5秒后页面跳转
CY62256V18L-200ZRC PDF预览

CY62256V18L-200ZRC

更新时间: 2024-02-28 20:10:58
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
12页 336K
描述
Standard SRAM, 32KX8, 200ns, CMOS, PDSO28, REVERSE, TSOP1-28

CY62256V18L-200ZRC 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:TSOP
包装说明:REVERSE, TSOP1-28针数:28
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.41风险等级:5.7
最长访问时间:200 ns其他特性:AUTOMATIC POWER-DOWN
I/O 类型:COMMONJESD-30 代码:R-PDSO-G28
JESD-609代码:e0长度:11.8 mm
内存密度:262144 bit内存集成电路类型:STANDARD SRAM
内存宽度:8功能数量:1
端子数量:28字数:32768 words
字数代码:32000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:32KX8输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP1-R
封装等效代码:TSSOP28,.53,22封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):240电源:1.8 V
认证状态:Not Qualified反向引出线:YES
座面最大高度:1.2 mm最大待机电流:0.00003 A
最小待机电流:1.4 V子类别:SRAMs
最大压摆率:0.017 mA最大供电电压 (Vsup):2 V
最小供电电压 (Vsup):1.6 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.55 mm
端子位置:DUAL处于峰值回流温度下的最长时间:30
宽度:8 mmBase Number Matches:1

CY62256V18L-200ZRC 数据手册

 浏览型号CY62256V18L-200ZRC的Datasheet PDF文件第2页浏览型号CY62256V18L-200ZRC的Datasheet PDF文件第3页浏览型号CY62256V18L-200ZRC的Datasheet PDF文件第4页浏览型号CY62256V18L-200ZRC的Datasheet PDF文件第5页浏览型号CY62256V18L-200ZRC的Datasheet PDF文件第6页浏览型号CY62256V18L-200ZRC的Datasheet PDF文件第7页 
fax id: 1069  
PRELIMINARY  
CY62256V  
32K x 8 Static RAM  
ers. These devices have an automatic power-down feature,  
reducing the power consumption by over 99% when deselect-  
ed. The CY62256V family is available in the standard  
450-mil-wide (300-mil body width) SOIC, TSOP, and reverse  
TSOP packages.  
Features  
• Low voltage range:  
2.7V 3.6V (62256V)  
2.3V 2.7V (62256V25)  
An active LOW write enable signal (WE) controls the writ-  
ing/reading operation of the memory. When CE and WE inputs  
1.6V 2.0V (62256V18)  
• Low active power and standby power  
• Easy memory expansion with CE and OE features  
• TTL-compatible inputs and outputs  
• Automatic power-down when deselected  
• CMOS for optimum speed/power  
are both LOW, data on the eight data input/output pins (I/O  
0
through I/O ) is written into the memory location addressed by  
7
the address present on the address pins (A through A ).  
0
14  
Reading the device is accomplished by selecting the device  
and enabling the outputs, CE and OE active LOW, while WE  
remains inactive or HIGH. Under these conditions, the con-  
tents of the location addressed by the information on address  
pins are present on the eight data input/output pins.  
Functional Description  
The input/output pins remain in a high-impedance state unless  
the chip is selected, outputs are enabled, and write enable  
(WE) is HIGH.  
The CY62256V family is composed of three high-performance  
CMOS static RAM’s organized as 32,768 words by 8 bits. Easy  
memory expansion is provided by an active LOW chip enable  
(CE) and active LOW output enable (OE) and three-state driv-  
Logic Block Diagram  
Pin Configurations  
SOIC  
Top View  
A
28  
27  
26  
25  
24  
V
CC  
WE  
1
2
3
4
5
6
7
8
5
A
6
7
A
A
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
4
3
0
1
2
3
4
5
6
A
A
INPUTBUFFER  
8
A
A
2
9
A
10  
A
11  
A
12  
A
13  
A
14  
23  
22  
A
A
A
A
8
1
10  
9
OE  
A
21  
20  
19  
18  
17  
0
A
CE  
I/O  
9
7
6
5
A
10  
11  
12  
13  
14  
512x512  
ARRAY  
7
A
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
6
5
4
0
1
2
A
A
A
4
3
16  
15  
2
GND  
3
C62256V–2  
CE  
POWER  
DOWN  
WE  
COLUMN  
DECODER  
I/O  
7
OE  
C62256V–1  
21  
A
A
A
A
A7  
A
8
9
A
0
CE  
I/O  
I/O  
I/O  
I/O  
I/O  
A
A
A
I/O  
I/O  
I/O  
GND  
I/O  
I/O  
4
I/O  
7
6
OE  
1
A
2
22  
23  
11  
12  
13  
14  
0
1
2
20  
A
10  
19  
18  
17  
16  
10  
11  
12  
13  
14  
15  
16  
5
4
3
24  
7
6
5
4
3
9
8
A
25  
26  
27  
28  
1
3
A
4
TSOP I  
Reverse Pinout  
Top View  
2
TSOP I  
Top View  
(not to scale)  
WE  
6
15  
14  
13  
A
5
CC  
1
28  
V
CC  
GND  
I/O  
A
5
V
3
(
not to scale)  
A
2
2
3
27  
26  
25  
24  
23  
6
WE  
12  
11  
17  
18  
I/O  
1
A7  
A
4
5
I/O  
A
A
4
5
0
I/O  
6
8
3
10  
9
A
13  
19  
20  
A
9
14  
A
2
A
OE  
I/O  
7
A
A
CE  
6
7
10  
11  
1
8
A
12  
A
21  
22  
A
0
C62256V–3  
C62256V–4  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
March 1996 – Revised April 1998  

与CY62256V18L-200ZRC相关器件

型号 品牌 获取价格 描述 数据表
CY62256V25-70SNC CYPRESS

获取价格

Cache SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.300 INCH, SOIC-28
CY62256V25-70ZC CYPRESS

获取价格

Cache SRAM, 32KX8, 70ns, CMOS, PDSO28, TSOP1-28
CY62256V25L-70SNC CYPRESS

获取价格

Cache SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.300 INCH, SOIC-28
CY62256V25LL CYPRESS

获取价格

32K x 8 Static RAM
CY62256V25LL-100ZC CYPRESS

获取价格

32K x 8 Static RAM
CY62256V25LL-100ZCT CYPRESS

获取价格

暂无描述
CY62256V25LL-100ZRC CYPRESS

获取价格

Standard SRAM, 32KX8, 100ns, CMOS, PDSO28, REVERSE, TSOP1-28
CY62256V25LL-70SNC CYPRESS

获取价格

Cache SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.300 INCH, SOIC-28
CY62256V25LL-70ZCT CYPRESS

获取价格

Cache SRAM, 32KX8, 70ns, CMOS, PDSO28, TSOP1-28
CY62256V-55RZC CYPRESS

获取价格

32K x 8 Static RAM