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CY62168DV30L-70BVI PDF预览

CY62168DV30L-70BVI

更新时间： 2024-11-05 12:59:31
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
页数 文件大小 规格书
9页 232K
描述
Standard SRAM, 2MX8, 70ns, CMOS, PBGA48, 8 X 9.50 MM, 1 MM HEIGHT, VFBGA-48

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CY62168DV30L-70BVI 技术参数

是否Rohs认证：不符合生命周期：Obsolete
零件包装代码：BGA包装说明：8 X 9.50 MM, 1 MM HEIGHT, VFBGA-48
针数：48Reach Compliance Code：not_compliant
ECCN代码：3A991.B.2.AHTS代码：8542.32.00.41
Factory Lead Time：1 week风险等级：5.8
Is Samacsys：N最长访问时间：70 ns
I/O 类型：COMMONJESD-30 代码：R-PBGA-B48
JESD-609代码：e0长度：9.5 mm
内存密度：16777216 bit内存集成电路类型：STANDARD SRAM
内存宽度：8功能数量：1
端子数量：48字数：2097152 words
字数代码：2000000工作模式：ASYNCHRONOUS
最高工作温度：85 °C最低工作温度：-40 °C
组织：2MX8输出特性：3-STATE
封装主体材料：PLASTIC/EPOXY封装代码：VFBGA
封装等效代码：BGA48,6X8,30封装形状：RECTANGULAR
封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH并行/串行：PARALLEL
峰值回流温度（摄氏度）：240电源：2.5/3.3 V
认证状态：Not Qualified座面最大高度：1 mm
最大待机电流：0.000015 A最小待机电流：1.5 V
子类别：SRAMs最大压摆率：0.025 mA
最大供电电压 (Vsup)：3.6 V最小供电电压 (Vsup)：2.2 V
标称供电电压 (Vsup)：3 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子面层：Tin/Lead (Sn/Pb)端子形式：BALL
端子节距：0.75 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：30宽度：8 mm
Base Number Matches：1

CY62168DV30L-70BVI 数据手册

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CY62168DV30  
MoBL  
16-Mbit (2048K x 8) Static RAM  
addresses are not toggling. The device can be put into standby  
mode reducing power consumption by more than 99% when  
deselected Chip Enable 1 (CE1) HIGH or Chip Enable 2 (CE2)  
LOW. The input/output pins (I/O0 through I/O7) are placed in  
a high-impedance state when: deselected Chip Enable 1  
(CE1) HIGH or Chip Enable 2 (CE2) LOW, outputs are disabled  
(OE HIGH), or during a write operation (Chip Enable 1 (CE1)  
LOW and Chip Enable 2 (CE2) HIGH and WE LOW).  
Writing to the device is accomplished by taking Chip Enable 1  
(CE1) LOW and Chip Enable 2 (CE2) HIGH and Write Enable  
(WE) input LOW. Data on the eight I/O pins (I/O0 through I/O7)  
is then written into the location specified on the address  
pins(A0 through A20).  
Reading from the device is accomplished by taking Chip  
Enable 1 (CE1) and Output Enable (OE) LOW and Chip  
Enable 2 (CE2) HIGH while forcing Write Enable (WE) HIGH.  
Under these conditions, the contents of the memory location  
specified by the address pins will appear on the I/O pins.  
The eight input/output pins (I/O0 through I/O7) are placed in a  
high-impedance state when the device is deselected (CE1  
LOW and CE2 HIGH), the outputs are disabled (OE HIGH), or  
during a write operation (CE1 LOW and CE2 HIGH and WE  
LOW). See the truth table for a complete description of read  
and write modes.  
Features  
• Very high speed: 55 ns and 70 ns  
— Wide voltage range: 2.20V – 3.60V  
• Ultra-low active power  
— Typical active current: 2 mA @ f = 1 MHz  
— Typical active current: 15 mA @ f = fmax  
• Ultra-low standby power  
• Easy memory expansion with CE1, CE2 and OE features  
• Automatic power-down when deselected  
• CMOS for optimum speed/power  
• Packages offered in a 48-ball FBGA  
Functional Description[1]  
The CY62168DV30 is a high-performance CMOS static RAMs  
organized as 2048Kbit words by 8 bits. This device features  
advanced circuit design to provide ultra-low active current.  
This is ideal for providing More Battery Life(MoBL) in  
portable applications such as cellular telephones. The device  
also has an automatic power-down feature that significantly  
reduces power consumption. The device can be put into  
standby mode reducing power consumption by 90% when  
Logic Block Diagram  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
0
Data in Drivers  
A0  
A1  
A2  
A3  
A4  
1
2
A
A5  
A6  
3
4
5
2048K x 8  
A7  
ARRAY  
A98  
A10  
A11  
A12  
6
7
POWER  
DOWN  
COLUMN  
CE  
CE  
1
2
DECODER  
I/O  
WE  
OE  
Note:  
1. For best practice recommendations, please refer to the Cypress application note entitled System Design Guidelines, available at http://www.cypress.com.  
Cypress Semiconductor Corporation  
•
3901 North First Street  
•
San Jose, CA 95134  
•
408-943-2600  
Document #: 38-05329 Rev. *D  
Revised September 14, 2004  
1234567...9

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