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CUHZ16V PDF预览

CUHZ16V

更新时间: 2023-12-20 18:44:41
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
16页 2754K
描述
16 V Zener Diode, SOD-323HE(US2H)

CUHZ16V 数据手册

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CUHZ Series  
TOSHIBA Zener Diode Silicon Epitaxial Planar Type  
CUHZ Series  
Applications  
Voltage surge protection  
Features  
Small package  
The typical voltage of V is accorded to E24 series  
Z
Packaging and Internal Circuit  
1
2
1: Cathode  
2: Anode  
US2H  
Absolute Maximum Ratings 1 (Note) (Unless otherwise specified, Ta = 25°C)  
Characteristics  
Symbol  
Rating  
Unit  
*1  
Power dissipation  
P
P
1200  
500  
mW  
mW  
°C  
D
D
*2  
Junction temperature  
Storage temperature  
T
150  
j
T
55 to 150  
°C  
stg  
Absolute Maximum Ratings 2 (Note) (Unless otherwise specified, Ta = 25°C)  
*3  
*3  
Electrostatic discharge voltage  
Electrostatic discharge voltage  
Type No.  
Peak pulse  
Peak pulse  
Type No.  
Peak pulse  
Peak pulse  
*4  
*4  
*4  
*4  
power  
current  
power  
current  
Contact  
Air  
Contact  
Air  
V
(kV)  
P
(W)  
I
(A)  
V
(kV)  
P
(W)  
I
(A)  
PP  
ESD  
PK  
PP  
ESD  
PK  
CUHZ5V6  
CUHZ6V2  
CUHZ6V8  
CUHZ8V2  
CUHZ12V  
± 30  
1750  
1800  
1800  
1900  
2100  
91  
CUHZ16V  
CUHZ20V  
CUHZ24V  
CUHZ30V  
CUHZ36V  
± 30  
2100  
2100  
2100  
2100  
2100  
42  
± 30  
± 30  
± 30  
± 30  
87  
73  
68  
60  
± 30  
± 30  
± 30  
± 30  
36  
27  
26  
23  
Note:  
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change  
in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.Please design the appropriate  
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept  
and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).  
2
*1: Mounted on a glass epoxy circuit board of 25.4 mm × 25.4 mm × 1.6 mm, Cu pad: 645 mm  
*2:  
*3:  
*4:  
Mounted on a glass epoxy circuit board of 25.4 mm × 25.4 mm × 1.6 mm, pad dimensions of 4 mm × 4 mm.  
according to IEC61000-4-2  
according to IEC61000-4-5, tp = 8 / 20 μs  
Start of commercial production  
2021-04  
© 2021  
2021-09-17  
1
Toshiba Electronic Devices & Storage Corporation  

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