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CY62158EV30LL-45ZSXIT PDF预览

CY62158EV30LL-45ZSXIT

更新时间: 2024-11-06 13:07:11
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 存储内存集成电路静态存储器
页数 文件大小 规格书
16页 407K
描述
Standard SRAM, 1MX8, 45ns, CMOS, PDSO44, LEAD FREE, TSOP2-44

CY62158EV30LL-45ZSXIT 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active包装说明:TSOP2, TSOP44,.36,32
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:1.75
Samacsys Confidence:1Samacsys Status:Released
Samacsys PartID:1321358Samacsys Pin Count:44
Samacsys Part Category:Integrated CircuitSamacsys Package Category:Small Outline Packages
Samacsys Footprint Name:44-pin TSOP Package Outline, 51-85087Samacsys Released Date:2018-07-10 11:06:54
Is Samacsys:N最长访问时间:45 ns
I/O 类型:COMMONJESD-30 代码:R-PDSO-G44
JESD-609代码:e4长度:18.415 mm
内存密度:8388608 bit内存集成电路类型:STANDARD SRAM
内存宽度:8湿度敏感等级:3
功能数量:1端子数量:44
字数:1048576 words字数代码:1000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:1MX8
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2封装等效代码:TSOP44,.36,32
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):260
电源:2.5/3.3 V认证状态:Not Qualified
座面最大高度:1.194 mm最大待机电流:0.000005 A
最小待机电流:1.5 V子类别:SRAMs
最大压摆率:0.025 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.2 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.8 mm
端子位置:DUAL处于峰值回流温度下的最长时间:30
宽度:10.16 mmBase Number Matches:1

CY62158EV30LL-45ZSXIT 数据手册

 浏览型号CY62158EV30LL-45ZSXIT的Datasheet PDF文件第2页浏览型号CY62158EV30LL-45ZSXIT的Datasheet PDF文件第3页浏览型号CY62158EV30LL-45ZSXIT的Datasheet PDF文件第4页浏览型号CY62158EV30LL-45ZSXIT的Datasheet PDF文件第5页浏览型号CY62158EV30LL-45ZSXIT的Datasheet PDF文件第6页浏览型号CY62158EV30LL-45ZSXIT的Datasheet PDF文件第7页 
CY62158EV30 MoBL®  
8-Mbit (1024 K × 8) Static RAM  
8-Mbit (1024  
K × 8) Static RAM  
Features  
Functional Description  
Very high speed: 45 ns  
Wide voltage range: 2.20 V–3.60 V  
The CY62158EV30 is a high performance CMOS static RAM  
organized as 1024K words by 8 bits. This device features  
advanced circuit design to provide ultra low active current. This  
is ideal for providing More Battery Life™ (MoBL) in portable  
applications such as cellular telephones. The device also has an  
automatic power down feature that significantly reduces power  
consumption. Placing the device into standby mode reduces  
power consumption significantly when deselected (CE1 HIGH or  
CE2 LOW). The eight input and output pins (I/O0 through I/O7)  
are placed in a high impedance state when the device is  
deselected (CE1 HIGH or CE2 LOW), the outputs are disabled  
(OE HIGH), or a write operation is in progress (CE1 LOW and  
CE2 HIGH and WE LOW).  
Pin compatible with CY62158DV30  
Ultra low standby power  
Typical standby current: 2 A  
Maximum standby current: 8 A  
Ultra low active power  
Typical active current: 1.8 mA at f = 1 MHz  
Easy memory expansion with CE1, CE2, and OE features  
Automatic power down when deselected  
CMOS for optimum speed/power  
To write to the device, take Chip Enables (CE1 LOW and CE2  
HIGH) and Write Enable (WE) input LOW. Data on the eight I/O  
pins (I/O0 through I/O7) is then written into the location specified  
on the address pins (A0 through A19).  
Offered in Pb-free 48-ball VFBGA and 44-pin TSOP II  
packages  
To read from the device, take Chip Enables (CE1 LOW and CE2  
HIGH) and OE LOW while forcing the WE HIGH. Under these  
conditions, the contents of the memory location specified by the  
address pins appear on the I/O pins. See Truth Table on page 10  
for a complete description of read and write modes.  
Logic Block Diagram  
I/O0  
I/O1  
I/O2  
I/O3  
I/O4  
I/O5  
I/O6  
I/O7  
Cypress Semiconductor Corporation  
Document #: 38-05578 Rev. *G  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised May 30, 2011  
[+] Feedback  

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