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CY62137CV30LL-70BAIT PDF预览

CY62137CV30LL-70BAIT

更新时间: 2024-11-09 13:07:11
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
页数 文件大小 规格书
13页 664K
描述
Standard SRAM, 128KX16, 70ns, CMOS, PBGA48, 7 X 7 MM, 1.20 MM HEIGHT, FBGA-48

CY62137CV30LL-70BAIT 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:TFBGA,针数:48
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41Factory Lead Time:1 week
风险等级:5.75Is Samacsys:N
最长访问时间:70 nsJESD-30 代码:S-PBGA-B48
JESD-609代码:e0长度:7 mm
内存密度:2097152 bit内存集成电路类型:STANDARD SRAM
内存宽度:16功能数量:1
端子数量:48字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128KX16封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装形状:SQUARE
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH并行/串行:PARALLEL
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):3.3 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:TIN LEAD端子形式:BALL
端子节距:0.75 mm端子位置:BOTTOM
宽度:7 mmBase Number Matches:1

CY62137CV30LL-70BAIT 数据手册

 浏览型号CY62137CV30LL-70BAIT的Datasheet PDF文件第2页浏览型号CY62137CV30LL-70BAIT的Datasheet PDF文件第3页浏览型号CY62137CV30LL-70BAIT的Datasheet PDF文件第4页浏览型号CY62137CV30LL-70BAIT的Datasheet PDF文件第5页浏览型号CY62137CV30LL-70BAIT的Datasheet PDF文件第6页浏览型号CY62137CV30LL-70BAIT的Datasheet PDF文件第7页 
CY62137CV30/33 MoBL®  
CY62137CV MoBL®  
2-Mbit (128K x 16) Static RAM  
ultra-low active current. This is ideal for providing More Battery  
Life™ (MoBL®) in portable applications such as cellular  
telephones. The devices also has an automatic power-down  
feature that significantly reduces power consumption by 80%  
when addresses are not toggling. The device can also be put  
into standby mode reducing power consumption by more than  
99% when deselected (CE HIGH or both BLE and BHE are  
HIGH). The input/output pins (I/O0 through I/O15) are placed  
in a high-impedance state when: deselected (CE HIGH),  
outputs are disabled (OE HIGH), both Byte High Enable and  
Byte Low Enable are disabled (BHE, BLE HIGH), or during a  
write operation (CE LOW, and WE LOW).  
Features  
• Very high speed  
— 55 ns  
• Temperature Ranges  
— Industrial: - 40°C to + 85°C  
— Automotive: - 40°C to + 125°C  
• Pin-compatible with the CY62137V  
• Ultra-low active power  
— Typical active current: 1.5 mA @ f = 1 MHz  
— Typical active current: 7 mA @ f = fMax (55 ns speed)  
• Low and ultra-low standby power  
• Easy memory expansion with CE and OE features  
• Automatic power-down when deselected  
• CMOS for optimum speed/power  
Writing to the device is accomplished by taking Chip Enable  
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable  
(BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is  
written into the location specified on the address pins (A0  
through A16). If Byte High Enable (BHE) is LOW, then data  
from I/O pins (I/O8 through I/O15) is written into the location  
specified on the address pins (A0 through A16).  
Reading from the device is accomplished by taking Chip  
Enable (CE) and Output Enable (OE) LOW while forcing the  
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,  
then data from the memory location specified by the address  
pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is  
LOW, then data from memory will appear on I/O8 to I/O15. See  
the truth table at the back of this data sheet for a complete  
description of read and write modes.  
• Available in Pb-free and non Pb-free 48-ball FBGA  
package  
Functional Description[1]  
The CY62137CV30/33 and CY62137CV are high-perfor-  
mance CMOS static RAMs organized as 128K words by 16  
bits. These devices feature advanced circuit design to provide  
Logic Block Diagram  
DATA IN DRIVERS  
A10  
A9  
A8  
A7  
A6  
A5  
A4  
A3  
A2  
128K x 16  
RAM Array  
I/O0–I/O7  
I/O8–I/O15  
A1  
A0  
COLUMN DECODER  
BHE  
WE  
CE  
OE  
BLE  
CE  
Power -Down  
Circuit  
BHE  
BLE  
Note:  
1. For best practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.  
Cypress Semiconductor Corporation  
Document #: 38-05201 Rev. *G  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised July 21, 2006  
[+] Feedback  

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