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CY62148ESL-55ZAXAT PDF预览

CY62148ESL-55ZAXAT

更新时间: 2024-11-20 12:59:19
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 存储内存集成电路静态存储器光电二极管
页数 文件大小 规格书
13页 359K
描述
Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, 8 X 13.40 MM, LEAD FREE, STSOP-32

CY62148ESL-55ZAXAT 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:TSSOP, TSSOP32,.56,20
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.6
最长访问时间:55 ns其他特性:IT ALSO OPERATES AT 5V SUPPLY
I/O 类型:COMMONJESD-30 代码:R-PDSO-G32
JESD-609代码:e4长度:11.8 mm
内存密度:4194304 bit内存集成电路类型:STANDARD SRAM
内存宽度:8湿度敏感等级:3
功能数量:1端子数量:32
字数:524288 words字数代码:512000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:512KX8
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP32,.56,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行:PARALLEL峰值回流温度(摄氏度):260
电源:2.5/3.3/5 V认证状态:Not Qualified
座面最大高度:1.2 mm最大待机电流:0.000007 A
最小待机电流:1.5 V子类别:SRAMs
最大压摆率:0.02 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.2 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:8 mmBase Number Matches:1

CY62148ESL-55ZAXAT 数据手册

 浏览型号CY62148ESL-55ZAXAT的Datasheet PDF文件第2页浏览型号CY62148ESL-55ZAXAT的Datasheet PDF文件第3页浏览型号CY62148ESL-55ZAXAT的Datasheet PDF文件第4页浏览型号CY62148ESL-55ZAXAT的Datasheet PDF文件第5页浏览型号CY62148ESL-55ZAXAT的Datasheet PDF文件第6页浏览型号CY62148ESL-55ZAXAT的Datasheet PDF文件第7页 
CY62148ESL MoBL®  
4-Mbit (512 K × 8) Static RAM  
4-Mbit (512  
K × 8) Static RAM  
Features  
Functional Description  
Higher speed up to 55 ns  
The CY62148ESL is a high performance CMOS static RAM  
organized as 512 K words by 8-bits. This device features  
advanced circuit design to provide ultra low active current. This  
is ideal for providing More Battery Life™ (MoBL®) in portable  
applications such as cellular telephones. The device also has an  
automatic power-down feature that significantly reduces power  
consumption. Placing the device in standby mode reduces  
power consumption by more than 99 percent when deselected  
(CE HIGH). The eight input and output pins (I/O0 through I/O7)  
are placed in a high impedance state when the device is  
deselected (CE HIGH), the outputs are disabled (OE HIGH), or  
during a write operation (CE LOW and WE LOW).  
Wide voltage range: 2.2 V to 3.6 V and 4.5 V to 5.5 V  
Ultra low standby power  
Typical standby current: 1 µA  
Maximum standby current: 7 µA  
Ultra low active power  
Typical active current: 2 mA at f = 1 MHz  
Easy memory expansion with CE and OE features  
Automatic power-down when deselected  
To write to the device, take Chip Enable (CE) and Write Enable  
(WE) inputs LOW. Data on the eight I/O pins (I/O0 through I/O7)  
is then written into the location specified on the address pins (A0  
through A18).  
Complementary metal oxide semiconductor (CMOS) for  
optimum speed and power  
Available in Pb-free 32-Pin shrunk thin small outline package  
(STSOP) package  
To read from the device, take Chip Enable (CE) and Output  
Enable (OE) LOW while forcing Write Enable (WE) HIGH. Under  
these conditions, the contents of the memory location specified  
by the address pins appear on the I/O pins.  
For best practice recommendations, refer to the Cypress  
application note AN1064, SRAM System Guidelines.  
Logic Block Diagram  
A
I/O  
I
0
0
INPUT BUFFER  
A
1
A
2
I/O  
I
1
2
3
4
5
6
7
A
3
A
4
I/O  
I
A
5
A
I/O  
I
6
512K x 8  
A
7
A
I/O  
I
8
ARRAY  
A
9
A
I/O  
I
10  
A
11  
A
I/O  
12  
I
I/O  
CE  
I
POWER  
DOWN  
COLUMN DECODER  
WE  
OE  
Cypress Semiconductor Corporation  
Document #: 001-50045 Rev. *C  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised August 23, 2010  
[+] Feedback  

CY62148ESL-55ZAXAT 替代型号

型号 品牌 替代类型 描述 数据表
CY62148ESL-55ZAXA CYPRESS

完全替代

4-Mbit (512 K × 8) Static RAM

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