CY62137FV30 MoBL®Automotive
2-Mbit (128 K × 16) Static RAM
2-Mbit (128
K × 16) Static RAM
Features
Functional Description
■ Very high speed: 45 ns
The CY62137FV30 is a high performance CMOS static RAM
organized as 128K words by 16 bits. This device features
advanced circuit design to provide ultra low active current. This
is ideal for providing More Battery Life™ (MoBL®) in portable
applications such as cellular telephones. The device also has an
automatic power down feature that significantly reduces power
consumption when addresses are not toggling. Placing the
device into standby mode reduces power consumption by more
than 99% when deselected (CE HIGH or both BLE and BHE are
HIGH). The input and output pins (I/O0 through I/O15) are placed
in a high impedance state in the following conditions when the
device is deselected (CE HIGH), the outputs are disabled (OE
HIGH), both the Byte High Enable and the Byte Low Enable are
disabled (BHE, BLE HIGH), or during an active write operation
(CE LOW and WE LOW).
■ Temperature ranges
❐ Automotive-A: –40 °C to +85 °C
❐ Automotive-E: –40 °C to +125 °C
■ Wide voltage range: 2.20 V–3.60 V
■ Pin
compatible
with
CY62137CV/CV25/CV30/CV33,
CY62137V, and CY62137EV30
■ Ultra low standby power
❐ Typical standby current: 1 A (Automotive-A)
❐ Maximum standby current: 5 A (Automotive-A)
■ Ultra low active power
❐ Typical active current: 1.6 mA at f = 1 MHz (45 ns speed)
■ Easy memory expansion with CE and OE features
■ Automatic power down when deselected
Write to the device by taking Chip Enable (CE) and Write Enable
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data
from I/O pins (I/O0 through I/O7) is written into the location
specified on the address pins (A0 through A16). If Byte High
Enable (BHE) is LOW, then data from I/O pins (I/O8 through
I/O15) is written into the location specified on the address pins
(A0 through A16).
■ Complementary metal oxide semiconductor (CMOS) for
optimum speed and power
■ Byte power down feature
■ Available in 44-pin thin small outline package (TSOP) II
Read from the device by taking Chip Enable (CE) and Output
Enable (OE) LOW, while forcing the Write Enable (WE) HIGH. If
Byte Low Enable (BLE) is LOW, then data from the memory
location specified by the address pins appear on I/O0 to I/O7. If
Byte High Enable (BHE) is LOW, then data from memory
appears on I/O8 to I/O15. See the Truth Table on page 11 for a
complete description of read and write modes.
package
For a complete list of related resources, click here.
Logic Block Diagram
DATA IN DRIVERS
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
128K x 16
RAM Array
I/O0–I/O7
I/O8–I/O15
BHE
WE
CE
COLUMN DECODER
CE
POWER DOWN
CIRCUIT
OE
BLE
BHE
BLE
Cypress Semiconductor Corporation
Document Number: 001-66190 Rev. *E
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised January 3, 2018