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CY62146GN30-45ZSXI PDF预览

CY62146GN30-45ZSXI

更新时间: 2024-11-06 14:56:35
品牌 Logo 应用领域
英飞凌 - INFINEON 静态存储器
页数 文件大小 规格书
16页 478K
描述
Asynchronous SRAM

CY62146GN30-45ZSXI 数据手册

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CY62146GN MoBL®  
4-Mbit (256K × 16) Static RAM  
4-Mbit (256K  
× 16) Static RAM  
Features  
Functional Description  
Very high speed: 45 ns  
Temperature ranges  
The CY62146GN is a high performance CMOS static RAM  
organized as 256K words by 16 bits. This device features an  
advanced circuit design designed to provide an ultra low active  
current. Ultra low active current is ideal for providing More  
Battery Life(MoBL®) in portable applications such as cellular  
telephones. The device also has an automatic power down  
feature that significantly reduces power consumption by 80  
percent when addresses are not toggling.The device can also be  
put into standby mode reducing power consumption by more  
than 99 percent when deselected (CE HIGH). The input and  
output pins (I/O0 through I/O15) are placed in a high impedance  
state when the device is deselected (CE HIGH), outputs are  
disabled (OE HIGH), both Byte High Enable and Byte Low  
Enable are disabled (BHE, BLE HIGH), or a write operation is in  
progress (CE LOW and WE LOW).  
Industrial: –40 °C to +85 °C  
Wide voltage range: 2.20 V to 3.60 V and 4.5 V to 5.5 V  
Ultra low standby power  
Typical standby current: 3.5 A  
Maximum standby current: 8.7 A  
Ultra low active power  
Typical active current: 3.5 mA at f = 1 MHz  
Automatic power down when deselected  
Complementary metal oxide semiconductor (CMOS) for  
optimum speed and power  
To write to the device, take Chip Enable (CE) and Write Enable  
(WE) input LOW. If Byte Low Enable (BLE) is LOW, then data  
from I/O pins (I/O0 through I/O7) is written into the location  
specified on the address pins (A0 through A17). If Byte High  
Enable (BHE) is LOW, then data from the I/O pins (I/O8 through  
I/O15) is written into the location specified on the address pins  
(A0 through A17).  
Available in a 44-pin TSOP II and 48-ball VFBGA Packages  
To read from the device, take Chip Enable (CE) and Output  
Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If  
Byte Low Enable (BLE) is LOW, then data from the memory  
location specified by the address pins appears on I/O0 to I/O7. If  
Byte High Enable (BHE) is LOW, then data from memory  
appears on I/O8 to I/O15. See the Truth Table on page 11 for a  
complete description of read and write modes.  
Logic Block Diagram  
DATA IN DRIVERS  
A10  
A9  
A8  
A7  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
256K x 16  
RAM Array  
I/O0–I/O7  
I/O8–I/O15  
COLUMN DECODER  
BHE  
WE  
CE  
OE  
BLE  
Cypress Semiconductor Corporation  
Document Number: 001-95417 Rev. *E  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised December 15, 2017  

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