CY62137V MoBL™
CY62137V18 MoBL2™
128K x 16 Static RAM
are placed in a high-impedance state when: deselected (CE
HIGH), outputs are disabled (OE HIGH), BHE and BLE are
disabled (BHE, BLE HIGH), or during a write operation (CE
LOW, and WE LOW).
Features
• Low voltage range:
— CY62137V18: 1.65V–1.95V
— CY62137V: 2.7V-3.6V
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
• Ultra-low active, standby power
(BLE) is LOW, then data from I/O pins (I/O through I/O ), is
0
7
• Easy memory expansion with CE and OE features
• TTL-compatible inputs and outputs
• Automatic power-down when deselected
• CMOS for optimum speed/power
written into the location specified on the address pins (A
0
through A ). If Byte High Enable (BHE) is LOW, then data
16
from I/O pins (I/O through I/O ) is written into the location
8
15
specified on the address pins (A through A ).
0
16
Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
Functional Description
The CY62137V and CY62137V18 are high-performance
CMOS static RAMs organized as 131,072 words by 16 bits.
This device features advanced circuit design to provide ul-
tra-low active current. This is ideal for providing More Battery
Life™ (MoBL™) in portable applications such as cellular tele-
phones. The device also has an automatic power-down fea-
ture that reduces power consumption by 99% when addresses
are not toggling. The device can also be put into standby mode
when deselected (CE HIGH) or when CE is LOW and both BLE
pins will appear on I/O to I/O . If Byte High Enable (BHE) is
0
7
LOW, then data from memory will appear on I/O to I/O . See
8
15
the truth table at the back of this data sheet for a complete
description of read and write modes.
The CY62137V and CY62137V18 are available in 48-ball
FBGA and standard 44-pin TSOP Type II (forward pinout)
packaging.
and BHE are HIGH. The input/output pins (I/O through I/O
)
0
15
Logic Block Diagram
Pin
Configurations
TSOP II (Forward)
Top View
DATA IN DRIVERS
44
1
A
4
A
5
43
42
41
40
39
38
A
A
2
3
4
5
6
3
6
A
A
A9
A8
A7
A6
A5
A4
2
7
OE
A
1
BHE
BLE
I/O
I/O
I/O
A
0
CE
128K x 16
RAM Array
I/O
7
0
15
37
36
35
34
33
I/O0–I/O7
I/O
I/O
8
1
2
14
13
12
9
A3
A2
I/O8–I/O15
10
11
12
13
I/O
V
SS
I/O
3
CC
V
SS
A1
A0
V
V
CC
I/O
32
I/O
I/O
4
5
6
7
11
10
I/O
I/O
I/O
31
30
29
28
14
15
16
I/O
I/O
9
8
COLUMN DECODER
WE 17
NC
18
27
26
25
A
A
8
16
19
A
A
15
14
9
10
11
A
20
21
22
A
A
BHE
A
12
24
23
WE
CE
OE
13
A
NC
BLE
62137V–2
CE
Power Down
Circuit
BHE
BLE
62137V–1
MoBL and More Battery Life are trademarks of Cypress Semiconductor Corporation.
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134
•
408-943-2600
January 20, 2000