Datasheet > CSOIC

CSOIC

更新时间： 2024-11-27 03:27:03

品牌	Logo	应用领域
AMKOR		/
页数	文件大小	规格书
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描述
Ceramic Small Outline Integrated Circuit Package

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CSOIC 数据手册

CERAMIC / HERMETIC

data sheet

CSOIC

The CSOIC offers a variety of features:

Ceramic Small Outline

Features:

Integrated Circuit Package

(CSOIC)

• 28 lead count (Others available if supplied

and tooled)

• 300 mil body size

This is a ceramic version of the Plastic SOIC

package. The CSOIC is a hermetic package

consisting of a multilayer ceramic surrounding a

"gullwing" formed leadframe. This package has

leads extending from two sides of the package

(dual). The package is hermetically solder sealed

at 325° Centigrade. These IC packages have

proven surface mount (SMT) performance

characteristics and have been designed to adapt

easily to ALL SMT processes and lines. Ceramic

SOIC packages provide component and packaging

engineers the ability and freedom to optimize

systems and product designs.

• Hermetic solder sealed package

• High thermal conductive ceramic

• Gold lead finish

• "Gullwing" lead form

• JEDEC and EIAJ package outline standard

compliant

• Wide selection of cavity sizes to meet most

die size needs

• Commercial or full Military flows

Applications:

End products range from consumer (audio, video,

and entertainment), telecom (pagers, cordless

telephone), RF/wireless (PC cards, RF/CATV,

telemetry), office (fax, copier, and printer),

PC/peripheral, automotive and other applications.

Whether you're working with resistor networks,

discrete semiconductors or ICs, CSOIC package

product lines will serve the needs of various

semiconductor technologies with ease.

VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND

TO VIEW THE MOST CURRENT PRODUCT INFORMATION

DS807

Rev Date: 08’02

www.amkor.com

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