Datasheet > CXK79M36C165GB-4

CXK79M36C165GB-4

更新时间： 2024-11-30 15:45:11

品牌	Logo	应用领域
索尼 - SONY		时钟静态存储器内存集成电路
页数	文件大小	规格书
29页	482K
描述
Standard SRAM, 512KX36, 2.1ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-209

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技术参数
数据手册

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CXK79M36C165GB-4 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Obsolete	零件包装代码：	BGA
包装说明：	BGA, BGA209,11X19,40	针数：	209
Reach Compliance Code：	unknown	ECCN代码：	3A991.B.2.A
HTS代码：	8542.32.00.41	风险等级：	5.92
最长访问时间：	2.1 ns	其他特性：	PIPELINED ARCHITECTURE; LATE WRITE
最大时钟频率 (fCLK)：	250 MHz	I/O 类型：	COMMON
JESD-30 代码：	R-PBGA-B209	长度：	22 mm
内存密度：	18874368 bit	内存集成电路类型：	STANDARD SRAM
内存宽度：	36	湿度敏感等级：	3
功能数量：	1	端子数量：	209
字数：	524288 words	字数代码：	512000
工作模式：	SYNCHRONOUS	最高工作温度：	85 °C
最低工作温度：		组织：	512KX36
输出特性：	3-STATE	封装主体材料：	PLASTIC/EPOXY
封装代码：	BGA	封装等效代码：	BGA209,11X19,40
封装形状：	RECTANGULAR	封装形式：	GRID ARRAY
并行/串行：	PARALLEL	峰值回流温度（摄氏度）：	225
电源：	1.5/1.8,1.8 V	认证状态：	Not Qualified
座面最大高度：	2.3 mm	最小待机电流：	1.7 V
子类别：	SRAMs	最大压摆率：	0.5 mA
最大供电电压 (Vsup)：	1.95 V	最小供电电压 (Vsup)：	1.75 V
标称供电电压 (Vsup)：	1.8 V	表面贴装：	YES
技术：	CMOS	温度等级：	OTHER
端子形式：	BALL	端子节距：	1 mm
端子位置：	BOTTOM	处于峰值回流温度下的最长时间：	30
宽度：	14 mm	Base Number Matches：	1

CXK79M36C165GB-4 数据手册

SONY ΣRAM^™CXK79M72C165GB / CXK79M36C165GB 3/33/4

18Mb 1x1Dp LVCMOS High Speed Synchronous SRAMs (256Kb x 72 or 512Kb x 36)

Preliminary

Description

The CXK79M72C165GB (organized as 262,144 words by 72 bits) and the CXK79M36C165GB (organized as 524,288 words

by 36 bits) are high speed CMOS synchronous static RAMs with common I/O pins. They are manufactured in compliance with

the JEDEC-standard 209 pin BGA package pinouts defined for SigmaRAM^™devices. They integrate input registers, high speed

RAM, output registers, and a two-deep write buffer onto a single monolithic IC. Single Data Rate (SDR) Pipelined (PL) read

operations and Double Late Write (DLW) write operations are supported, providing a high-performance user interface. Positive

and negative output clocks are provided for applications requiring source-synchronous operation.

All address and control input signals are registered on the rising edge of the CK input clock.

During read operations, output data is driven valid once, from the rising edge of CK, one full cycle after the address and control

signals are registered.

During write operations, input data is registered once, on the rising edge of CK, two full cycles after the address and control

signals are registered.

Output drivers are series-terminated, and output impedance is selectable via the ZQ control pin. When ZQ is tied “low”, the

impedance of the SRAM’s output drivers is set to ~25Ω. When ZQ is tied “high” or left unconnected, the impedance of the

SRAM’s output drivers is set to ~50Ω.

333 MHz operation (333 Mbps) is obtained from a single 1.8V power supply. JTAG boundary scan interface is provided using

a subset of IEEE standard 1149.1 protocol.

Features

•

3 Speed Bins

Cycle Time / Data Access Time

3.0ns / 2.0ns

-3

-33

-4

3.3ns / 2.0ns

4.0ns / 2.1ns

• Single 1.8V power supply (V_DD): 1.7V or 1.75V (min) to 1.95V (max)

• Dedicated output supply voltage (V_DDQ): 1.4V (min) to V_DD(max)

• LVCMOS-compatible I/O interface

• Common I/O

• Single Data Rate (SDR) data transfers

• Pipelined (PL) read operations

• Double Late Write (DLW) write operations

• Burst capability with internally controlled Linear Burst address sequencing

• Burst length of two, three, or four, with automatic address wrap

• Full read/write data coherency

• Byte write capability

• Single-ended input clock (CK)

• Data-referenced output clocks (CQ1, CQ1, CQ2, CQ2)

• Selectable output driver impedance via dedicated control pin (ZQ)

• Depth expansion capability (2 or 4 banks) via programmable chip enables (E2, E3, EP2, EP3)

• JTAG boundary scan (subset of IEEE standard 1149.1)

• 209 pin (11x19), 1mm pitch, 14mm x 22mm Ball Grid Array (BGA) package

18Mb 1x1Dp, LVCMOS, rev 1.3

1 / 29

November 18, 2003

12 3 4 5 6 7...29

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与CXK79M36C165GB-4相关器件

型号	品牌	获取价格	描述	数据表
CXK79M36C165GB-5	SONY	获取价格	Standard SRAM, 512KX36, 2.3ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-209
CXK79M72C160GB	ETC	获取价格	MEMORY-SigmaRAM 16Meg 1x1 HSTL I/O (256K x 72) (27 pages 364K Rev. 7/6/01)
CXK79M72C160GB-33	SONY	获取价格	Standard SRAM, 256KX72, 1.8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-209
CXK79M72C160GB-4	SONY	获取价格	Standard SRAM, 256KX72, 2.1ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-209
CXK79M72C160GB-44	SONY	获取价格	Standard SRAM, 256KX72, 2.3ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-209
CXK79M72C160GB-5	SONY	获取价格	Standard SRAM, 256KX72, 2.3ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-209
CXK79M72C161GB	ETC	获取价格	MEMORY-SigmaRAM 16Meg 1x1 LVCMOS I/O (256K x 72) (27 pages 364K Rev. 7/6/01)
CXK79M72C161GB-33	SONY	获取价格	Standard SRAM, 256KX72, 1.8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-209
CXK79M72C161GB-44	SONY	获取价格	Standard SRAM, 256KX72, 2.3ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-209
CXK79M72C161GB-5	SONY	获取价格	Standard SRAM, 256KX72, 2.3ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-209

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