Features
■ 0ꢁ02 miniature size
Applications
■ RF modules
■ Ceramic core provides stable electrical
■ Cellular phones
■ GPS receivers
■ Wireless PDAs, LANs
■ CATV filters, tuners
■ Cable modems, set-top boxes
characteristics
■ High Q
■ High self-resonant frequency
■ Flat top surface for automated assembly
■ RoHS compliant* and halogen free**
CW100505 Series High Q Ceramic Chip Inductors
Electrical Specifications
General Specifications
Operating Temperature
Test Freq.
(MHz)
SRF
DCR
Irms
(mA)
................................-55 °C to +125 °C
(Temperature rise included)
Inductance
Q
®
(MHz)
(Ohms)
Bourns Part No.
Storage Temperature
L (nH)
1.0
Tol.
0.ꢀ nH
0.ꢀ nH
0.ꢀ nH
5 ꢁ
5 ꢁ
5 ꢁ
5 ꢁ
5 ꢁ
5 ꢁ
5 ꢁ
5 ꢁ
5 ꢁ
5 ꢁ
5 ꢁ
5 ꢁ
5 ꢁ
5 ꢁ
5 ꢁ
5 ꢁ
5 ꢁ
5 ꢁ
5 ꢁ
5 ꢁ
Min.
1ꢀ
18
16
20
20
15
2ꢀ
20
25
2ꢀ
26
26
25
25
26
24
25
26
22
22
20
20
20
L / Q
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
200
200
200
150
150
150
Min.
6000
6000
6000
6000
5800
4775
5800
4800
4400
ꢀ900
ꢀ600
ꢀ280
ꢀ100
2800
2480
2ꢀ50
2100
2100
1760
1620
1500
1ꢀ00
1100
Max.
1ꢀ60
960
640
840
840
640
760
680
680
480
640
560
420
400
400
400
ꢀ20
210
200
180
150
120
110
................................-55 °C to +125 °C
Resistance to Soldering Heat
CW100505-1N0D
CW100505-2N2D
CW100505-2N7D
CW100505-ꢀNꢀJ
CW100505-ꢀN9J
CW100505-4N7J
CW100505-5N6J
CW100505-6N8J
CW100505-8N2J
CW100505-10NJ
CW100505-12NJ
CW100505-15NJ
CW100505-18NJ
CW100505-22NJ
CW100505-27NJ
CW100505-ꢀꢀNJ
CW100505-ꢀ9NJ
CW100505-47NJ
CW100505-56NJ
CW100505-68NJ
CW100505-82NJ
CW100505-R10J
CW100505-R12J
0.045
0.070
0.120
0.066
0.066
0.1ꢀ0
0.08ꢀ
0.08ꢀ
0.104
0.195
0.120
0.172
0.2ꢀ0
0.ꢀ00
0.298
0.ꢀ50
0.550
0.8ꢀ0
0.970
1.120
1.250
2.520
2.660
2.2
2.7
ꢀ.ꢀ
ꢀ.9
.......................... +260 °C, 5 sec. max.
Temperature Rise.....15 °C at rated Irms
Materials
4.7
5.6
6.8
8.2
Core...........................................Ceramic
Wire ............Enameled copper (Class H)
Terminal...........................Mo/Mn+Ni+Au
10.0
12.0
15.0
18.0
22.0
27.0
ꢀꢀ.0
ꢀ9.0
47.0
56.0
68.0
82.0
100.0
120.0
Product Dimensions
0.50 0.ꢀ
0.30
(.020 .00ꢁ)
(.0ꢀ2)
ꢀ.00 0.ꢀ
(.039 .00ꢁ)
0.55 0.ꢀ
(.022 .00ꢁ)
Soldering Profile
0.20
(.008)
0.20
(.008)
Temperature
Rising
Area
Preheat
Area
Reflow
Area
Forced Cooling
Area
0.50
(.020)
-
-
-
20~
ꢁ0 °C/
Sec.
ꢁ °C/
Sec.
Max.
ꢀ50~200 °C / 60~ꢀ20 Sec.
-ꢀ~5 °C/Sec. Max.
Recommended Layout
Max.
PEAK TEMP.
260 °C
0.50
(.020)
0.50
(.020)
250
230 °C
-
50 SECONDS MAX.
200
ꢀ50
ꢀ00
50
0.ꢁ0
(.0ꢀ6)
0.ꢁ0
(.0ꢀ6)
70 SE-CONDS MAX.
MM
(INCHES)
DIMENSIONS:
Schematic
0
50
ꢀ00
ꢀ50
200
250
Time (Seconds)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 20ꢀꢀ/65/EU June 8, 20ꢀꢀ.
** Bourns follows the prevailing definition of “halogen free” in the industry. Bourns considers a product to be
“halogen free” if (a) the Bromine (Br ) content is 900 ppm or less; (b) the Chlorine ( Cl ) content is 900 ppm or less;
and (c) the total Bromine (Br) and Chlorine ( Cl ) content is ꢀ500 ppm or less.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.