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CY28341OXC-2 PDF预览

CY28341OXC-2

更新时间: 2024-11-18 02:54:55
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 晶体时钟发生器微控制器和处理器外围集成电路光电二极管双倍数据速率
页数 文件大小 规格书
19页 320K
描述
Universal Clock Chip for VIA⑩P4M/KT/KM400 DDR Systems

CY28341OXC-2 技术参数

是否Rohs认证: 符合生命周期:Transferred
零件包装代码:SSOP包装说明:LEAD FREE, SSOP-56
针数:56Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.22Is Samacsys:N
JESD-30 代码:R-PDSO-G56JESD-609代码:e4
长度:18.415 mm湿度敏感等级:3
端子数量:56最高工作温度:70 °C
最低工作温度:最大输出时钟频率:200 MHz
封装主体材料:PLASTIC/EPOXY封装代码:SSOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度):260主时钟/晶体标称频率:14.31818 MHz
认证状态:Not Qualified座面最大高度:2.794 mm
最大供电电压:3.465 V最小供电电压:3.135 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:NICKEL PALLADIUM GOLD端子形式:GULL WING
端子节距:0.635 mm端子位置:DUAL
处于峰值回流温度下的最长时间:20宽度:7.5057 mm
uPs/uCs/外围集成电路类型:CLOCK GENERATOR, PROCESSOR SPECIFICBase Number Matches:1

CY28341OXC-2 数据手册

 浏览型号CY28341OXC-2的Datasheet PDF文件第2页浏览型号CY28341OXC-2的Datasheet PDF文件第3页浏览型号CY28341OXC-2的Datasheet PDF文件第4页浏览型号CY28341OXC-2的Datasheet PDF文件第5页浏览型号CY28341OXC-2的Datasheet PDF文件第6页浏览型号CY28341OXC-2的Datasheet PDF文件第7页 
CY28341-2  
Universal Clock Chip for VIA™P4M/KT/KM400  
DDR Systems  
Features  
Table 1. Frequency Selection Table  
FS(3:0)  
0000  
0001  
0010  
0011  
0100  
0101  
0110  
0111  
1000  
1001  
1010  
1011  
1100  
1101  
1110  
1111  
CPU  
AGP  
66.80  
66.80  
60.00  
66.67  
72.00  
70.00  
64.00  
70.00  
77.00  
73.33  
60.00  
66.6  
PCI  
• Supports VIAP4M/KM/KT/266/333/400 chipsets  
• Supports Pentium® 4, Athlon™ processors  
• Supports two DDR DIMMS  
• Supports three SDRAM DIMMS at 100 MHz  
• Provides:  
— two different programmable CPU clock pairs  
— six differential SDRAM DDR pairs  
— three low-skew/-jitter AGP clocks  
— seven low-skew/-jitter PCI clocks  
— one 48M output for USB  
66.80  
33.40  
33.40  
30.00  
33.33  
36.00  
35.00  
32.00  
35.00  
38.50  
36.67  
30.00  
33.3  
100.00  
120.00  
133.33  
72.00  
105.00  
160.00  
140.00  
77.00  
110.00  
180.00  
166.6  
— one programmable 24M or 48M for SIO  
• Dial-a-Frequencyand Dial-a-dBfeatures  
90.00  
60.00  
66.67  
66.67  
66.67  
30.00  
33.33  
33.33  
33.33  
100.00  
200.00  
133.33  
• SpreadSpectrumforbestelectromagneticinterference  
(EMI) reduction  
• Watchdog feature for system recovery  
• SMBus-compatible for programmability  
• 56-pin SSOP and TSSOP packages  
Pin Configuration[1]  
Block Diagram  
VDDR  
XIN  
XOUT  
1
2
3
4
5
6
7
8
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
*FS0/REF0  
VSSR  
VTTPWRGD#/REF1  
VDDR  
VSSC  
CPUT/CPUOD_T  
CPUC/CPUOD_C  
VDDC  
REF(0:1)  
VDDI  
XTAL  
FS2  
REF0  
XIN  
XOUT  
VDDAGP  
AGP0  
*SELP4_K7/AGP1  
AGP2  
VSSAGP  
**FS1/PCI_F  
**SELSDR_DDR/PCI1  
CPUCS_T/C  
FS0  
VDDC  
SELP4_K7#  
VDDI  
CPU(0:1)/CPU0D_T/C  
PLL1  
CPUCS_C  
CPUCS_T  
VSSI  
FBOUT  
BUF_IN  
DDRT0/SDRAM0  
DDRC0/SDRAM1  
DDRT1/SDRAM2  
DDRC1/SDRAM3  
VDDD  
9
VDDPCI  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
PCI(3:6)  
FS3 FS1  
*MULTSEL/PCI2  
VSSPCI  
PCI3  
PCI_F  
MULTSEL  
PCI2  
PD#  
PCI4  
VDDPCI  
PCI5  
PCI1  
VDDAGP  
AGP(0:2)  
PCI6  
VSSD  
VSS48M  
**FS3/48M  
**FS2/24_48M  
VDD48M  
VDD  
VSS  
IREF  
*PD#/SRESET#  
SCLK  
DDRT2/SDRAM4  
DDRC2/SDRAM5  
DDRT3/SDRAM6  
DDRC3/SDRAM7  
VDDD  
VDD48M  
48M  
SDATA  
SCLK  
SMBus  
PLL2  
/ 2  
WDEN  
VSSD  
24_48M  
DDRT4/SDRAM8  
DDRC4/SDRAM9  
DDRT5/SDRAM10  
DDRC5/SDRAM11  
SRESET#  
VDDD  
WD  
SDATA  
SELSDR_DDR  
FBOUT  
S2D  
56 pin SSOP  
DDRT(0:5)/SDRAM(0,2,4,6,8,10)  
DDRC(0:5)/SDRAM(1,3,5,7,9,11)  
Buf_IN  
CONVERT  
Note:  
1. Pins marked with [*] have internal pull-up resistors. Pins marked with [**] have internal pull-down resistors.  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Document #: 38-07471 Rev. *D  
Revised March 11, 2005  

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