是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | LFBGA, | 针数: | 144 |
Reach Compliance Code: | unknown | HTS代码: | 8542.39.00.01 |
风险等级: | 5.78 | Is Samacsys: | N |
其他特性: | IT ALSO REQUIRES 3V TO 3.6V SUPPLY | 商用集成电路类型: | CONSUMER CIRCUIT |
JESD-30 代码: | S-PBGA-B144 | JESD-609代码: | e0 |
长度: | 12 mm | 功能数量: | 1 |
端子数量: | 144 | 最高工作温度: | 75 °C |
最低工作温度: | -20 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 240 |
认证状态: | Not Qualified | 座面最大高度: | 1.45 mm |
最大供电电压 (Vsup): | 2.7 V | 最小供电电压 (Vsup): | 2.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL EXTENDED | 端子面层: | TIN LEAD |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 10 |
宽度: | 12 mm | Base Number Matches: | 1 |
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