CY62147G/CY621472G
CY62147GE MoBL®
4-Mbit (256K words × 16-bit) Static RAM
with Error-Correcting Code (ECC)
4-Mbit (256K words
× 16-bit) Static RAM with Error-Correcting Code (ECC)
Data writes are performed by asserting the Write Enable (WE)
input LOW, while providing the data on I/O0 through I/O15 and
address on A0 through A17 pins. The Byte High Enable (BHE)
and Byte Low Enable (BLE) inputs control write operations to the
upper and lower bytes of the specified memory location. BHE
controls I/O8 through I/O15 and BLE controls I/O0 through I/O7.
Features
■ High speed: 45 ns/55 ns
■ Ultra-low standby power
❐ Typical standby current: 3.5 A
❐ Maximum standby current: 8.7 A
Data reads are performed by asserting the Output Enable (OE)
input and providing the required address on the address lines.
Read data is accessible on the I/O lines (I/O0 through I/O15).
Byte accesses can be performed by asserting the required byte
enable signal (BHE or BLE) to read either the upper byte or the
lower byte of data from the specified address location.
■ Embedded ECC for single-bit error correction[1]
■ Wide voltage range: 1.65V to 2.2 V, 2.2 V to 3.6 V, 4.5 V to 5.5 V
■ 1.0-V data retention
■ TTL-compatible inputs and outputs
■ Error indication (ERR) pin to indicate 1-bit error detection and
correction
All I/Os (I/O0 through I/O15) are placed in a HI-Z state when the
device is deselected (CE HIGH for a single chip enable device
and CE1 HIGH/CE2 LOW for a dual chip enable device), or
control signals are deasserted (OE, BLE, BHE).
■ Pb-free 48-ball VFBGA and 44-pin TSOP II packages
Functional Description
The device also has a unique Byte Power down feature, where,
if both the Byte Enables (BHE and BLE) are disabled, the
devices seamlessly switch to standby mode irrespective of the
state of the chip enables, thereby saving power.
CY62147G and CY62147GE are high-performance CMOS
low-power (MoBL) SRAM devices with embedded ECC. Both
devices are offered in single and dual chip enable options and in
multiple pin configurations. The CY62147GE device includes an
ERR pin that signals an error-detection and correction event
during a read cycle.
On the CY62147GE devices, the detection and correction of a
single-bit error in the accessed location is indicated by the
assertion of the ERR output (ERR = HIGH)[1]. See the Truth
Table – CY62147G/CY62147GE on page 16 for a complete
description of read and write modes.
Devices with a single chip enable input are accessed by
asserting the chip enable (CE) input LOW. Dual chip enable
devices are accessed by asserting both chip enable inputs – CE1
as low and CE2 as HIGH.
The logic block diagrams are on page 2.
Product Portfolio
Power Dissipation
Features and
Options
(see the Pin
Configurations
section)
Operating ICC, (mA)
Standby, ISB2 (µA)
Product[2]
Range
VCC Range (V) Speed (ns)
f = fmax
Typ[3]
Max
Typ[3]
Max
CY62147G(E)18
Industrial
1.65 V–2.2 V
2.2 V–3.6 V
55
45
15
15
20
20
3.5
3.5
10
Single or dual
Chip Enables
CY62147G(E)30
CY621472G30
8.7
Optional ERR
pin
CY62147G(E)
4.5 V–5.5 V
Notes
1. This device does not support automatic write-back on error detection.
2. The ERR pin is available only for devices which have ERR option “E” in the ordering code. Refer Ordering Information on page 17.
3. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V = 1.8 V (for a V range of 1.65 V–2.2 V),
CC
CC
V
= 3 V (for V range of 2.2 V–3.6 V), and V = 5 V (for V range of 4.5 V–5.5 V), T = 25 °C.
CC
CC CC CC A
Cypress Semiconductor Corporation
Document Number: 001-92847 Rev. *J
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised June 27, 2017