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CXK77N18B160GB-3 PDF预览

CXK77N18B160GB-3

更新时间: 2024-11-11 21:08:11
品牌 Logo 应用领域
索尼 - SONY 静态存储器
页数 文件大小 规格书
25页 149K
描述
Late-Write SRAM, 1MX18, 1.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119

CXK77N18B160GB-3 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:BGA
包装说明:BGA, BGA119,7X17,50针数:119
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.92
Base Number Matches:1

CXK77N18B160GB-3 数据手册

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SONYÒ CXK77N36B160GB / CXK77N18B160GB  
3/33/4  
16Mb LW LS R-R HSTL High Speed Synchronous SRAM (512K x 36 or 1M x 18)  
Preliminary  
Description  
The CXK77N36B160GB (organized as 524,288 words by 36 bits) and the CXK77N18B160GB (organized as 1,048,576 words  
by 18 bits) are high speed CMOS synchronous static RAMs with common I/O pins. These synchronous SRAMs integrate input  
registers, high speed RAM, output registers, and a one-deep write buffer onto a single monolithic IC. Register - Register (R-R)  
read operations and Late Write (LW) write operations are supported, providing a high-performance user interface.  
Two distinct R-R modes of operation are supported, selectable via the M2 mode pin. When M2 is “high”, this device functions  
as a conventional R-R SRAM, and pin 4P functions as a conventional SA address input. When M2 is “low”, this device func-  
tions as a Late Select (LS) R-R SRAM, and pin 4P functions as a Late Select SAS address input.  
When Late Select R-R mode is selected, the SRAM is divided into two banks internally. During write operations, SAS is reg-  
istered in the same cycle as the other address and control signals, and is used to select to which bank input data is ultimately  
written (through one stage of write pipelining). During read operations, SAS is registered one full clock cycle after the other  
address and control signals, and is used to select from which bank output data is read.  
All address and control input signals except G (Output Enable) and ZZ (Sleep Mode) are registered on the rising edge of the K  
differential input clock.  
During read operations, output data is driven valid from the rising edge of K, one full clock cycle after all address and control  
input signals (except SAS) are registered.  
During write operations, input data is registered on the rising edge of K, one full clock cycle after all address and control input  
signals (including SAS) are registered.  
Sleep (power down) capability is provided via the ZZ input signal.  
Output drivers are series terminated, and output impedance is programmable via the ZQ input pin. By connecting an external  
control resistor RQ between ZQ and VSS, the impedance of all data output drivers can be precisely controlled.  
333 MHz operation is obtained from a single 2.5V power supply. JTAG boundary scan interface is provided using a subset of  
IEEE standard 1149.1 protocol.  
Features  
3 Speed Bins  
Cycle Time / Access Time  
3.0ns / 1.5ns  
-3  
-33  
-4  
3.3ns / 1.6ns  
4.0ns / 2.0ns  
Single 2.5V power supply (VDD): 2.5V ± 5%  
Dedicated output supply voltage (VDDQ): 1.5V to 1.8V typical  
HSTL-compatible I/O interface with dedicated input reference voltage (VREF ): VDDQ/2 typical  
Register - Register (R-R) read protocol  
Late Write (LW) write protocol  
Conventional or Late Select (LS) mode of operation, selectable via dedicated mode pin (M2)  
Full read/write coherency  
Byte Write capability  
Differential input clocks (K/K)  
Asynchronous output enable (G)  
Sleep (power down) mode via dedicated mode pin (ZZ)  
Programmable output driver impedance  
JTAG boundary scan (subset of IEEE standard 1149.1)  
119 pin (7x17), 1.27mm pitch, 14mm x 22mm Ball Grid Array (BGA) package  
16Mb LW R-R and R-R w/ LS, rev 1.0  
1 / 25  
November 21, 2003  

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Late-Write SRAM, 512KX36, 2ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119
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Late-Write SRAM, 512KX36, 1.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119
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