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CUHZ5V6 PDF预览

CUHZ5V6

更新时间: 2023-12-20 18:44:41
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
16页 2754K
描述
5.6 V Zener Diode, SOD-323HE(US2H)

CUHZ5V6 数据手册

 浏览型号CUHZ5V6的Datasheet PDF文件第2页浏览型号CUHZ5V6的Datasheet PDF文件第3页浏览型号CUHZ5V6的Datasheet PDF文件第4页浏览型号CUHZ5V6的Datasheet PDF文件第5页浏览型号CUHZ5V6的Datasheet PDF文件第6页浏览型号CUHZ5V6的Datasheet PDF文件第7页 
CUHZ Series  
TOSHIBA Zener Diode Silicon Epitaxial Planar Type  
CUHZ Series  
Applications  
Voltage surge protection  
Features  
Small package  
The typical voltage of V is accorded to E24 series  
Z
Packaging and Internal Circuit  
1
2
1: Cathode  
2: Anode  
US2H  
Absolute Maximum Ratings 1 (Note) (Unless otherwise specified, Ta = 25°C)  
Characteristics  
Symbol  
Rating  
Unit  
*1  
Power dissipation  
P
P
1200  
500  
mW  
mW  
°C  
D
D
*2  
Junction temperature  
Storage temperature  
T
150  
j
T
55 to 150  
°C  
stg  
Absolute Maximum Ratings 2 (Note) (Unless otherwise specified, Ta = 25°C)  
*3  
*3  
Electrostatic discharge voltage  
Electrostatic discharge voltage  
Type No.  
Peak pulse  
Peak pulse  
Type No.  
Peak pulse  
Peak pulse  
*4  
*4  
*4  
*4  
power  
current  
power  
current  
Contact  
Air  
Contact  
Air  
V
(kV)  
P
(W)  
I
(A)  
V
(kV)  
P
(W)  
I
(A)  
PP  
ESD  
PK  
PP  
ESD  
PK  
CUHZ5V6  
CUHZ6V2  
CUHZ6V8  
CUHZ8V2  
CUHZ12V  
± 30  
1750  
1800  
1800  
1900  
2100  
91  
CUHZ16V  
CUHZ20V  
CUHZ24V  
CUHZ30V  
CUHZ36V  
± 30  
2100  
2100  
2100  
2100  
2100  
42  
± 30  
± 30  
± 30  
± 30  
87  
73  
68  
60  
± 30  
± 30  
± 30  
± 30  
36  
27  
26  
23  
Note:  
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change  
in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.Please design the appropriate  
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept  
and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).  
2
*1: Mounted on a glass epoxy circuit board of 25.4 mm × 25.4 mm × 1.6 mm, Cu pad: 645 mm  
*2:  
*3:  
*4:  
Mounted on a glass epoxy circuit board of 25.4 mm × 25.4 mm × 1.6 mm, pad dimensions of 4 mm × 4 mm.  
according to IEC61000-4-2  
according to IEC61000-4-5, tp = 8 / 20 μs  
Start of commercial production  
2021-04  
© 2021  
2021-09-17  
1
Toshiba Electronic Devices & Storage Corporation  

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