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CSLZ5V6 PDF预览

CSLZ5V6

更新时间: 2024-11-12 14:57:15
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
16页 1999K
描述
5.6 V Zener Diode, SOD-962 (SL2)

CSLZ5V6 数据手册

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CSLZ Series  
TOSHIBA Zener Diode Silicon Epitaxial Planar Type  
CSLZ Series  
Applications  
Voltage surge protection  
Features  
Small package  
Packaging and Internal Circuit  
1: Cathode  
2: Anode  
1
2
SL2  
Absolute Maximum Ratings 1 (Note) (Unless otherwise specified, Ta = 25°C)  
Characteristics  
Symbol  
Rating  
Unit  
*1  
Power dissipation  
P
P
150  
400  
mW  
mW  
°C  
D
D
*2  
Junction temperature  
Storage temperature  
T
150  
j
T
55 to 150  
°C  
stg  
Absolute Maximum Ratings 2 (Note) (Unless otherwise specified, Ta = 25°C)  
*3  
*3  
Electrostatic discharge voltage  
Electrostatic discharge voltage  
Type No.  
Peak pulse  
Peak pulse  
Type No.  
Peak pulse  
Peak pulse  
*4  
*4  
*4  
*4  
power  
current  
power  
current  
Contact  
Air  
Contact  
Air  
V
(kV)  
P
(W)  
I
(A)  
V
(kV)  
P
(W)  
I
(A)  
PP  
ESD  
PK  
PP  
ESD  
PK  
CSLZ5V6  
CSLZ6V2  
CSLZ6V8  
CSLZ8V2  
CSLZ10V  
± 30  
32  
2.5  
CSLZ12V  
CSLZ16V  
CSLZ20V  
CSLZ24V  
CSLZ30V  
± 20  
72  
2.5  
± 30  
± 30  
± 30  
± 30  
37  
40  
55  
60  
2.5  
2.5  
2.5  
2.5  
± 12  
± 12  
± 10  
± 8  
87  
2.5  
2.5  
2.5  
2.5  
105  
117  
145  
Note:  
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change  
in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.Please design the appropriate  
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept  
and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).  
*1: Mounted on a glass epoxy circuit board of 20 mm × 20 mm, pad dimensions of 4 mm × 4 mm.  
2
*2:  
*3:  
*4:  
Mounted on a glass epoxy circuit board of 25.4 mm × 25.4 mm × 1.6 mmt, Cu pad: 645 mm  
according to IEC61000-4-2  
according to IEC61000-4-5, tp = 8 / 20 μs  
Start of commercial production  
2022-04  
© 2022  
2022-05-24  
Rev.1.0  
1
Toshiba Electronic Devices & Storage Corporation  

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