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CSD16407Q5 PDF预览

CSD16407Q5

更新时间: 2024-09-25 12:55:15
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
11页 340K
描述
N-Channel NexFET™ Power MOSFETs

CSD16407Q5 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:6 X 5 MM, ROHS COMPLIANT, PLASTIC, SON-8
针数:8Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
Factory Lead Time:12 weeks风险等级:1.13
其他特性:AVALANCHE RATED雪崩能效等级(Eas):218 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:25 V最大漏极电流 (Abs) (ID):100 A
最大漏极电流 (ID):31 A最大漏源导通电阻:0.0033 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR最大反馈电容 (Crss):160 pF
JESD-30 代码:R-PDSO-N8JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:5工作模式:ENHANCEMENT MODE
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):3.1 W
最大脉冲漏极电流 (IDM):200 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:NO LEAD
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

CSD16407Q5 数据手册

 浏览型号CSD16407Q5的Datasheet PDF文件第2页浏览型号CSD16407Q5的Datasheet PDF文件第3页浏览型号CSD16407Q5的Datasheet PDF文件第4页浏览型号CSD16407Q5的Datasheet PDF文件第5页浏览型号CSD16407Q5的Datasheet PDF文件第6页浏览型号CSD16407Q5的Datasheet PDF文件第7页 
CSD16407Q5  
www.ti.com  
SLPS203A AUGUST 2009REVISED SEPTEMBER 2010  
N-Channel NexFET™ Power MOSFETs  
Check for Samples: CSD16407Q5  
1
FEATURES  
PRODUCT SUMMARY  
2
Ultralow Qg and Qgd  
VDS  
Qg  
Drain-to0source voltage  
Gate charge, total (4.5 V)  
Gate charge, gate-to-drain  
25  
13.3  
3.5  
V
Low Thermal Resistance  
Avalanche Rated  
nC  
nC  
m  
mΩ  
V
Qgd  
SON 5-mm × 6-mm Plastic Package  
VGS = 4.5 V  
VGS = 10 V  
1.6  
2.5  
1.8  
RDS(on) Drain-to-source on-resistance  
VGS(th) Threshold voltage  
APPLICATIONS  
Point-of-Load Synchronous Buck Converter  
for Applications in Networking, Telecom and  
Computing Systems  
ORDERING INFORMATION  
Device  
CSD16407Q5  
Package  
Media  
Qty  
Ship  
Optimized for Synchronous FET Applications  
SON 5 × 6 plastic  
package  
13-inch  
reel  
Tape and  
reel  
2500  
DESCRIPTION  
ABSOLUTE MAXIMUM RATINGS  
The NexFET™ power MOSFET has been designed  
to minimize losses in power conversion applications.  
TA = 25°C unless otherwise stated  
VALUE  
UNIT  
V
VDS  
VGS  
Drain-to-source voltage  
25  
Top View  
Gate-to-source voltage  
+16 / –12  
100  
V
Continuous drain current, TC = 25°C  
Continuous drain current(1)  
Pulsed drain current, TA = 25°C(2)  
Power dissipation(1)  
A
ID  
S
S
S
G
1
2
3
4
8
7
6
5
D
D
D
31  
A
IDM  
PD  
TJ,  
200  
A
3.1  
W
Operating junction and storage temperature  
TSTG range  
–55 to 150  
218  
°C  
Avalanche energy, single pulse  
ID = 66A, L = 0.1 mH, RG = 25 Ω  
EAS  
mJ  
D
D
(1)  
R
qJA = 40°C/W on 1 in2 (6.45 cm2) Cu [2 oz. (0.071 mm  
thick)] on 0.060-inch (1.52-mm) thick FR4 PCB.  
P0094-01  
(2) Pulse duration 300 ms, duty cycle 2%  
rDS(ON) vs VGS  
Gate Charge  
6
5
4
3
2
1
0
12  
I
V
= 25A  
I
D
= 25A  
D
= 12.5V  
DS  
10  
8
T
= 125°C  
C
6
4
T
= 25°C  
C
4
2
0
0
2
6
8
10  
12  
0
5
10  
15  
Q − Gate Charge − nC  
g
20  
25  
30  
35  
V
GS  
− Gate to Source Voltage − V  
G006  
G003  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NexFET is a trademark of Texas Instruments.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2009–2010, Texas Instruments Incorporated  
 

CSD16407Q5 替代型号

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