CY62146V MoBL™
CY62146V18 MoBL2™
256K x 16 Static RAM
put/output pins (I/O through I/O ) are placed in a high-im-
Features
0
15
pedance state when: deselected (CE HIGH), outputs are dis-
abled (OE HIGH), BHE and BLE are disabled (BHE, BLE
HIGH), or during a write operation (CE LOW, and WE LOW).
• Low voltage range:
— CY62146V18: 1.65V–1.95V
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
— CY62146V: 2.7V–3.6V
• Ultra-low active, standby power
(BLE) is LOW, then data from I/O pins (I/O through I/O ), is
0
7
• Easy memory expansion with CE and OE features
• TTL-compatible inputs and outputs
• Automatic power-down when deselected
• CMOS for optimum speed/power
written into the location specified on the address pins (A
0
through A ). If Byte High Enable (BHE) is LOW, then data
16
from I/O pins (I/O through I/O ) is written into the location
8
15
specified on the address pins (A through A ).
0
17
Reading from the device is accomplished by taking Chip En-
able (CE) and Output Enable (OE) LOW while forcing the Write
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then
data from the memory location specified by the address pins
Functional Description
The CY62146V and CY62146V18 are high-performance
CMOS static RAMs organized as 262,144 words by 16 bits.
These devices feature advanced circuit design to provide ul-
tra-low active current. This is ideal for providing More Battery
Life™ (MoBL™) in portable applications such as cellular tele-
phones. The device also has an automatic power-down fea-
ture that significantly reduces power consumption by 99%
when addresses are not toggling. The device can also be put
into standby mode when deselected (CE HIGH). The in-
will appear on I/O to I/O . If Byte High Enable (BHE) is LOW,
0
7
then data from memory will appear on I/O to I/O . See the
8
15
truth table at the back of this data sheet for a complete descrip-
tion of read and write modes.
The CY62146V and CY62146V18 are available in 48-Ball
FBGA and standard 44-Pin TSOP Type II (forward pinout)
packaging.
Logic Block Diagram
Pin
Configurations
TSOP II (Forward)
Top View
44
1
A
4
A
5
43
42
41
40
39
38
A
A
2
3
4
5
6
3
6
DATA IN DRIVERS
A
A
2
7
OE
A
1
A9
A8
A7
A6
A5
A4
A3
A2
BHE
BLE
I/O
I/O
I/O
A
0
CE
I/O
7
0
15
37
36
35
34
33
I/O
I/O
8
1
2
14
13
12
256K x 16
9
10
11
12
13
I/O
V
SS
RAM Array
2048 x 2048
I/O
I/O0–I/O7
3
CC
V
SS
V
V
I/O8–I/O15
CC
I/O
32
I/O
I/O
4
5
6
7
11
10
A1
A0
I/O
I/O
I/O
31
30
29
28
14
15
16
I/O
I/O
9
8
WE 17
NC
18
27
26
25
A
A
8
16
19
A
A
9
COLUMN DECODER
15
A
A
A
20
21
22
A
14
10
A
24
23
11
13
A
12
17
BHE
WE
CE
OE
62146V–2
BLE
62146V–1
MoBL, MoBL2, and More Battery Life are trademarks of Cypress Semiconductor Corporation.
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134
•
408-943-2600
March 23, 2000