006D  
PRELIMINARY  
1-Mbit (256K x 4) Static RAM  
Features  
Functional Description[1]  
The CY7C106D and CY7C1006D are high-performance  
CMOS static RAMs organized as 262,144 words by 4 bits.  
Easy memory expansion is provided by an active LOW Chip  
Enable (CE), an active LOW Output Enable (OE), and tri-state  
drivers. These devices have an automatic power-down feature  
that reduces power consumption by more than 65% when the  
devices are deselected.  
• Pin- and function-compatible with  
CY7C106B/CY7C1006B  
• High speed  
— tAA = 10 ns  
• CMOS for optimum speed/power  
• Low active power  
Writing to the devices is accomplished by taking Chip Enable  
(CE) and Write Enable (WE) inputs LOW. Data on the four I/O  
pins (I/O0 through I/O3) is then written into the location  
specified on the address pins (A0 through A17).  
— ICC = 60 mA @ 10 ns  
• Low CMOS standby power  
— ISB2 = 3.0 mA  
Reading from the devices is accomplished by taking Chip  
Enable (CE) and Output Enable (OE) LOW while forcing Write  
Enable (WE) HIGH. Under these conditions, the contents of  
the memory location specified by the address pins will appear  
on the four I/O pins.  
• Data Retention at 2.0V  
• Automatic power-down when deselected  
• TTL-compatible inputs and outputs  
• Available in Pb-Free packages  
The four input/output pins (I/O0 through I/O3) are placed in a  
high-impedance state when the devices are deselected (CE  
HIGH), the outputs are disabled (OE HIGH), or during a write  
operation (CE and WE LOW).  
The CY7C106D is available in a standard 400-mil-wide  
Pb-Free SOJ; the CY7C1006D is available in a standard  
300-mil-wide Pb-Free SOJ.  
Logic Block Diagram  
Pin Configuration  
SOJ  
Top View  
28  
27  
26  
1
2
3
4
5
6
A
1
V
CC  
0
A
A
17  
A
A
2
16  
A
25  
24  
A
3
15  
A
A
4
14  
23  
22  
A
A
5
13  
A
A
7
8
6
12  
INPUT BUFFER  
21  
20  
19  
18  
17  
A
A
7
11  
A
9
NC  
I/O  
8
A1  
10  
11  
12  
13  
A
9
10  
3
2
1
A2  
A3  
A4  
A5  
A6  
A7  
A8  
I/O3  
I/O2  
I/O1  
I/O0  
A
I/O  
I/O  
CE  
16  
15  
OE  
I/O  
0
512 x 512 x 4  
ARRAY  
14  
GND  
WE  
A9  
POWER  
DOWN  
COLUMN  
DECODER  
CE  
WE  
OE  
Note:  
1. For guidelines on SRAM system design, please refer to the ‘System Design Guidelines’ Cypress application note, available on the internet at www.cypress.com.  
Cypress Semiconductor Corporation  
Document #: 38-05459 Rev. *C  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Revised January 11, 2005  

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