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CXG1180EQ PDF预览

CXG1180EQ

更新时间: 2022-10-24 11:13:10
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其他 - ETC 开关GSM
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2页 52K
描述
Ultralow Loss GSM Quad-Band Antenna Switch Module

CXG1180EQ 数据手册

 浏览型号CXG1180EQ的Datasheet PDF文件第2页 
Ultralow Loss GSM Quad-Band Antenna Switch Module  
CXG1180EQ/1186EQ  
Ultralow insertion loss: 0.70 dB in the  
GSM 850/900 Tx path and 0.85 dB in  
the DCS/PCS Tx path  
Multiband support to allow the use of the multiple frequencies that are  
used in different countries is now standard in GSM terminals, which  
are now the most widely used terminal worldwide. Thus there are es-  
pecially strong desires for miniature, low-cost, low-loss devices that  
can switch between multiple circuits with differing frequencies. The  
newly-developed CXG1180EQ and CXG1186EQ are high-performance  
lead frame modules that achieve those requirements in a balanced  
manner.  
Dual low-pass filters:  
Attenuation 30 dB typical  
(GSM Tx 2fo, DCS/PCS Tx 2fo)  
Lead frame module that adopts a mold  
array package  
Miniature low-height package:  
LQFN-28P-01  
The GSM/UMTS dual mode CXG1190EQ/AEQ products introduced in  
CX-News Volume 38 are also high-performance lead frame modules.  
(4.5 mm × 3.2 mm × 1.3 mm max.)  
path switching switch. As a result, the  
overall loss was quite large.  
achieves both high performance and high  
integration densities and high integration  
density filters using LTCC technology. By  
using existing package technology based  
on lead frames, it was possible to use  
current manufacturing and assembly  
equipment and processes, and thus Sony  
is able to supply quality products at low  
cost. Furthermore, since these products  
consist of two simple components, a GaAs  
switching IC and a low-pass filter, they  
have the advantage that the development  
TAT can be reduced.  
Switching Structure that  
Achieves Low Insertion Loss  
In contrast, in the SP6T structure, only the  
switch insertion loss occurs in the paths  
other than the GSM Tx path, thus achiev-  
ing low loss. Low loss can be achieved  
for the GSM Tx path as well, since the  
LPF can be implemented with a lower in-  
sertion loss than the diplexer. Further-  
more, these devices achieve ultralow loss  
and low distortion by using GaAs switches  
implemented using Sony's unique  
JPHEMT process as the switching de-  
vices.  
Insertion loss is an important index for  
switch performance. This parameter  
contributes significantly to both current  
consumption during transmission and  
reception sensitivity in portable terminals.  
Switch modules using the conventional  
LTCC* substrate adopted a structure in  
which the frequency band was divided into  
a low band (900 MHz band) and a high  
band (1800/1900 MHz band) using a  
diplexer, and after that, the path switches  
were connected. (See figure 1.) In these  
products, Sony adopted the SP6T switch  
structure to achieve low loss. These  
devices also provide a low-pass filter in  
the GSM Tx path. (See figure 2.) In the  
conventional LTCC module structure, the  
insertion loss for all the paths becomes the  
sum of the losses for the diplexer and the  
*
: LTCC: Low temperature co-fired ceramic  
Miniature Low-Height Form  
Factor  
Lead Frame Module  
The mounting area was reduced by inte-  
grating the two low-pass filters for the Tx  
paths (two circuits) into one component  
using LTCC technology. Also, etching  
technology can be used to perform com-  
plicated machining on the lead frame,  
which plays the role of interface between  
the switch and low-pass filter components  
mounted on the lead frame.  
Furthermore, Sony optimized the contact  
area between the internal low-pass filter  
lands and the lead frame and also opti-  
mized the mold sealing thickness above  
the low-pass filters, thus achieving a min-  
iature low-height form factor.  
In conventional antenna switch modules  
used in GSM terminals and other prod-  
ucts, the switches are implemented by  
combining, on an LTCC, FR-4, or similar  
substrate, PIN diodes and other semicon-  
ductor switching elements and multiple  
passive devices inserted on the substrate.  
However, considering the demands for  
multimode and multiband operation, min-  
iature low-height form factors, and lower  
costs in recent cellular phone products, it  
can easily be seen that it will be difficult  
to achieve these using these conventional  
structures. Sony's response to these issues  
was to use the mold array package, which  
uses lead frames and is an existing pack-  
age technology. These new products are  
implemented by mounting, on the lead  
frame, both GaAs switches fabricated us-  
ing Sony's unique JPHEMT process that  
V
O
I
C
E
The CXG1180EQ and CXG1186EQ  
are antenna switches that feature  
low loss. While the function they  
provide is simple, this component  
has a large influence on the per-  
formance of radio transceivers.  
While this could be said to be ex-  
cessive concern for such a small  
point, I hope this will contribute to  
our customers’ creation of superb  
radio products.  

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