CY62147EV30 MoBL® Automotive
4-Mbit (256 K × 16) Static RAM
4-Mbit (256
K × 16) Static RAM
portable applications such as cellular telephones. The device
also has an automatic power down feature that significantly
reduces power consumption when addresses are not toggling.
Placing the device into standby mode reduces power
consumption by more than 99 percent when deselected (CE
HIGH or both BLE and BHE are HIGH). The input and output pins
(I/O0 through I/O15) are placed in a high impedance state when:
Features
■ Very high speed: 45 ns
■ Temperature ranges
❐ Automotive-A: –40 °C to +85 °C
❐ Automotive-E: –40 °C to +125 °C
■ Wide voltage range: 2.20 V to 3.60 V
■ Pin compatible with CY62147DV30
■ Deselected (CE HIGH)
■ Outputs are disabled (OE HIGH)
■ Ultra low standby power
❐ Typical standby current: 1 A
■ Both Byte High Enable and Byte Low Enable are disabled
❐ Maximum standby current: 7 A (Automotive-A)
(BHE, BLE HIGH)
■ Ultra low active power
■ Write operation is active (CE LOW and WE LOW)
❐ Typical active current: 2 mA (Automotive-A) at f = 1 MHz
■ Easy memory expansion with CE [1] and OE features
To write to the device, take Chip Enable (CE) and Write Enable
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data
from I/O pins (I/O0 through I/O7) is written into the location
specified on the address pins (A0 through A17). If Byte High
Enable (BHE) is LOW, then data from I/O pins (I/O8 through
I/O15) is written into the location specified on the address pins
(A0 through A17).
■ Automatic power down when deselected
■ Complementary metal oxide semiconductor (CMOS) for
optimum speed and power
■ Available in Pb-free 48-ball very fine ball grid array (VFBGA)
(single/dual CE option) and 44-pin thin small outline package
(TSOP) II packages
To read from the device, take Chip Enable (CE) and Output
Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If
Byte Low Enable (BLE) is LOW, then data from the memory
location specified by the address pins appear on I/O0 to I/O7. If
Byte High Enable (BHE) is LOW, then data from memory
appears on I/O8 to I/O15. See the Truth Table on page 12 for a
complete description of read and write modes.
■ Byte power-down feature
Functional Description
The CY62147EV30 is a high performance CMOS static RAM
(SRAM) organized as 256K words by 16 bits. This device
features advanced circuit design to provide ultra low active
current. It is ideal for providing More Battery Life™ (MoBL) in
For best practice recommendations, refer to the Cypress
application note AN1064, SRAM System Guidelines.
Logic Block Diagram
DATA IN DRIVERS
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
256K x 16
I/O0–I/O7
RAM Array
I/O8–I/O15
COLUMN DECODER
BHE
WE
CE
POWER DOWN
CIRCUIT
BHE
BLE
[1]
CE
OE
BLE
Note
1. BGA packaged device is offered in single CE and dual CE options. In this data sheet, for a dual CE device, CE refers to the internal logical combination of CE and
1
CE such that when CE is LOW and CE is HIGH, CE is LOW. For all other cases CE is HIGH.
2
1
2
Cypress Semiconductor Corporation
Document Number: 001-66256 Rev. *A
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised March 19, 2013